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H01L2224/4321

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4321Pulling

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor fuse with multi-bond wire
- Patent number 12,191,252
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,901,337
- Issue date Feb 13, 2024
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,570
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection pads for low cross-talk vertical wirebonds
- Patent number 10,580,756
- Issue date Mar 3, 2020
- Intel Corporation
- Hungying L. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper-based alloy wire and methods for manufaturing the same
- Patent number 9,997,488
- Issue date Jun 12, 2018
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 9,812,421
- Issue date Nov 7, 2017
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device use and method of production...
- Patent number 9,536,854
- Issue date Jan 3, 2017
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire and method for manufacturing same
- Patent number 9,434,027
- Issue date Sep 6, 2016
- NIPPON MICROMETAL CORPORATION
- Ryo Togashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper alloy bonding wire for semiconductor
- Patent number 9,427,830
- Issue date Aug 30, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum alloy wire for bonding applications
- Patent number 9,397,064
- Issue date Jul 19, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for fabricating bonding wires on the basis of mic...
- Patent number 8,561,446
- Issue date Oct 22, 2013
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,389,860
- Issue date Mar 5, 2013
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,299,356
- Issue date Oct 30, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240071996
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230335528
- Publication date Oct 19, 2023
- NIPPON MICROMETAL COPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
- Publication number 20230187348
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220238490
- Publication date Jul 28, 2022
- KIOXIA Corporation
- Yasuo OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
- Publication number 20210280552
- Publication date Sep 9, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION PADS FOR LOW CROSS-TALK VERTICAL WIREBONDS
- Publication number 20180323173
- Publication date Nov 8, 2018
- Intel Corporation
- Hungying L. LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160111389
- Publication date Apr 21, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM ALLOY WIRE FOR BONDING APPLICATIONS
- Publication number 20150303165
- Publication date Oct 22, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140329106
- Publication date Nov 6, 2014
- NIPPON MICROMETAL CORPORATION
- Ryo TOGASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME
- Publication number 20140209215
- Publication date Jul 31, 2014
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE
- Publication number 20130160902
- Publication date Jun 27, 2013
- Jun-Der LEE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITE ALLOY BONDING WIRE
- Publication number 20130164169
- Publication date Jun 27, 2013
- Jun-Der Lee
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND S...
- Publication number 20130022831
- Publication date Jan 24, 2013
- Hitachi Cable, Ltd.
- Hideyuki Sagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120094121
- Publication date Apr 19, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF
- Publication number 20120093681
- Publication date Apr 19, 2012
- Jun-Der LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110089549
- Publication date Apr 21, 2011
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20110011619
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor fuse with multi-bond wire

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Palladium-coated copper bonding wire, manufacturing method of palla...

Semiconductor device and method of manufacturing the same

Semiconductor package structure with heat sink and method preparing...

Semiconductor package structure with heat sink and method preparing...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Connection pads for low cross-talk vertical wirebonds

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Copper-based alloy wire and methods for manufaturing the same

Bonding wire for semiconductor devices

Bonding wire for semiconductor device use and method of production...

Bonding wire and method for manufacturing same

Copper alloy bonding wire for semiconductor

Aluminum alloy wire for bonding applications

Bonding structure of bonding wire

Core-jacket bonding wire

Bonding wire for semiconductor device

Method and device for fabricating bonding wires on the basis of mic...

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

CONNECTION PADS FOR LOW CROSS-TALK VERTICAL WIREBONDS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

ALUMINUM ALLOY WIRE FOR BONDING APPLICATIONS

BONDING WIRE AND METHOD FOR MANUFACTURING SAME

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME

SEMICONDUCTOR DEVICE

CORE-JACKET BONDING WIRE

MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE

COMPOSITE ALLOY BONDING WIRE

SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND S...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURE OF BONDING WIRE

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES