Printed shielding conductors for shielding around or between signal conductors

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H05K1/0219

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0219Printed shielding conductors for shielding around or between signal conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low-loss transmission line structure comprising a dielectric layer...
- Patent number 12,212,033
- Issue date Jan 28, 2025
- Huazhong University of Science & Technology
- Xiaojun Bi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,207,395
- Issue date Jan 21, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trace routable radiation shield
- Patent number 12,193,149
- Issue date Jan 7, 2025
- Intel Corporation
- Sami Markus Heinisuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency module and communication device
- Patent number 12,144,104
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Tetsuro Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic equipment
- Patent number 12,127,332
- Issue date Oct 22, 2024
- Sony Interactive Entertainment Inc.
- Yuta Tamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device, and electronic device
- Patent number 12,108,522
- Issue date Oct 1, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takashi Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with ground terminals and shielding ground ter...
- Patent number 12,107,370
- Issue date Oct 1, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,101,874
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,082,349
- Issue date Sep 3, 2024
- HONOR DEVICE CO., LTD.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Superconducting flex circuit boards having metal structures for imp...
- Patent number 12,082,335
- Issue date Sep 3, 2024
- Google LLC
- John Martinis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Differential circuit board and semiconductor light emitting device
- Patent number 12,082,336
- Issue date Sep 3, 2024
- Lumentum Japan, Inc.
- Koichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid interconnect circuits
- Patent number 12,052,814
- Issue date Jul 30, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile phased array
- Patent number 12,021,306
- Issue date Jun 25, 2024
- Raytheon Company
- Thomas V. Sikina
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Lens moving apparatus, and camera module and optical device compris...
- Patent number 11,985,404
- Issue date May 14, 2024
- LG Innotek Co., Ltd
- Tae Bong Park
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Connector including signal pins shielded by buried ground vias
- Patent number 11,967,782
- Issue date Apr 23, 2024
- NEOCONIX, INC
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and manufacturing method therefor, and relat...
- Patent number 11,950,355
- Issue date Apr 2, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Hui Wen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 11,903,121
- Issue date Feb 13, 2024
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide band printed circuit board through connector
- Patent number 11,903,124
- Issue date Feb 13, 2024
- Rockwell Collins, Inc.
- Daniel S. Shaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board for multiple signal transmission
- Patent number 11,844,173
- Issue date Dec 12, 2023
- Gigalane Co., Ltd.
- Byung-hoon Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication module and electronic device
- Patent number 11,839,019
- Issue date Dec 5, 2023
- Canon Kabushiki Kaisha
- Tomohisa Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Breakout structure for an integrated circuit device
- Patent number 11,812,544
- Issue date Nov 7, 2023
- Xilinx, Inc.
- Shad Shepston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,812,552
- Issue date Nov 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chul Mun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system with split trace for high speed routing
- Patent number 11,805,594
- Issue date Oct 31, 2023
- Dell Products L.P.
- Sandor Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having heat-radiating structure
- Patent number 11,800,632
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Yonghwa Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 11,785,706
- Issue date Oct 10, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED MICROSTRIP TRACE
- Publication number 20250024586
- Publication date Jan 16, 2025
- Dell Products L.P.
- Sandor FARKAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
- Publication number 20240431083
- Publication date Dec 26, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Yoshiharu YANAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD
- Publication number 20240422954
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20240414839
- Publication date Dec 12, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240407079
- Publication date Dec 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chien-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
- Publication number 20240397609
- Publication date Nov 28, 2024
- Nitto Denko Corporation
- Tomoaki TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Hybrid Interconnect Circuits
- Publication number 20240373546
- Publication date Nov 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION OF CABLES FOR A CONNECTOR
- Publication number 20240356251
- Publication date Oct 24, 2024
- Cisco Technology, Inc.
- David Nozadze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20240292516
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Kouichirou SUGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE ELECTRONIC DEVICE
- Publication number 20240284621
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Chungsoon PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODU...
- Publication number 20240251500
- Publication date Jul 25, 2024
- Canon Kabushiki Kaisha
- HIROKI SAITO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT
- Publication number 20240237191
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Kenji MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-LOSS TRANSMISSION LINE STRUCTURE
- Publication number 20240222834
- Publication date Jul 4, 2024
- HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Xiaojun Bi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240196517
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Youngsun JO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT AND SIGNAL TRANSMISSION METHOD
- Publication number 20240172357
- Publication date May 23, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- Li Chung CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS
- Publication number 20240170867
- Publication date May 23, 2024
- Neoconix, Inc.
- Woody Maynard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device
- Publication number 20240130048
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...
- Publication number 20240121885
- Publication date Apr 11, 2024
- Canon Kabushiki Kaisha
- Yu Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20240074035
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20240055744
- Publication date Feb 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240057247
- Publication date Feb 15, 2024
- MURATA MANUFACTURING CO., LTD.
- Takanori UEJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND PRINTING APPARATUS
- Publication number 20240023226
- Publication date Jan 18, 2024
- Canon Kabushiki Kaisha
- Yo Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240014536
- Publication date Jan 11, 2024
- Murata Manufacturing Co., Ltd.
- Hironobu TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH LOWER DIELECTRIC CONSTANT AND ELECTRICAL CONNECT...
- Publication number 20230413434
- Publication date Dec 21, 2023
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Zhaolong ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layout of signal traces
- Publication number 20230403786
- Publication date Dec 14, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- YUNG-CHUNG CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230389171
- Publication date Nov 30, 2023
- SK HYNIX INC.
- Jae Hoon KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230378096
- Publication date Nov 23, 2023
- InnoLux Corporation
- Yu-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Printed shielding conductors for shielding around or between signal conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low-loss transmission line structure comprising a dielectric layer...

Backplane footprint for high speed, high density electrical connectors

Trace routable radiation shield

Circuit board with rigid portion and flexible portion having connec...

High frequency module and communication device

Electronic equipment

Circuit board, semiconductor device, and electronic device

Electrical connector with ground terminals and shielding ground ter...

Rigid flexible printed circuit board and electronic device includin...

Electronic device

Superconducting flex circuit boards having metal structures for imp...

Differential circuit board and semiconductor light emitting device

Flexible hybrid interconnect circuits

Low profile phased array

Lens moving apparatus, and camera module and optical device compris...

Connector including signal pins shielded by buried ground vias

Flexible circuit board and manufacturing method therefor, and relat...

Sensor interposer employing castellated through-vias

Mating backplane for high speed, high density electrical connector

Edge connector, circuit board, and connector component

Printed circuit board design for high speed application

Wide band printed circuit board through connector

Flexible circuit board for multiple signal transmission

Communication module and electronic device

Breakout structure for an integrated circuit device

Printed circuit board

Backplane footprint for high speed, high density electrical connectors

Information handling system with split trace for high speed routing

Electronic device having heat-radiating structure

Interlaced crosstalk controlled traces, vias, and capacitors

Patents Applicationslast 30 patents

ENHANCED MICROSTRIP TRACE

ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD

ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

CARRIER STRUCTURE

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

Flexible Hybrid Interconnect Circuits

TERMINATION OF CABLES FOR A CONNECTOR

WIRING BOARD AND ELECTRONIC DEVICE

WEARABLE ELECTRONIC DEVICE

WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODU...

MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT

LOW-LOSS TRANSMISSION LINE STRUCTURE

INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

INTEGRATED CIRCUIT AND SIGNAL TRANSMISSION METHOD

CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS

Electronic Device

WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...

WIRING BASE AND ELECTRONIC DEVICE

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

PRINTED CIRCUIT BOARD AND PRINTING APPARATUS

MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

CIRCUIT BOARD WITH LOWER DIELECTRIC CONSTANT AND ELECTRICAL CONNECT...

Layout of signal traces

CIRCUIT BOARD

ELECTRONIC DEVICE