Protection means against electrical discharge

Industry

CPC
H01L2224/752

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/752Protection means against electrical discharge

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,237,297
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Junga Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip laser bonding system
- Patent number 12,237,295
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Geunsik Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for laser bonding of flip chip
- Patent number 12,237,296
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring electronic device
- Patent number 12,224,263
- Issue date Feb 11, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Reflow method and system
- Patent number 12,176,319
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 12,176,318
- Issue date Dec 24, 2024
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing device and manufacturing method
- Patent number 12,176,317
- Issue date Dec 24, 2024
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering electronic component and method for manufactur...
- Patent number 12,051,887
- Issue date Jul 30, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding system and laser bonding apparatus
- Patent number 11,973,053
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Geun Woo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with heat transfer structures for bonding a stack of mic...
- Patent number 11,961,818
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser reflow apparatus and laser reflow method
- Patent number 11,935,863
- Issue date Mar 19, 2024
- Disco Corporation
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
- Patent number 11,908,828
- Issue date Feb 20, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and method of manufacturing semiconductor de...
- Patent number 11,837,573
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 11,823,938
- Issue date Nov 21, 2023
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REFLOW METHOD AND SYSTEM
- Publication number 20250070077
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE AND ITS OPERATING METHOD
- Publication number 20250038147
- Publication date Jan 30, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...
- Publication number 20250022836
- Publication date Jan 16, 2025
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20250015039
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Tatsuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...
- Publication number 20240421118
- Publication date Dec 19, 2024
- MB Automation GmbH & Co. KG
- Benjamin Holzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING AND BONDING DEVICE
- Publication number 20240371664
- Publication date Nov 7, 2024
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240363579
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Seungyeop Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...
- Publication number 20240313153
- Publication date Sep 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Futoshi YOSHIDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240234362
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Cheolan KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...
- Publication number 20240186279
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...
- Publication number 20240170450
- Publication date May 23, 2024
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe RIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASING TO ATTACH DIE TO LEAD FRAME
- Publication number 20240145419
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daiki KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
- Publication number 20240145427
- Publication date May 2, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240136321
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Cheolan KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240120311
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- FUTOSHI YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS

Protection means against electrical discharge

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder reflow apparatus and method of manufacturing an electronic d...

Flip chip laser bonding system

System for laser bonding of flip chip

Method for transferring electronic device

Selective micro device transfer to receiver substrate

Reflow method and system

Thermal compression bonder nozzle with vacuum relief features

Semiconductor device manufacturing device and manufacturing method

Solder reflow apparatus and method of manufacturing an electronic d...

Tools and systems for processing semiconductor devices, and methods...

Method of chip transferring and device/module having gas guiding st...

Selective transfer of micro devices

Method for soldering electronic component and method for manufactur...

Pressure sintering device and method for manufacturing an electroni...

Laser bonding system and laser bonding apparatus

Method for transferring electronic device

Apparatus and method for forming a package structure

Substrates with heat transfer structures for bonding a stack of mic...

Laser reflow apparatus and laser reflow method

Low warpage curing methodology by inducing curvature

Die bonding for chip conveying apparatus

Contaminant control in thermocompression bonding of semiconductors...

Manufacturing method of power semiconductor device, power semicondu...

Method of using processing oven

Method of manufacturing a semiconductor package

Semiconductor device with a semiconductor chip connected in a flip...

Chip bonding apparatus and method of manufacturing semiconductor de...

Semiconductor manufacturing apparatus, and method of manufacturing...

Mounting device and mounting method

Laser bonding apparatus for three-dimensional molded sculptures

Patents Applicationslast 30 patents

REFLOW METHOD AND SYSTEM

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

BONDING DEVICE AND ITS OPERATING METHOD

APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

BONDING DEVICE AND BONDING METHOD

THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SELECTIVE TRANSFER OF MICRO DEVICES

CHIP TRANSFERRING AND BONDING DEVICE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

SEMICONDUCTOR MANUFACTURING EQUIPMENT

METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

DIE BONDING APPARATUS

METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...

LASING TO ATTACH DIE TO LEAD FRAME

APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...

SEMICONDUCTOR MANUFACTURING EQUIPMENT

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

SOLDER REFLOW APPARATUS

BONDING APPARATUS