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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/022Protective coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a sensor device having moisture sensitive dielect...
- Patent number 12,159,848
- Issue date Dec 3, 2024
- GLOBALFOUNDRIES Singapore Ptd. Ltd.
- Ee Jan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of soldering a semiconductor chip to a chip carrier
- Patent number 12,132,017
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for wafer scale chip package
- Patent number 12,125,811
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,059
- Issue date Oct 1, 2024
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,094,867
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a wire bonding pad structure connected...
- Patent number 12,068,268
- Issue date Aug 20, 2024
- Fuji Electric Co., Ltd.
- Morio Iwamizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 12,062,630
- Issue date Aug 13, 2024
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, manufacturing method thereof, and display device
- Patent number 12,034,014
- Issue date Jul 9, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhongliu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 12,027,469
- Issue date Jul 2, 2024
- Advanced Semiconductor Engineering, Inc.
- En Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 12,027,479
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a through electrode and semiconductor pac...
- Patent number 12,027,482
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die
- Patent number 12,009,327
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,995,277
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,990,440
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with via openings and methods of making th...
- Patent number 11,990,431
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, chip structure and method for forming chip...
- Patent number 11,894,331
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,876,065
- Issue date Jan 16, 2024
- Texas Instruments Incorporated
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a sensor device
- Patent number 11,855,019
- Issue date Dec 26, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ee Jan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a chip pad having a connection port...
- Patent number 11,854,912
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,848,282
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413144
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240413104
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...
- Publication number 20240413107
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Morio IWAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20240395742
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20240387424
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240387421
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Hyungsun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355763
- Publication date Oct 24, 2024
- Advanced Semiconductor Engineering, Inc.
- En Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
- Publication number 20240339422
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...
- Publication number 20240332228
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Joongwon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321792
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...
- Publication number 20240321794
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS
- Publication number 20240321791
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240304574
- Publication date Sep 12, 2024
- Mitsubishi Electric Corporation
- Yohei TORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE
- Publication number 20240297137
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
- Publication number 20240258259
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP LAYER FOR PAD OXIDATION PREVENTION
- Publication number 20240243080
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE
- Publication number 20240178173
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER
- Publication number 20240162175
- Publication date May 16, 2024
- STMicroelectronics S.r.l.
- Lucrezia GUARINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20240153903
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Platinum-Based Solder Body Contacts for Integration of a First Subs...
- Publication number 20240128213
- Publication date Apr 18, 2024
- Newport Fab. LLC dba Tower Semiconductor Newport Beach
- Zhirong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION
- Publication number 20240113054
- Publication date Apr 4, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Clément Lobre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adding Sealing Material to Wafer edge for Wafer Bonding
- Publication number 20240096830
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS

Protective coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a sensor device having moisture sensitive dielect...

Method of soldering a semiconductor chip to a chip carrier

Semiconductor structure and method for wafer scale chip package

Semiconductor package and manufacturing method thereof

Semiconductor package

Semiconductor die contact structure and method

Semiconductor device having a wire bonding pad structure connected...

Semiconductor module and method of manufacturing semiconductor module

Integrated fan-out package structures with recesses in molding comp...

Semiconductor device and method for manufacturing semiconductor device

Display panel, manufacturing method thereof, and display device

Packaged semiconductor device with electroplated pillars

Electronic device package and method of manufacturing the same

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor chip having a through electrode and semiconductor pac...

Semiconductor packages having a die, an encapsulant, and a redistri...

Semiconductor die

Display apparatus

Structure and formation method of semiconductor device with conduct...

Semiconductor structures with via openings and methods of making th...

Bonded assembly including an airgap containing bonding-level dielec...

Bump structure and method of manufacturing bump structure

Semiconductor device with edge-protecting spacers over bonding pad

Chip package structure, chip structure and method for forming chip...

Flip chip package assembly

Semiconductor device and method of manufacturing the same

Method of forming a sensor device

Semiconductor package including a chip pad having a connection port...

Semiconductor devices having crack-inhibiting structures

Chip structure and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

FILM STRUCTURE FOR BOND PAD

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION

SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...

SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

CAP LAYER FOR PAD OXIDATION PREVENTION

CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE

SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

FLIP CHIP PACKAGE ASSEMBLY

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Platinum-Based Solder Body Contacts for Integration of a First Subs...

CHIP STRUCTURE

ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION

Adding Sealing Material to Wafer edge for Wafer Bonding