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H05K2201/0723

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0723provided by an inner layer of PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,101,874
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 12,028,967
- Issue date Jul 2, 2024
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 11,968,775
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Yeon Sun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency and high density GaN-based power converter and meth...
- Patent number 11,923,778
- Issue date Mar 5, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structure for system-in-package and electronic device
- Patent number 11,917,750
- Issue date Feb 27, 2024
- Huawei Technologies Co., Ltd.
- Huijuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of electric field effects in a printed circuit board assemb...
- Patent number 11,877,413
- Issue date Jan 16, 2024
- Sparton DeLeon Springs, LLC
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board, manufacturing method thereof and display panel
- Patent number 11,877,384
- Issue date Jan 16, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qing Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,864,313
- Issue date Jan 2, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kishimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless power transmitter and wireless power receiver including mu...
- Patent number 11,777,341
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Chong-Min Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,765,813
- Issue date Sep 19, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB RF noise grounding for shielded high-speed interface cable
- Patent number 11,737,207
- Issue date Aug 22, 2023
- Marvell Asia Pte, Ltd.
- Shaowu Huang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing the same
- Patent number 11,700,685
- Issue date Jul 11, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 11,696,391
- Issue date Jul 4, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Architecture for chip-to-chip interconnection in semiconductors
- Patent number 11,546,984
- Issue date Jan 3, 2023
- CLOUD LIGHT TECHNOLOGY LIMITED
- Ka Kit Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and electronic device including the same
- Patent number 11,477,879
- Issue date Oct 18, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung Ho Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of electric field effects in a printed circuit board assemb...
- Patent number 11,477,903
- Issue date Oct 18, 2022
- Sparton DeLeon Springs, LLC
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,457,525
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and current measuring device
- Patent number 11,457,526
- Issue date Sep 27, 2022
- Kabushiki Kaisha Toshiba
- Shinji Oshima
- G01 - MEASURING TESTING
Information Patent Grant
Flexible cable including a transmission line having an air gap conf...
- Patent number 11,444,363
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and antenna module comprising the same
- Patent number 11,432,396
- Issue date Aug 30, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Hui Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line substrate and electronic device
- Patent number 11,387,016
- Issue date Jul 12, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate, electronic component, and mounting stru...
- Patent number 11,259,401
- Issue date Feb 22, 2022
- Murata Manufacturing Co., Ltd.
- Hiromasa Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate, electronic component, and mounting stru...
- Patent number 11,224,119
- Issue date Jan 11, 2022
- Murata Manufacturing Co., Ltd.
- Hiromasa Koyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20250056712
- Publication date Feb 13, 2025
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20240414839
- Publication date Dec 12, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY MODULE ACCOUNTING FOR ESD PHENOMENON, AND ELECTRONIC DEVICE...
- Publication number 20240023233
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Jonghae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240014536
- Publication date Jan 11, 2024
- Murata Manufacturing Co., Ltd.
- Hironobu TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230363086
- Publication date Nov 9, 2023
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20230354503
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20230239998
- Publication date Jul 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH EFFICIENCY AND HIGH DENSITY GaN-BASED POWER CONVERTER AND METH...
- Publication number 20230155513
- Publication date May 18, 2023
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yanbo ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230127697
- Publication date Apr 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20230058180
- Publication date Feb 23, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...
- Publication number 20230035851
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Eunseok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...
- Publication number 20230025696
- Publication date Jan 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHUNG-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMB...
- Publication number 20230009440
- Publication date Jan 12, 2023
- Sparton DeLeon Springs, LLC
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20220386451
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND DISPLAY PANEL
- Publication number 20220272832
- Publication date Aug 25, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qing GONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220232695
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220151058
- Publication date May 12, 2022
- SAMSUNG DISPLAY CO., LTD.
- Yeon Sun NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding Structure for System-In-Package and Electronic Device
- Publication number 20220141950
- Publication date May 5, 2022
- Huawei Technologies Co., Ltd
- Huijuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING THE SAME
- Publication number 20220053629
- Publication date Feb 17, 2022
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210385939
- Publication date Dec 9, 2021
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20210329775
- Publication date Oct 21, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20210298172
- Publication date Sep 23, 2021
- Toppan Printing Co.,Ltd.
- Jun ONOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB RF NOISE GROUNDING FOR SHIELDED HIGH-SPEED INTERFACE CABLE
- Publication number 20210282260
- Publication date Sep 9, 2021
- Marvell Asia Pte, Ltd.
- Shaowu Huang
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD AND ANTENNA MODULE COMPRISING THE SAME
- Publication number 20210274646
- Publication date Sep 2, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Myeong Hui JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20210249157
- Publication date Aug 12, 2021
- Murata Manufacturing Co., Ltd.
- Takahiro BABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND CURRENT MEASURING DEVICE
- Publication number 20210243886
- Publication date Aug 5, 2021
- Kabushiki Kaisha Toshiba
- Shinji OSHIMA
- G01 - MEASURING TESTING
Information Patent Application
CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMB...
- Publication number 20210204396
- Publication date Jul 1, 2021
- Sparton Corporation
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20210051797
- Publication date Feb 18, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Ho HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

provided by an inner layer of PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board with rigid portion and flexible portion having connec...

Circuit board

Circuit board and manufacturing method thereof and electronic device

Electronic device

Rigid flexible printed circuit board and electronic device includin...

Electromagnetic wave transmission board comprising an inner board w...

Method of manufacturing wiring substrate

Printed circuit board and display device including the same

High efficiency and high density GaN-based power converter and meth...

Shielding structure for system-in-package and electronic device

Control of electric field effects in a printed circuit board assemb...

Flexible circuit board, manufacturing method thereof and display panel

Multilayer wiring substrate

Substrate with buried component and manufacture method thereof

Wireless power transmitter and wireless power receiver including mu...

Backplane footprint for high speed, high density electrical connectors

PCB RF noise grounding for shielded high-speed interface cable

Interconnect structure having conductor extending along dielectric...

Method for manufacturing the same

Wiring substrate and method of manufacturing the same

Architecture for chip-to-chip interconnection in semiconductors

Electronic component module and electronic device including the same

Control of electric field effects in a printed circuit board assemb...

Interconnect structure having conductor extending along dielectric...

Wiring substrate and current measuring device

Flexible cable including a transmission line having an air gap conf...

Printed circuit board and antenna module comprising the same

Transmission line substrate and electronic device

Resin multilayer substrate, electronic component, and mounting stru...

Resin multilayer substrate, electronic component, and mounting stru...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF CIRCUIT BOARD

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

REDUCED BALL GRID ARRAY PAD CAPACITANCE

DISPLAY MODULE ACCOUNTING FOR ESD PHENOMENON, AND ELECTRONIC DEVICE...

MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

ELECTRONIC DEVICE

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

METHOD OF MANUFACTURING WIRING SUBSTRATE

HIGH EFFICIENCY AND HIGH DENSITY GaN-BASED POWER CONVERTER AND METH...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...

TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...

CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMB...

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND DISPLAY PANEL

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

Shielding Structure for System-In-Package and Electronic Device

METHOD FOR MANUFACTURING THE SAME

HIGH-FREQUENCY CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

CIRCUIT BOARD

PCB RF NOISE GROUNDING FOR SHIELDED HIGH-SPEED INTERFACE CABLE

PRINTED CIRCUIT BOARD AND ANTENNA MODULE COMPRISING THE SAME

TRANSMISSION LINE SUBSTRATE AND ELECTRONIC DEVICE

WIRING SUBSTRATE AND CURRENT MEASURING DEVICE

CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMB...

ELECTRONIC COMPONENT MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME