Protecting a component during manufacturing

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CPC
H05K2203/304

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/304Protecting a component during manufacturing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Screen-printing screen and process for obtaining glazings equipped...
- Patent number 12,049,093
- Issue date Jul 30, 2024
- Saint-Gobain Glass France
- André Beyrle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement to enclose a circuit board
- Patent number 10,933,505
- Issue date Mar 2, 2021
- Atlas Copco Airpower, naamloze vennootschap
- Per-Anders Karlsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel for the purpose of winding a length of cable of optical fiber...
- Patent number 10,845,562
- Issue date Nov 24, 2020
- Sagemcom Broadband SAS
- Stéphane Kohn
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Control unit
- Patent number 10,829,048
- Issue date Nov 10, 2020
- Jaguar Land Rover Limited
- Ashutosh Tomar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board, power supply apparatus, image forming appara...
- Patent number 10,412,839
- Issue date Sep 10, 2019
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a flexible and/or stretchable electronic de...
- Patent number 10,034,382
- Issue date Jul 24, 2018
- Nanyang Technology University
- Chaoyi Yan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cortical implant system for brain stimulation and recording
- Patent number 9,949,376
- Issue date Apr 17, 2018
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed circuit board, power supply apparatus, image forming appara...
- Patent number 9,918,393
- Issue date Mar 13, 2018
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards with thermal control and methods for their design
- Patent number 9,779,199
- Issue date Oct 3, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Paul D. Schmalenberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,693,462
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metastable gas heating
- Patent number 9,681,557
- Issue date Jun 13, 2017
- Elwha LLC
- Tom Driscoll
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulation process enabling hotbar soldering without direct PCB...
- Patent number 9,643,272
- Issue date May 9, 2017
- Apple Inc.
- Chiu-Yu Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with printed circuit board noise reduction using...
- Patent number 9,596,756
- Issue date Mar 14, 2017
- Apple Inc.
- Amanda R. Rainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,530,745
- Issue date Dec 27, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,490,232
- Issue date Nov 8, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed circuit boards with stacked micro...
- Patent number 9,485,876
- Issue date Nov 1, 2016
- Viasystems Technologies Corp., L.L.C.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board unit, manufacturing method thereof, and manufacturing...
- Patent number 9,349,674
- Issue date May 24, 2016
- NGK Spark Plug Co., Ltd.
- Kensuke Matsuhashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric discharge protection for surface mounted and embedded comp...
- Patent number 9,320,135
- Issue date Apr 19, 2016
- Littelfuse, Inc.
- Lex Kosowsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protecting a thermal sensitive component in a thermal process
- Patent number 9,059,373
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Cliff Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with staggered contact pads and compact component...
- Patent number 9,001,522
- Issue date Apr 7, 2015
- Apple Inc.
- Wyeman Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for gold removal from electronic components
- Patent number 8,943,662
- Issue date Feb 3, 2015
- Raytheon Company
- Paul B. Hafeli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for protecting an electronic component
- Patent number 8,662,394
- Issue date Mar 4, 2014
- “Compagnie Industrielle et Financiere d'Ingenierie” Ingenico
- Eric Bonnet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection for circuit boards
- Patent number 8,625,298
- Issue date Jan 7, 2014
- Infineon Technologies AG
- Johannes Hankofer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature detection method of semiconductor device and power conv...
- Patent number 8,423,317
- Issue date Apr 16, 2013
- Hitachi Industrial Equipment Systems Co., Ltd.
- Tomoya Kamezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of gold removal from electronic components
- Patent number 8,413,320
- Issue date Apr 9, 2013
- Raytheon Company
- Paul B. Hafeli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating aperture in printed circuit boards
- Patent number 8,335,077
- Issue date Dec 18, 2012
- Hewlett-Packard Development Company, L.P.
- Christopher N. Rijken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting diode
- Patent number 8,294,169
- Issue date Oct 23, 2012
- Maintek Computer (Suzhou) Co., Ltd.
- Wenbing Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES
- Publication number 20240284603
- Publication date Aug 22, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Eitan Ariel Caplan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PANEL AESA WITH THERMAL MANAGEMENT
- Publication number 20230345616
- Publication date Oct 26, 2023
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRANGEMENT ARRANGED TO ENCLOSE A CIRCUIT BOARD COMPRISING ELECTRON...
- Publication number 20190015946
- Publication date Jan 17, 2019
- ATLAS COPCO AIRPOWER, naamloze vennootschap
- Per-Anders KARLSSON
- B24 - GRINDING POLISHING
Information Patent Application
PRINTED CIRCUIT BOARD, POWER SUPPLY APPARATUS, IMAGE FORMING APPARA...
- Publication number 20180160544
- Publication date Jun 7, 2018
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION PROCESS ENABLING HOTBAR SOLDERING WITHOUT DIRECT PCB...
- Publication number 20160050763
- Publication date Feb 18, 2016
- Apple Inc.
- Chiu-Yu Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE...
- Publication number 20150276275
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Cliff Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO...
- Publication number 20150041428
- Publication date Feb 12, 2015
- Viasystems Technologies Corp., L.L.C.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING REDUCED DRILL SMEAR
- Publication number 20150030402
- Publication date Jan 29, 2015
- International Business Machines Corporation
- Brian L. Carlson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD UNIT, MANUFACTURING METHOD THEREOF, AND MANUFACTURING...
- Publication number 20140353024
- Publication date Dec 4, 2014
- NGK Spark Plug Co., Ltd.
- Kensuke MATSUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR CONNECTING SECONDARY BATTERY
- Publication number 20140285990
- Publication date Sep 25, 2014
- Samsung SDI Co., Ltd.
- Hyung-Sin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS
- Publication number 20140113788
- Publication date Apr 24, 2014
- Tzu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD REMOVAL FROM ELECTRONIC COMPONENTS
- Publication number 20130186942
- Publication date Jul 25, 2013
- Raytheon Company
- Paul B. Hafeli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuits with Staggered Contact Pads and Compact Component...
- Publication number 20130122725
- Publication date May 16, 2013
- Apple Inc.
- Wyeman Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE...
- Publication number 20130107460
- Publication date May 2, 2013
- International Business Machines Corporation
- Cliff Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection for Circuit Boards
- Publication number 20130063916
- Publication date Mar 14, 2013
- INFINEON TECHNOLOGIES AG
- Johannes Hankofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, POWER SUPPLY APPARATUS, IMAGE FORMING APPARA...
- Publication number 20130004196
- Publication date Jan 3, 2013
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE
- Publication number 20120222808
- Publication date Sep 6, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazunori Hamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GOLD REMOVAL FROM ELECTRONIC COMPONENTS
- Publication number 20120192406
- Publication date Aug 2, 2012
- Raytheon Company
- Paul B. Hafeli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric discharge protection for surface mounted and embedded comp...
- Publication number 20110211319
- Publication date Sep 1, 2011
- Lex Kosowsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION
- Publication number 20110163261
- Publication date Jul 7, 2011
- Fujitsu Limited
- Seiki Sakuyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LIGHT-EMITTING DIODE
- Publication number 20110062483
- Publication date Mar 17, 2011
- Wenbing Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO...
- Publication number 20110041330
- Publication date Feb 24, 2011
- Dynamic Details, Inc.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND REINFORCING COMPONENT
- Publication number 20100300739
- Publication date Dec 2, 2010
- FUJITSU LIMITED
- Kenji SUZUKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Insulating Aperture In Printed Circuit Boards
- Publication number 20100290183
- Publication date Nov 18, 2010
- Christopher N. Rijken
- G01 - MEASURING TESTING
Information Patent Application
COMPOSITION
- Publication number 20100270362
- Publication date Oct 28, 2010
- Fujitsu Limited
- Seiki Sakuyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC APPARATUS AND CIRCUIT BOARD
- Publication number 20100187672
- Publication date Jul 29, 2010
- Kabushiki Kaisha Toshiba
- Nobuhiro Yamamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Interconnect And Method For Mounting An Electronic Device To A Subs...
- Publication number 20100123115
- Publication date May 20, 2010
- Warren M. Farnworth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Device for Protecting an Electronic Component
- Publication number 20100102127
- Publication date Apr 29, 2010
- COMPAGNIE INDUSTRIELLE ET FINANCIERE D'INGENIERIE
- Eric Bonnet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Systems and Methods for Reducing Electrically-caused Fires in Wirin...
- Publication number 20100073829
- Publication date Mar 25, 2010
- Michael Baxter
- G08 - SIGNALLING

Protecting a component during manufacturing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Screen-printing screen and process for obtaining glazings equipped...

Low cost panel AESA with thermal management

Arrangement to enclose a circuit board

Reel for the purpose of winding a length of cable of optical fiber...

Control unit

Printed circuit board, power supply apparatus, image forming appara...

Method of manufacturing a flexible and/or stretchable electronic de...

Cortical implant system for brain stimulation and recording

Printed circuit board, power supply apparatus, image forming appara...

Electronic apparatus and method for fabricating the same

Circuit boards with thermal control and methods for their design

Electronic apparatus and method for fabricating the same

Printed circuit board

Metastable gas heating

Encapsulation process enabling hotbar soldering without direct PCB...

Electronic device with printed circuit board noise reduction using...

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Methods of manufacturing printed circuit boards with stacked micro...

Wiring board unit, manufacturing method thereof, and manufacturing...

Electric discharge protection for surface mounted and embedded comp...

Protecting a thermal sensitive component in a thermal process

Printed circuits with staggered contact pads and compact component...

Method for gold removal from electronic components

Device for protecting an electronic component

Protection for circuit boards

Temperature detection method of semiconductor device and power conv...

Method of gold removal from electronic components

Insulating aperture in printed circuit boards

Light-emitting diode

Patents Applicationslast 30 patents

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES

LOW COST PANEL AESA WITH THERMAL MANAGEMENT

ARRANGEMENT ARRANGED TO ENCLOSE A CIRCUIT BOARD COMPRISING ELECTRON...

PRINTED CIRCUIT BOARD, POWER SUPPLY APPARATUS, IMAGE FORMING APPARA...

ENCAPSULATION PROCESS ENABLING HOTBAR SOLDERING WITHOUT DIRECT PCB...

METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE...

METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO...

IMPLEMENTING REDUCED DRILL SMEAR

WIRING BOARD UNIT, MANUFACTURING METHOD THEREOF, AND MANUFACTURING...

CIRCUIT BOARD FOR CONNECTING SECONDARY BATTERY

PACKAGING PROCESS

GOLD REMOVAL FROM ELECTRONIC COMPONENTS

Printed Circuits with Staggered Contact Pads and Compact Component...

METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE...

Protection for Circuit Boards

PRINTED CIRCUIT BOARD, POWER SUPPLY APPARATUS, IMAGE FORMING APPARA...

MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

GOLD REMOVAL FROM ELECTRONIC COMPONENTS

Electric discharge protection for surface mounted and embedded comp...

COMPOSITION

LIGHT-EMITTING DIODE

METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO...

ELECTRONIC APPARATUS AND REINFORCING COMPONENT

Insulating Aperture In Printed Circuit Boards

COMPOSITION

ELECTRONIC APPARATUS AND CIRCUIT BOARD

Interconnect And Method For Mounting An Electronic Device To A Subs...

Device for Protecting an Electronic Component

Systems and Methods for Reducing Electrically-caused Fires in Wirin...