Process monitoring

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CPC
H01L21/67253

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67253Process monitoring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus and polishing apparatus
- Patent number 12,205,831
- Issue date Jan 21, 2025
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of cleaning, method of manufacturing semiconductor device, s...
- Patent number 12,195,848
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Kazuhiro Harada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas-phase reactor system including a gas detector
- Patent number 12,195,855
- Issue date Jan 14, 2025
- ASM IP Holding B.V.
- SungBae Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for operating the same
- Patent number 12,198,953
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Rong Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor delivery head for preventing stiction of high aspect ratio st...
- Patent number 12,198,945
- Issue date Jan 14, 2025
- Lam Research AG
- Bhaskar Bandarapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and processing apparatus
- Patent number 12,198,964
- Issue date Jan 14, 2025
- Toto Ltd.
- Jun Shiraishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing chamber, substrate processing system including...
- Patent number 12,191,190
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Yongmyung Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cleaning substrates using high temperature...
- Patent number 12,186,684
- Issue date Jan 7, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Fuping Chen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Information handling system display backplane vapor chamber
- Patent number 12,189,370
- Issue date Jan 7, 2025
- Dell Products L.P.
- Jace W. Files
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nozzle having real time inspection functions
- Patent number 12,191,175
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kai-Lin Chuang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
- Patent number 12,191,176
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and methods for controlling an amount of primer in a primer...
- Patent number 12,191,214
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Pei-Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor process system and method
- Patent number 12,183,607
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Ming Chin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Implanting system for fabricating semiconductor device structure
- Patent number 12,183,643
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer processing method and wafer processing apparatus
- Patent number 12,183,635
- Issue date Dec 31, 2024
- Disco Corporation
- Kenya Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and assemblies for gas flow ratio control
- Patent number 12,183,606
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Kevin Brashear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,172,194
- Issue date Dec 24, 2024
- Kioxia Corporation
- Minako Inukai
- B08 - CLEANING
Information Patent Grant
Method and apparatus for monitoring edge bevel removal area in semi...
- Patent number 12,169,179
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chao-Tung Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and oxygen removal method thereof
- Patent number 12,165,883
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Min Zuo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adjustable wafer chuck
- Patent number 12,165,898
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and method
- Patent number 12,165,887
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jieh-Chau Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method, method of manufacturing semiconductor, and subst...
- Patent number 12,165,894
- Issue date Dec 10, 2024
- Kokusai Electric Corporation
- Yasuhiro Mizuguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispenser for micro LED suspension and method of transferring micro...
- Patent number 12,165,890
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Joonyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device, system and control method
- Patent number 12,165,892
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yuichi Takenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing monitoring
- Patent number 12,165,934
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zuoming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
XPS metrology for process control in selective deposition
- Patent number 12,158,437
- Issue date Dec 3, 2024
- NOVA MEASURING INSTRUMENTS INC.
- Charles Larson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Estimation device, vacuum valve, and vacuum pump
- Patent number 12,158,155
- Issue date Dec 3, 2024
- Shimadzu Corporation
- Junichiro Kozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pollutant detection devices and monitoring system having the same
- Patent number 12,153,016
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Dusik Bae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR
- Publication number 20250022727
- Publication date Jan 16, 2025
- ASMPT SINGAPORE PTE. LTD
- Ka Shing KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING DEVICE, SEMICONDUCTOR PROCESSING SYSTEM, A...
- Publication number 20250014932
- Publication date Jan 9, 2025
- HUAYING RESEARCH CO., LTD
- Sophia Ziying WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAMPLE THICKNESS METROLOGY USING FOCUSED BEAM INTERFERENCE
- Publication number 20250012560
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Venkatakaushik Voleti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING APPARATUS, ABNORMALITY DETECTION METHOD, AND...
- Publication number 20250014925
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Yuka NAKASATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD
- Publication number 20250014916
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Naoto Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, METHOD...
- Publication number 20250014924
- Publication date Jan 9, 2025
- Kokusai Electric Corporation
- Tsukasa KAMAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS APPARATUS INCLUDING GAS SUPPLIER AND METHOD OF OPERATING TH...
- Publication number 20250010257
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Dongsik Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIAGNOSTIC DEVICE, SEMICONDUCTOR MANUFACTURING EQUIPMENT SYSTEM, SE...
- Publication number 20250014923
- Publication date Jan 9, 2025
- Hitachi High-Tech Corporation
- Satoshi MURASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD
- Publication number 20250014917
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Naoto Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY IN THE PRESENCE OF CMOS UNDER ARRAY (CUA) STRUCTURES UTIL...
- Publication number 20250004384
- Publication date Jan 2, 2025
- KLA Corporation
- Zhaxylyk Kudyshev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250006525
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Takeshi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND...
- Publication number 20250005737
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Takeshi SHIMOAOKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD FOR SUBSTRATE PROCESSING, AN...
- Publication number 20240429075
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Ryo ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS
- Publication number 20240429076
- Publication date Dec 26, 2024
- Disco Corporation
- Kensuke FURUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW OPEN AREA AND COUPON ENDPOINT DETECTION
- Publication number 20240429077
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Varoujan Chakarian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW OPEN AREA AND COUPON ENDPOINT DETECTION
- Publication number 20240420975
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Varoujan Chakarian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING A LOCALIZED FLUID VELOCITY ON A...
- Publication number 20240420973
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Michael Carcasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING A LOCALIZED FLUID VELOCITY OF A...
- Publication number 20240420974
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Michael Carcasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS...
- Publication number 20240410078
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND DISPLAY METHOD
- Publication number 20240404849
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Tatsuya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240404850
- Publication date Dec 5, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF ADJUSTING SUBSTRATE TR...
- Publication number 20240395589
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Shota UMEZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL
- Publication number 20240395637
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
- Publication number 20240395574
- Publication date Nov 28, 2024
- SAMSUNG DISPLAY CO., LTD.
- DEOKJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECIPE CREATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD,...
- Publication number 20240385602
- Publication date Nov 21, 2024
- Kokusai Electric Corporation
- Takatoshi SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD
- Publication number 20240387203
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING AND DETECTING APPARATUS
- Publication number 20240387211
- Publication date Nov 21, 2024
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR IMPROVING PHOTORESIST COATING OPE...
- Publication number 20240387172
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ming CHEN
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
APPARATUS AND METHODS FOR DETERMINING FLUID DYNAMICS OF LIQUID FILM...
- Publication number 20240387212
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Pin CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKEUP AIR HANDLING UNIT IN SEMICONDUCTOR FABRICATION BUILDING AND...
- Publication number 20240384881
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-MING TSAO
- H01 - BASIC ELECTRIC ELEMENTS

Process monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma control method in semiconductor wafer fabrication

Cleaning apparatus and polishing apparatus

Method of cleaning, method of manufacturing semiconductor device, s...

Gas-phase reactor system including a gas detector

System and method for operating the same

Vapor delivery head for preventing stiction of high aspect ratio st...

Electrostatic chuck and processing apparatus

Substrate processing chamber, substrate processing system including...

Method and apparatus for cleaning substrates using high temperature...

Information handling system display backplane vapor chamber

Nozzle having real time inspection functions

Integrated substrate measurement system to improve manufacturing pr...

System and methods for controlling an amount of primer in a primer...

Semiconductor process system and method

Implanting system for fabricating semiconductor device structure

Wafer processing method and wafer processing apparatus

Methods and assemblies for gas flow ratio control

Substrate processing apparatus and substrate processing method

Method and apparatus for monitoring edge bevel removal area in semi...

Semiconductor device and oxygen removal method thereof

Adjustable wafer chuck

Wafer cleaning apparatus and method

Processing method, method of manufacturing semiconductor, and subst...

Dispenser for micro LED suspension and method of transferring micro...

Control device, system and control method

Substrate processing monitoring

XPS metrology for process control in selective deposition

Method of controlling chemical concentration in electrolyte

Estimation device, vacuum valve, and vacuum pump

Pollutant detection devices and monitoring system having the same

Patents Applicationslast 30 patents

DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR

SEMICONDUCTOR PROCESSING DEVICE, SEMICONDUCTOR PROCESSING SYSTEM, A...

SAMPLE THICKNESS METROLOGY USING FOCUSED BEAM INTERFERENCE

INFORMATION PROCESSING APPARATUS, ABNORMALITY DETECTION METHOD, AND...

SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, METHOD...

PROCESS APPARATUS INCLUDING GAS SUPPLIER AND METHOD OF OPERATING TH...

DIAGNOSTIC DEVICE, SEMICONDUCTOR MANUFACTURING EQUIPMENT SYSTEM, SE...

SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD

METROLOGY IN THE PRESENCE OF CMOS UNDER ARRAY (CUA) STRUCTURES UTIL...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND...

SUBSTRATE PROCESSING APPARATUS, METHOD FOR SUBSTRATE PROCESSING, AN...

WAFER PROCESSING APPARATUS

LOW OPEN AREA AND COUPON ENDPOINT DETECTION

LOW OPEN AREA AND COUPON ENDPOINT DETECTION

SYSTEMS AND METHODS FOR DETERMINING A LOCALIZED FLUID VELOCITY ON A...

SYSTEMS AND METHODS FOR DETERMINING A LOCALIZED FLUID VELOCITY OF A...

IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS...

SUBSTRATE PROCESSING SYSTEM AND DISPLAY METHOD

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND METHOD OF ADJUSTING SUBSTRATE TR...

METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL

LASER DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME

RECIPE CREATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD,...

HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD

PROCESSING AND DETECTING APPARATUS

SYSTEM, APPARATUS, AND METHOD FOR IMPROVING PHOTORESIST COATING OPE...

APPARATUS AND METHODS FOR DETERMINING FLUID DYNAMICS OF LIQUID FILM...

MAKEUP AIR HANDLING UNIT IN SEMICONDUCTOR FABRICATION BUILDING AND...