printing

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CPC
H01L21/02288

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02288printing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Additive process for circular printing
- Patent number 12,172,374
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Color film substrate, method for preparing color film substrate, an...
- Patent number 12,119,430
- Issue date Oct 15, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Lixuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of nanostructures using imprint lithography
- Patent number 12,092,953
- Issue date Sep 17, 2024
- University of Massachusetts
- James J. Watkins
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet printing apparatus and method for aligning dipoles
- Patent number 12,017,465
- Issue date Jun 25, 2024
- Samsung Display Co., Ltd.
- Hyun Deok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming material within openings extending into a semico...
- Patent number 12,020,979
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Additive process for circular printing of electronic devices
- Patent number 11,865,773
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for substrate registration and anchoring in inkjet printing
- Patent number 11,798,831
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,792,924
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Taehyeun Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic printing plate precursor, method of producing lithogra...
- Patent number 11,574,810
- Issue date Feb 7, 2023
- FUJIFILM Corporation
- Kenjiro Araki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Fabrication of thin-film encapsulation layer for light-emitting device
- Patent number 11,551,982
- Issue date Jan 10, 2023
- Kateeva, Inc.
- Eliyahu Vronsky
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Manufacturing method of multilayered board
- Patent number 11,503,707
- Issue date Nov 15, 2022
- UNIJET CO., LTD.
- Sung-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for layer fencing to improve edge linearity
- Patent number 11,456,220
- Issue date Sep 27, 2022
- Kateeva, Inc.
- Eliyahu Vronsky
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Microelectronic device substrate formed by additive process
- Patent number 11,404,270
- Issue date Aug 2, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for substrate registration and anchoring in inkjet printing
- Patent number 11,367,643
- Issue date Jun 21, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electrohydrodynamic jet printing and spatial atomic laye...
- Patent number 11,342,176
- Issue date May 24, 2022
- The Regents of the University of Michigan
- Mattison Rose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchoring dies using 3D printing to form reconstructed wafer
- Patent number 11,329,003
- Issue date May 10, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for substrate registration and anchoring in inkjet printing
- Patent number 11,322,381
- Issue date May 3, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully-printed stretchable thin-film transistors and integrated logi...
- Patent number 11,302,685
- Issue date Apr 12, 2022
- Board of Trustees of Michigan State University
- Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct write, high conductivity MMIC attach
- Patent number 11,264,299
- Issue date Mar 1, 2022
- Northrop Grumman Systems Corporation
- Jesse Tice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with passivation layer that directly contacts the su...
- Patent number 11,227,873
- Issue date Jan 18, 2022
- Samsung Display Co., Ltd.
- Woo Yong Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming silica layer, silica layer and electronic d...
- Patent number 11,201,052
- Issue date Dec 14, 2021
- Samsung SDI Co., Ltd.
- Seungwoo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of thin-film encapsulation layer for light emitting device
- Patent number 11,088,035
- Issue date Aug 10, 2021
- Kateeva, Inc.
- Eliyahu Vronsky
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
3D-printed protective shell structures with support columns for str...
- Patent number 11,082,028
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,039,532
- Issue date Jun 15, 2021
- Samsung Electronics Co., Ltd.
- Taehyeun Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device with multilayer stress buffer
- Patent number 11,031,311
- Issue date Jun 8, 2021
- Texas Instruments Incorporated
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Critical dimension uniformity
- Patent number 11,022,878
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Co. LTD
- Xi-Zong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package thermal conduit
- Patent number 11,004,680
- Issue date May 11, 2021
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions having fluorocarbon material
- Patent number 10,998,221
- Issue date May 4, 2021
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLANARIZATION SYSTEM, PLANARIZING METHOD, AND METHOD OF MANUFACTURI...
- Publication number 20240429060
- Publication date Dec 26, 2024
- Canon Kabushiki Kaisha
- Steven C. Shackleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20240297068
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240274500
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yoshihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE PROCESS FOR CIRCULAR PRINTING
- Publication number 20240109247
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COLOR FILM SUBSTRATE, METHOD FOR PREPARING COLOR FILM SUBSTRATE, AN...
- Publication number 20240047626
- Publication date Feb 8, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Lixuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240021493
- Publication date Jan 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240014097
- Publication date Jan 11, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THIN-FILM ENCAPSULATION LAYER FOR LIGHT-EMITTING DEVICE
- Publication number 20230147887
- Publication date May 11, 2023
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MICROELECTRONIC DEVICE SUBSTRATE FORMED BY ADDITIVE PROCESS
- Publication number 20220336217
- Publication date Oct 20, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
- Publication number 20220336246
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
- Publication number 20220328336
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT WRITE, HIGH CONDUCTIVITY MMIC ATTACH
- Publication number 20220068752
- Publication date Mar 3, 2022
- Northrop Grumman Systems Corporation
- Jesse Tice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device With Multilayer Stress Buffer
- Publication number 20210351098
- Publication date Nov 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THIN-FILM ENCAPSULATION LAYER FOR LIGHT-EMITTING DEVICE
- Publication number 20210343602
- Publication date Nov 4, 2021
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210282262
- Publication date Sep 9, 2021
- Samsung Electronics Co., Ltd.
- Taehyeun HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT
- Publication number 20210272804
- Publication date Sep 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20210225690
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ADDITIVE PROCESS FOR CIRCULAR PRINTING
- Publication number 20210138727
- Publication date May 13, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20210066155
- Publication date Mar 4, 2021
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTROHYDRODYNAMIC JET PRINTING AND SPATIAL ATOMIC LAYE...
- Publication number 20210028006
- Publication date Jan 28, 2021
- The Regents of the University of Michigan
- Mattison Rose
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANCHORING DIES USING 3D PRINTING TO FORM RECONSTRUCTED WAFER
- Publication number 20200411447
- Publication date Dec 31, 2020
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
- Publication number 20200411312
- Publication date Dec 31, 2020
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
- Publication number 20200411351
- Publication date Dec 31, 2020
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE
- Publication number 20200388508
- Publication date Dec 10, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER AND ELECTRONIC D...
- Publication number 20200365400
- Publication date Nov 19, 2020
- Samsung SDI Co., Ltd.
- Seungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PRODUCING LITHOGRA...
- Publication number 20200234948
- Publication date Jul 23, 2020
- FUJIFILM CORPORATION
- Kenjiro ARAKI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MICROELECTRONIC DEVICE SUBSTRATE FORMED BY ADDITIVE PROCESS
- Publication number 20200176251
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE
- Publication number 20200161596
- Publication date May 21, 2020
- SAKAI DISPLAY PRODUCTS CORPORATION
- Katsuhiko KISHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Additive process for circular printing

Color film substrate, method for preparing color film substrate, an...

Patterning of nanostructures using imprint lithography

Chip package, method of forming a chip package and method of formin...

Inkjet printing apparatus and method for aligning dipoles

Methods of forming material within openings extending into a semico...

Additive process for circular printing of electronic devices

Method for substrate registration and anchoring in inkjet printing

Printed circuit board and manufacturing method thereof

Lithographic printing plate precursor, method of producing lithogra...

Fabrication of thin-film encapsulation layer for light-emitting device

Manufacturing method of multilayered board

Techniques for layer fencing to improve edge linearity

Microelectronic device substrate formed by additive process

Method for substrate registration and anchoring in inkjet printing

Integrated electrohydrodynamic jet printing and spatial atomic laye...

Anchoring dies using 3D printing to form reconstructed wafer

Method for substrate registration and anchoring in inkjet printing

Fully-printed stretchable thin-film transistors and integrated logi...

Direct write, high conductivity MMIC attach

Display device with passivation layer that directly contacts the su...

Composition for forming silica layer, silica layer and electronic d...

Fabrication of thin-film encapsulation layer for light emitting device

3D-printed protective shell structures with support columns for str...

Printed circuit board and manufacturing method thereof

Packaged semiconductor device with multilayer stress buffer

Critical dimension uniformity

Semiconductor device package thermal conduit

Semiconductor constructions having fluorocarbon material

Method of forming an electrical contact and method of forming a chi...

Patents Applicationslast 30 patents

PLANARIZATION SYSTEM, PLANARIZING METHOD, AND METHOD OF MANUFACTURI...

Methods of Forming Material Within Openings Extending into a Semico...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

ADDITIVE PROCESS FOR CIRCULAR PRINTING

COLOR FILM SUBSTRATE, METHOD FOR PREPARING COLOR FILM SUBSTRATE, AN...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

FABRICATION OF THIN-FILM ENCAPSULATION LAYER FOR LIGHT-EMITTING DEVICE

MICROELECTRONIC DEVICE SUBSTRATE FORMED BY ADDITIVE PROCESS

METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING

APPARATUS FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING

DIRECT WRITE, HIGH CONDUCTIVITY MMIC ATTACH

Packaged Semiconductor Device With Multilayer Stress Buffer

FABRICATION OF THIN-FILM ENCAPSULATION LAYER FOR LIGHT-EMITTING DEVICE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT

Methods of Forming Material Within Openings Extending into a Semico...

ADDITIVE PROCESS FOR CIRCULAR PRINTING

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

INTEGRATED ELECTROHYDRODYNAMIC JET PRINTING AND SPATIAL ATOMIC LAYE...

ANCHORING DIES USING 3D PRINTING TO FORM RECONSTRUCTED WAFER

METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING

METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING

REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE

COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER AND ELECTRONIC D...

LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PRODUCING LITHOGRA...

MICROELECTRONIC DEVICE SUBSTRATE FORMED BY ADDITIVE PROCESS

ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE