Process monitoring

Industry

CPC
H01L21/67253

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67253Process monitoring

Industries

Patents Grantslast 30 patents

Information Patent Grant
Monolithic platen
- Patent number 12,311,498
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Processing apparatus
- Patent number 12,315,744
- Issue date May 27, 2025
- Disco Corporation
- Yuta Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, and method and program for controlling...
- Patent number 12,315,704
- Issue date May 27, 2025
- Tokyo Electron Limited
- Yusuke Saitoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing device and wafer conveying method
- Patent number 12,308,277
- Issue date May 20, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hui Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method
- Patent number 12,300,519
- Issue date May 13, 2025
- Semes Co., Ltd.
- Jung Suk Goh
- B08 - CLEANING
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, calculation method, and calculation pr...
- Patent number 12,300,469
- Issue date May 13, 2025
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling method and substrate transport module
- Patent number 12,300,525
- Issue date May 13, 2025
- Tokyo Electron Limited
- Hiroto Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of automatically setting purge mode of STB and system for ma...
- Patent number 12,293,927
- Issue date May 6, 2025
- Semes Co., Ltd.
- Young Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process monitoring system and method
- Patent number 12,288,703
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Sung Hung
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor deposition monitoring device
- Patent number 12,283,497
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Young Uk Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for processing wafer
- Patent number 12,283,514
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization apparatus, planarization process, and method of manuf...
- Patent number 12,283,522
- Issue date Apr 22, 2025
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside deposition tuning of stress to control wafer bow in semico...
- Patent number 12,276,922
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treatment device
- Patent number 12,278,120
- Issue date Apr 15, 2025
- Shibaura Mechatronics Corporation
- Minami Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate
- Patent number 12,278,119
- Issue date Apr 15, 2025
- Semes Co., Ltd.
- Myung Seok Cha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for determining fluid dynamics of liquid film...
- Patent number 12,272,576
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Learned model generating method, abnormality factor estimating devi...
- Patent number 12,271,830
- Issue date Apr 8, 2025
- SCREEN Holdings Co., Ltd.
- Asuka Wakita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
EPI self-heating sensor tube as in-situ growth rate sensor
- Patent number 12,270,752
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Zhepeng Cong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection device and processing system
- Patent number 12,272,577
- Issue date Apr 8, 2025
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus and method thereof
- Patent number 12,265,327
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Hai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for monitoring semiconductor processes
- Patent number 12,266,552
- Issue date Apr 1, 2025
- Inficon, Inc.
- Matan Lapidot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for venting a processing cha...
- Patent number 12,266,508
- Issue date Apr 1, 2025
- HITACHI HIGH-TECH CORPORATION
- Kazuyuki Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Matching process controllers for improved matching of process
- Patent number 12,265,380
- Issue date Apr 1, 2025
- Applied Materials, Inc.
- James Robert Moyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Normal-incidence in-situ process monitor sensor
- Patent number 12,261,030
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Ching Ling Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for revitalizing plasma processing tools
- Patent number 12,261,026
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Hsing Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Control device and control method for single-wafer processing epita...
- Patent number 12,261,065
- Issue date Mar 25, 2025
- Sumco Corporation
- Naoyuki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,255,069
- Issue date Mar 18, 2025
- Kokusai Electric Corporation
- Yukitomo Hirochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for real-time quality control of a film in a sp...
- Patent number 12,255,110
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Gaurav Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Using spectroscopic measurements for substrate temperature monitoring
- Patent number 12,249,525
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- Ian McDonald
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS, FLUID SUPPLY SYSTEM, AND SUBSTRATE...
- Publication number 20250167010
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Mikio NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK ASSEMBLY
- Publication number 20250167037
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING STATUS MONITORING DEVICE AND SUBSTRATE PROCESS...
- Publication number 20250167020
- Publication date May 22, 2025
- Kurashiki Boseki Kabushiki Kaisha
- Noboru HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION MONITOR FOR SEMICONDUCTOR MANUFACTURING SYSTEM
- Publication number 20250167021
- Publication date May 22, 2025
- Axcelis Technologies, Inc.
- Phillip Geissbuhler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESIN SEALING DEVICE AND RESIN SEALING METHOD
- Publication number 20250167016
- Publication date May 22, 2025
- Apic Yamada Corporation
- Shusaku Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...
- Publication number 20250167022
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Keita Hirase
- B08 - CLEANING
Information Patent Application
METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...
- Publication number 20250155234
- Publication date May 15, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- G01 - MEASURING TESTING
Information Patent Application
HIGH-PRESSURE HEAT TREATMENT APPARATUS AND GAS MONITORING MODULE US...
- Publication number 20250157834
- Publication date May 15, 2025
- HPSP Co., Ltd.
- Kun Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method of Manufacture by Monitoring Relative...
- Publication number 20250149378
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS
- Publication number 20250149362
- Publication date May 8, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR NON-DESTRUCTIVE INSPECTION OF CELL ETCH REDEPOSITION
- Publication number 20250149387
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD AND...
- Publication number 20250146807
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Masahide Tadokoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING METHOD FOR SEMICONDUCTOR PROCESS AUXILIARY APPARATUS, C...
- Publication number 20250149359
- Publication date May 8, 2025
- United Microelectronics Corp.
- Chih-Chung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MONITORING EMBRITTLEMENT OF AN INTERFACE BETWEEN A SUBST...
- Publication number 20250137928
- Publication date May 1, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frédéric MAZEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR SUPPLYING LIQUID FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20250140575
- Publication date May 1, 2025
- KURITA WATER INDUSTRIES LTD.
- Hideaki IINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVALUATION OF PLASMA UNIFORMITY USING COMPUTER VISION
- Publication number 20250140542
- Publication date May 1, 2025
- LAM RESEARCH CORPORATION
- Kapil Sawlani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID SUPPLY DEVICE, LIQUID SUPPLY METHOD, AND STORAGE MEDIUM
- Publication number 20250132171
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- So OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN STRUCTURES, PLATE APPARATUS, AND RELATED METHODS, PROCESS KITS,...
- Publication number 20250132178
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSINGSYSTEM
- Publication number 20250125162
- Publication date Apr 17, 2025
- TOKYO ELECTRON LIMITED
- Takashi UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING APPARATUS FOR PACKAGE
- Publication number 20250125167
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Minyan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPATIAL PATTERN LOADING MEASUREMENT WITH IMAGING METROLOGY
- Publication number 20250125171
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Eric Chin Hong Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...
- Publication number 20250125143
- Publication date Apr 17, 2025
- Kokusai Electric Corporation
- Keigo NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCH TOOL WITH SPINEL-BASED COMPOSITE MATERIAL COMPONENTS
- Publication number 20250125161
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ming LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DICING WAFER
- Publication number 20250125163
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Kyo-Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...
- Publication number 20250118549
- Publication date Apr 10, 2025
- Kokusai Electric Corporation
- Keigo NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-MATERIAL CHUCK
- Publication number 20250112083
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PROCESSING APPARATUS, AND MONITORING METHOD
- Publication number 20250112066
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Shinichi MIZUSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY INTEGRATED WITH VACUUM PROCESSING
- Publication number 20250112065
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Ivan MALEEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FLUORESCENCE-BASED CHAMBER AND WAFER MONITORING
- Publication number 20250110055
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- David Eitan BARLAZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET PROCESSING WITH AUTOMATIC PROCESS CONTROL
- Publication number 20250105036
- Publication date Mar 27, 2025
- Yield Engineering Systems, Inc.
- Venugopal Govindarajulu
- H01 - BASIC ELECTRIC ELEMENTS

Process monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Monolithic platen

Processing apparatus

Plasma processing apparatus, and method and program for controlling...

Wafer processing device and wafer conveying method

Surface treatment method

Substrate processing system

Plasma processing apparatus, calculation method, and calculation pr...

Controlling method and substrate transport module

Method of automatically setting purge mode of STB and system for ma...

Wafer process monitoring system and method

Semiconductor deposition monitoring device

Method and system for processing wafer

Planarization apparatus, planarization process, and method of manuf...

Backside deposition tuning of stress to control wafer bow in semico...

Substrate treatment device

Apparatus for treating substrate

Apparatus and methods for determining fluid dynamics of liquid film...

Learned model generating method, abnormality factor estimating devi...

EPI self-heating sensor tube as in-situ growth rate sensor

Inspection device and processing system

Semiconductor manufacturing apparatus and method thereof

System and method for monitoring semiconductor processes

Plasma processing apparatus and method for venting a processing cha...

Matching process controllers for improved matching of process

Normal-incidence in-situ process monitor sensor

Method and apparatus for revitalizing plasma processing tools

Control device and control method for single-wafer processing epita...

Substrate processing apparatus, method of manufacturing semiconduct...

Methods and systems for real-time quality control of a film in a sp...

Using spectroscopic measurements for substrate temperature monitoring

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS, FLUID SUPPLY SYSTEM, AND SUBSTRATE...

WAFER CHUCK ASSEMBLY

SUBSTRATE PROCESSING STATUS MONITORING DEVICE AND SUBSTRATE PROCESS...

DEPOSITION MONITOR FOR SEMICONDUCTOR MANUFACTURING SYSTEM

RESIN SEALING DEVICE AND RESIN SEALING METHOD

SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...

METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...

HIGH-PRESSURE HEAT TREATMENT APPARATUS AND GAS MONITORING MODULE US...

Semiconductor Device, Method of Manufacture by Monitoring Relative...

WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS

METHOD FOR NON-DESTRUCTIVE INSPECTION OF CELL ETCH REDEPOSITION

INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD AND...

CONTROLLING METHOD FOR SEMICONDUCTOR PROCESS AUXILIARY APPARATUS, C...

METHOD FOR MONITORING EMBRITTLEMENT OF AN INTERFACE BETWEEN A SUBST...

DEVICE FOR SUPPLYING LIQUID FOR SEMICONDUCTOR MANUFACTURING

EVALUATION OF PLASMA UNIFORMITY USING COMPUTER VISION

LIQUID SUPPLY DEVICE, LIQUID SUPPLY METHOD, AND STORAGE MEDIUM

FIN STRUCTURES, PLATE APPARATUS, AND RELATED METHODS, PROCESS KITS,...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSINGSYSTEM

MONITORING APPARATUS FOR PACKAGE

SPATIAL PATTERN LOADING MEASUREMENT WITH IMAGING METROLOGY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...

ETCH TOOL WITH SPINEL-BASED COMPOSITE MATERIAL COMPONENTS

APPARATUS FOR DICING WAFER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...

MULTI-MATERIAL CHUCK

LIQUID PROCESSING APPARATUS, AND MONITORING METHOD

METROLOGY INTEGRATED WITH VACUUM PROCESSING

IN-SITU FLUORESCENCE-BASED CHAMBER AND WAFER MONITORING

WET PROCESSING WITH AUTOMATIC PROCESS CONTROL