Providing fillings in containers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/54Providing fillings in containers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interlayer of sub-structure having elevations and further sub-struc...
- Patent number 12,136,578
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,131,974
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a layer that includes inorganic filler...
- Patent number 11,848,213
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Gopalakrishnan Trichy Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate
- Patent number 11,715,647
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Fabian Craes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with separate substrate sections
- Patent number 11,710,684
- Issue date Jul 25, 2023
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,587,841
- Issue date Feb 21, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill injection for electronic devices
- Patent number 11,574,848
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing power semiconductor module arrangement
- Patent number 11,557,522
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack identification in IC chip package using encapsulated liquid p...
- Patent number 11,543,322
- Issue date Jan 3, 2023
- GLOBALFOUNDRIES U.S. INC.
- George K. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,538,727
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,424,220
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 11,410,956
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity coupling interconnect packaging systems and methods
- Patent number 11,398,465
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,367,664
- Issue date Jun 21, 2022
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar component package and method for manufacturing the same
- Patent number 11,346,920
- Issue date May 31, 2022
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging cover plate, organic light-emitting diode display and man...
- Patent number 11,245,099
- Issue date Feb 8, 2022
- BOE Technology Group Co., Ltd.
- Linlin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing structure and manufacturing method thereof
- Patent number 11,244,877
- Issue date Feb 8, 2022
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 11,227,776
- Issue date Jan 18, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for producing the same
- Patent number 11,121,004
- Issue date Sep 14, 2021
- Infineon Technologies AG
- Gopalakrishnan Trichy Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,081,414
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package thermal transfer systems and methods
- Patent number 11,056,466
- Issue date Jul 6, 2021
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing the same, and power...
- Patent number 11,037,858
- Issue date Jun 15, 2021
- Mitsubishi Electric Corporation
- Yoshitaka Kimura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor device and method of manufacturing the same, an...
- Patent number 11,037,844
- Issue date Jun 15, 2021
- Mitsubishi Electric Corporation
- Satoshi Kondo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Arrangement for subsea cooling of semiconductor modules
- Patent number 10,879,150
- Issue date Dec 29, 2020
- ABB Schweiz AG
- Heinz Lendenmann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device, power conversion apparatus, and method of man...
- Patent number 10,861,758
- Issue date Dec 8, 2020
- Mitsubishi Electric Corporation
- Akitoshi Shirao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip package structure with bump
- Patent number 10,854,565
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...
- Publication number 20240429144
- Publication date Dec 26, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interlayer of Sub-structure Having Elevations and Further Sub-struc...
- Publication number 20240413033
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379491
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE
- Publication number 20240355696
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
- Publication number 20240006392
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anton Winkler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED HEAT SLUG IN A SUBSTRATE
- Publication number 20230317554
- Publication date Oct 5, 2023
- Qorvo US, Inc.
- Christine Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230014476
- Publication date Jan 19, 2023
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220384284
- Publication date Dec 1, 2022
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367414
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20220359447
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20220301970
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FUSING AND FILLING SEMICONDUCTOR STRUCTURE, AND SEMICOND...
- Publication number 20220254718
- Publication date Aug 11, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Guangcai GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL INJECTION FOR ELECTRONIC DEVICES
- Publication number 20220238403
- Publication date Jul 28, 2022
- International Business Machines Corporation
- AKIHIRO HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL
- Publication number 20220102166
- Publication date Mar 31, 2022
- STMICROELECTRONICS, INC.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Arrangement and Method for Producing the...
- Publication number 20220051960
- Publication date Feb 17, 2022
- Marianna Nomann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Substrate
- Publication number 20210398821
- Publication date Dec 23, 2021
- Fabian Craes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A LAYER THAT INCLUDES INORGANIC FILLER...
- Publication number 20210366730
- Publication date Nov 25, 2021
- Gopalakrishnan Trichy Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK IDENTIFICATION IN IC CHIP PACKAGE USING ENCAPSULATED LIQUID P...
- Publication number 20210341349
- Publication date Nov 4, 2021
- GLOBALFOUNDRIES U.S. Inc.
- George K. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlayer of Sub-structure Having Elevations and Further Sub-struc...
- Publication number 20210335686
- Publication date Oct 28, 2021
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20210335682
- Publication date Oct 28, 2021
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210210401
- Publication date Jul 8, 2021
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20210193539
- Publication date Jun 24, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Shojiro Hanada
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
RADAR COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210181297
- Publication date Jun 17, 2021
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE WITH SEPARATE SUBSTRATE SECTIONS
- Publication number 20210111108
- Publication date Apr 15, 2021
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20210082855
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS
- Publication number 20210035875
- Publication date Feb 4, 2021
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS

Providing fillings in containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interlayer of sub-structure having elevations and further sub-struc...

Semiconductor package and method of manufacturing semiconductor pac...

Chip package structure with bump

Leadframe package with pre-applied filler material

Semiconductor structure and manufacturing method thereof

Semiconductor module having a layer that includes inorganic filler...

Methods of manufacturing stacked semiconductor die assemblies with...

Method for producing a substrate

Package with separate substrate sections

Semiconductor module

Underfill injection for electronic devices

Method for producing power semiconductor module arrangement

Crack identification in IC chip package using encapsulated liquid p...

Semiconductor module

Semiconductor structure and manufacturing method thereof

Chip package structure with bump

Proximity coupling interconnect packaging systems and methods

Semiconductor devices and methods of manufacturing semiconductor de...

Radar component package and method for manufacturing the same

Packaging cover plate, organic light-emitting diode display and man...

Sealing structure and manufacturing method thereof

Leadframe package with pre-applied filler material

Semiconductor module and method for producing the same

Power semiconductor module arrangement

Package on package thermal transfer systems and methods

Semiconductor module, method for manufacturing the same, and power...

Power semiconductor device and method of manufacturing the same, an...

Arrangement for subsea cooling of semiconductor modules

Semiconductor device, power conversion apparatus, and method of man...

Chip package structure with bump

Patents Applicationslast 30 patents

SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...

ENCLOSURE

Interlayer of Sub-structure Having Elevations and Further Sub-struc...

Chip Package Structure with Bump

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE

INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

EMBEDDED HEAT SLUG IN A SUBSTRATE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Chip Package Structure with Bump

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

METHOD FOR FUSING AND FILLING SEMICONDUCTOR STRUCTURE, AND SEMICOND...

UNDERFILL INJECTION FOR ELECTRONIC DEVICES

LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL

Power Semiconductor Module Arrangement and Method for Producing the...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

Method for Producing a Substrate

SEMICONDUCTOR MODULE HAVING A LAYER THAT INCLUDES INORGANIC FILLER...

CRACK IDENTIFICATION IN IC CHIP PACKAGE USING ENCAPSULATED LIQUID P...

Interlayer of Sub-structure Having Elevations and Further Sub-struc...

METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...

RADAR COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE WITH SEPARATE SUBSTRATE SECTIONS

Chip Package Structure with Bump

AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS