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HETEROGENEOUS CHIP STACKING DEVICE
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Publication number 20250105202
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Publication date Mar 27, 2025
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Shine Optics Technology Company Limited
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KUNG-AN LIN
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H01 - BASIC ELECTRIC ELEMENTS
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HETEROGENEOUS CHIP STACKING METHOD
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Publication number 20250105204
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Publication date Mar 27, 2025
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Shine Optics Technology Company Limited
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KUNG-AN LIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250029942
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Publication date Jan 23, 2025
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Samsung Electronics Co., Ltd.
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Raeyoung KANG
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-DIE-TO-WAFER HYBRID BONDING
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Publication number 20250015029
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Publication date Jan 9, 2025
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Murata Manufacturing Co., Ltd.
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Sinan GOKTEPELI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240413144
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Publication date Dec 12, 2024
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Samsung Electronics Co., Ltd.
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Sangcheon PARK
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H01 - BASIC ELECTRIC ELEMENTS
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FILM STRUCTURE FOR BOND PAD
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Publication number 20240387424
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Publication date Nov 21, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Julie Yang
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240321792
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Publication date Sep 26, 2024
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Samsung Electronics Co., Ltd.
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Duckgyu KIM
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DIE
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Publication number 20240297137
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Publication date Sep 5, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Yen-Kun Lai
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H01 - BASIC ELECTRIC ELEMENTS
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-
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CAP LAYER FOR PAD OXIDATION PREVENTION
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Publication number 20240243080
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Publication date Jul 18, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Harry-Haklay Chuang
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H01 - BASIC ELECTRIC ELEMENTS
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