Process monitoring

Industry

CPC
H01L21/67253

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67253Process monitoring

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,365,987
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Hiroaki Hiramatsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, processing method, and non-transito...
- Patent number 12,368,043
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Akinori Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate cleaning apparatus, substrate processing apparatus, subst...
- Patent number 12,368,059
- Issue date Jul 22, 2025
- Ebara Corporation
- Shuji Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supercritical fluid processing apparatus and substrate processing s...
- Patent number 12,362,200
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seohyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for OES data collection and endpoint detection
- Patent number 12,362,158
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Sergey Voronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method and etching system
- Patent number 12,362,208
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Takeshi Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for pulse gas delivery with concentration meas...
- Patent number 12,360,093
- Issue date Jul 15, 2025
- MKS Instruments, Inc.
- Hongke Ye
- G05 - CONTROLLING REGULATING
Information Patent Grant
Ellipsometer and apparatus for inspecting semiconductor device incl...
- Patent number 12,345,626
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Yasuhiro Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,347,670
- Issue date Jul 1, 2025
- STMicroelectronics (Crolles 2) SAS
- Delia Ristoiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for detecting the presence of deposits in fluid...
- Patent number 12,347,703
- Issue date Jul 1, 2025
- Watlow Electric Manufacturing Company
- Miranda P. Pizzella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus
- Patent number 12,341,052
- Issue date Jun 24, 2025
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light-emitting element
- Patent number 12,342,658
- Issue date Jun 24, 2025
- Nichia Corporation
- Yoshitaka Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Estimation of chamber component conditions using substrate measurem...
- Patent number 12,339,645
- Issue date Jun 24, 2025
- Applied Materials, Inc.
- Chunlei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus with thickness measuring unit
- Patent number 12,330,266
- Issue date Jun 17, 2025
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for correcting position of wafer and storage m...
- Patent number 12,332,625
- Issue date Jun 17, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhiling Guo
- G08 - SIGNALLING
Information Patent Grant
Abnormality detecting apparatus, semiconductor manufacturing appara...
- Patent number 12,334,374
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Yuka Nakasato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abnormality detecting device and abnormality detecting method
- Patent number 12,327,186
- Issue date Jun 10, 2025
- Tokyo Electron Limited
- Takuro Tsutsui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bubble measurement unit, substrate treating apparatus including the...
- Patent number 12,320,735
- Issue date Jun 3, 2025
- Semes Co., Ltd.
- Jung Suk Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing liquid supply apparatus and method of removing solids fr...
- Patent number 12,322,610
- Issue date Jun 3, 2025
- Semes Co., Ltd.
- Mu Hyeon Lee
- B08 - CLEANING
Information Patent Grant
Acoustic measurement of fabrication equipment clearance
- Patent number 12,320,782
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Hao Deng
- B08 - CLEANING
Information Patent Grant
Dynamic process control in semiconductor manufacturing
- Patent number 12,322,619
- Issue date Jun 3, 2025
- Lam Research Corporation
- Purushottam Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive control of variability in device performance in advanced s...
- Patent number 12,322,618
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Samer Banna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displacement measurements in semiconductor wafer processing
- Patent number 12,322,662
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Justin Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Monolithic platen
- Patent number 12,311,498
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Processing apparatus
- Patent number 12,315,744
- Issue date May 27, 2025
- Disco Corporation
- Yuta Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, and method and program for controlling...
- Patent number 12,315,704
- Issue date May 27, 2025
- Tokyo Electron Limited
- Yusuke Saitoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing device and wafer conveying method
- Patent number 12,308,277
- Issue date May 20, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hui Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method
- Patent number 12,300,519
- Issue date May 13, 2025
- Semes Co., Ltd.
- Jung Suk Goh
- B08 - CLEANING
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, calculation method, and calculation pr...
- Patent number 12,300,469
- Issue date May 13, 2025
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA SYSTEMS AND METHODS FOR USING SQUARE-SHAPED PULSE SIGNALS
- Publication number 20250239434
- Publication date Jul 24, 2025
- LAM RESEARCH CORPORATION
- Alexei M. Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...
- Publication number 20250239473
- Publication date Jul 24, 2025
- KLA Corporation
- Farhat A. Quli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CONTROL OF MULTI-STATION PROCESSING CHAMBER COMPONENTS
- Publication number 20250230546
- Publication date Jul 17, 2025
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS
- Publication number 20250232992
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Yao HSIAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate Processing Apparatus, Method of Manufacturing Semiconduct...
- Publication number 20250232993
- Publication date Jul 17, 2025
- Kokusai Electric Corporation
- Shin TSUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM AND PROCESSING METHOD
- Publication number 20250232967
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20250233004
- Publication date Jul 17, 2025
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT DEVICE
- Publication number 20250226240
- Publication date Jul 10, 2025
- SHIBAURA MECHATRONICS CORPORATION
- Minami NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING CONTROL DEVICE, POLISHING CONTROL METHOD, AND SUBSTRATE P...
- Publication number 20250222555
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Taekjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING APPARATUS, SUBSTR...
- Publication number 20250226248
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Norihito SHINOZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS MONITORING SYSTEM AND METHOD
- Publication number 20250226249
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Sung HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Fabrication
- Publication number 20250226250
- Publication date Jul 10, 2025
- Nanoverse Technologies Inc.
- Jeffrey Albelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS
- Publication number 20250226247
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- SOONKU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CORRECTING ERROR OF WAFER-LIKE SENSING APPARATUS
- Publication number 20250226267
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Jonghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250218814
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Myung A JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTATE PROCESSING METHOD USING TH...
- Publication number 20250218752
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Sejin Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF OPERATION THEREOF
- Publication number 20250218826
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jonghyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
- Publication number 20250218747
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Dong Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCRUBBER APPARATUS
- Publication number 20250218811
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Keunsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, PHOTOGRAPHING UNIT AND LIQUID PROCE...
- Publication number 20250218812
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Oh Yeol KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218821
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Jong Wha KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESS MEASUREMENT SYSTEM AND SEMICONDUCTOR PROCESS...
- Publication number 20250216297
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Chang Ho LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
END POINT DETECTION DEVICE, ETCHING CONTROL SYSTEM, END POINT DETEC...
- Publication number 20250218827
- Publication date Jul 3, 2025
- Horiba Stec, Co., Ltd.
- Michie IMANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DISAGGREGATION OF SEMICONDUCTOR DIES IN A...
- Publication number 20250210402
- Publication date Jun 26, 2025
- Intel Corporation
- Marek Patyra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING UN-PATTERNED AND PATTERNED METROLOGY TARGETS FOR IN SITU PROC...
- Publication number 20250210385
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Shifang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATCHING PROCESS CONTROLLERS FOR IMPROVED MATCHING OF PROCESS
- Publication number 20250199521
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- James Robert Moyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HYBRID BONDING APPARATUS
- Publication number 20250201602
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sunwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TREATING SUBSTRATE
- Publication number 20250201603
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Kwang Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REVITALIZING PLASMA PROCESSING TOOLS
- Publication number 20250201528
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsing LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...
- Publication number 20250201597
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- YEONG JUN JO
- H01 - BASIC ELECTRIC ELEMENTS

Process monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing substrate, method of manufacturing semiconduct...

Substrate processing apparatus, processing method, and non-transito...

Substrate cleaning apparatus, substrate processing apparatus, subst...

Supercritical fluid processing apparatus and substrate processing s...

Method for OES data collection and endpoint detection

Inspection method and etching system

Method and apparatus for pulse gas delivery with concentration meas...

Ellipsometer and apparatus for inspecting semiconductor device incl...

Etching method

Systems and methods for detecting the presence of deposits in fluid...

Wafer cleaning apparatus

Method for manufacturing light-emitting element

Estimation of chamber component conditions using substrate measurem...

Polishing apparatus with thickness measuring unit

Method and apparatus for correcting position of wafer and storage m...

Abnormality detecting apparatus, semiconductor manufacturing appara...

Abnormality detecting device and abnormality detecting method

Bubble measurement unit, substrate treating apparatus including the...

Processing liquid supply apparatus and method of removing solids fr...

Acoustic measurement of fabrication equipment clearance

Dynamic process control in semiconductor manufacturing

Adaptive control of variability in device performance in advanced s...

Displacement measurements in semiconductor wafer processing

Monolithic platen

Processing apparatus

Plasma processing apparatus, and method and program for controlling...

Wafer processing device and wafer conveying method

Surface treatment method

Substrate processing system

Plasma processing apparatus, calculation method, and calculation pr...

Patents Applicationslast 30 patents

PLASMA SYSTEMS AND METHODS FOR USING SQUARE-SHAPED PULSE SIGNALS

PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...

SELECTIVE CONTROL OF MULTI-STATION PROCESSING CHAMBER COMPONENTS

DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS

Substrate Processing Apparatus, Method of Manufacturing Semiconduct...

PROCESSING SYSTEM AND PROCESSING METHOD

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

SUBSTRATE TREATMENT DEVICE

POLISHING CONTROL DEVICE, POLISHING CONTROL METHOD, AND SUBSTRATE P...

SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING APPARATUS, SUBSTR...

WAFER PROCESS MONITORING SYSTEM AND METHOD

Method of Semiconductor Fabrication

SEMICONDUCTOR PROCESSING APPARATUS

METHOD OF CORRECTING ERROR OF WAFER-LIKE SENSING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTATE PROCESSING METHOD USING TH...

ELECTRONIC DEVICE AND METHOD OF OPERATION THEREOF

APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE

SCRUBBER APPARATUS

SUBSTRATE PROCESSING APPARATUS, PHOTOGRAPHING UNIT AND LIQUID PROCE...

SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR PROCESS MEASUREMENT SYSTEM AND SEMICONDUCTOR PROCESS...

END POINT DETECTION DEVICE, ETCHING CONTROL SYSTEM, END POINT DETEC...

METHODS AND APPARATUS FOR DISAGGREGATION OF SEMICONDUCTOR DIES IN A...

USING UN-PATTERNED AND PATTERNED METROLOGY TARGETS FOR IN SITU PROC...

MATCHING PROCESS CONTROLLERS FOR IMPROVED MATCHING OF PROCESS

HYBRID BONDING APPARATUS

METHOD OF TREATING SUBSTRATE

METHOD AND APPARATUS FOR REVITALIZING PLASMA PROCESSING TOOLS

LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...