Punching metal foil

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CPC
H05K2203/033

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/033Punching metal foil

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for printing solder paste and other viscous materials at hi...
- Patent number 11,697,166
- Issue date Jul 11, 2023
- IO Tech Group Ltd.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lamp having metal PCB bent polyhedrally and manufacturing metho...
- Patent number 11,480,328
- Issue date Oct 25, 2022
- ECOCAB.CO., LTD
- Young Cheon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for printing solder paste and other viscous materials at hi...
- Patent number 11,446,750
- Issue date Sep 20, 2022
- IO TECH GROUP LTD.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized rework using liquid media soldering
- Patent number 11,445,650
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,268,203
- Issue date Mar 8, 2022
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,162,182
- Issue date Nov 2, 2021
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Insulated circuit board
- Patent number 11,013,107
- Issue date May 18, 2021
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional packaging structure and packaging method of power...
- Patent number 10,943,845
- Issue date Mar 9, 2021
- Huazhong University of Science & Technology
- Cai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 10,651,320
- Issue date May 12, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management module and method of manufacture
- Patent number 10,475,568
- Issue date Nov 12, 2019
- L. Pierre de Rochemont
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interdigitated foil interconnect for rear-contact solar cells
- Patent number 10,383,207
- Issue date Aug 13, 2019
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional packaging structure and packaging method of power...
- Patent number 10,354,937
- Issue date Jul 16, 2019
- Huazhong University of Science & Technology
- Cai Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder application stamp for applying solder on contact locations p...
- Patent number 10,237,982
- Issue date Mar 19, 2019
- ENDRESS+HAUSER SE+CO.KG
- Christoph Hippin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing portable data carriers
- Patent number 10,015,886
- Issue date Jul 3, 2018
- GIESECKE+DEVRIENT MOBILE SECURITY GMBH
- Thomas Tarantino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical components and method of manufacture
- Patent number 9,905,928
- Issue date Feb 27, 2018
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Solder precoating method and workpiece for electronic equipment
- Patent number 9,821,397
- Issue date Nov 21, 2017
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bellows interconnect
- Patent number 9,801,277
- Issue date Oct 24, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano-copper via fill for enhanced thermal conductivity of plated th...
- Patent number 9,736,947
- Issue date Aug 15, 2017
- Multek Technologies, Ltd.
- Mark Bergman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,699,920
- Issue date Jul 4, 2017
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable electronic device contact puck alignment
- Patent number 9,591,766
- Issue date Mar 7, 2017
- Motorola Mobility LLC
- Michael J Lombardi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Security mesh and method of making
- Patent number 9,565,777
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 9,478,674
- Issue date Oct 25, 2016
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 9,332,638
- Issue date May 3, 2016
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor device
- Patent number 9,155,195
- Issue date Oct 6, 2015
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,040,832
- Issue date May 26, 2015
- Shinko Electric Industries Co., Ltd.
- Yuichiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of solder transfer substrate, solder precoatin...
- Patent number 9,027,822
- Issue date May 12, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-random array anisotropic conductive film (ACF) and manufacturin...
- Patent number 8,802,214
- Issue date Aug 12, 2014
- Trillion Science, Inc.
- Rong-Chang Liang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING A PRINTED CIRCUIT BO...
- Publication number 20250203771
- Publication date Jun 19, 2025
- ROBERT BOSCH GmbH
- Charles-Edouard De Gryse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...
- Publication number 20210337674
- Publication date Oct 28, 2021
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
LOCALIZED REWORK USING LIQUID MEDIA SOLDERING
- Publication number 20210120712
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378025
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378024
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LED LAMP HAVING METAL PCB BENT POLYHEDRALLY AND MANUFACUTRING METHO...
- Publication number 20200318826
- Publication date Oct 8, 2020
- ECOCAB CO., LTD.
- Young Cheon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20190288127
- Publication date Sep 19, 2019
- DSM IP Assets, B.V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC COMPONENT CARRIER FOR AUTOMOBILE A...
- Publication number 20190182963
- Publication date Jun 13, 2019
- Kiekert AG
- Andreas Schmitz
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20190067199
- Publication date Feb 28, 2019
- Shinko Electric Industries Co., Ltd.
- Daisuke Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL PACKAGING STRUCTURE AND PACKAGING METHOD OF POWER...
- Publication number 20190067151
- Publication date Feb 28, 2019
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Cai CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20170018660
- Publication date Jan 19, 2017
- DSM IP Assets B. V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRO...
- Publication number 20170006708
- Publication date Jan 5, 2017
- UNITECH PRINTED CIRCUIT BOARD CORP.
- MING YI YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PORTABLE ELECTRONIC DEVICE CONTACT PUCK ALIGNMENT
- Publication number 20160249466
- Publication date Aug 25, 2016
- Michael J. Lombardi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Portable Data Carriers
- Publication number 20160120036
- Publication date Apr 28, 2016
- Giesecke & Devrient GmbH
- Thomas TARANTINO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150163908
- Publication date Jun 11, 2015
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURIN...
- Publication number 20140312501
- Publication date Oct 23, 2014
- Trillion Science Inc.
- Rong-Chang Liang
- B32 - LAYERED PRODUCTS
Information Patent Application
Thin Film Deposition of Materials by External Induced Release from...
- Publication number 20140242747
- Publication date Aug 28, 2014
- Zvi Yaniv
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20140151106
- Publication date Jun 5, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device for Producing an Electric Contact Sensor Plate
- Publication number 20140154894
- Publication date Jun 5, 2014
- Andreas Heise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL PATTERN LAMINATE, METHOD FOR PUNCHING METAL FOIL, CIRCUI...
- Publication number 20130247977
- Publication date Sep 26, 2013
- Toppan Printing Co., Ltd.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20130235543
- Publication date Sep 12, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...
- Publication number 20130181041
- Publication date Jul 18, 2013
- PANASONIC CORPORATION
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Management Module and Method of Manufacture
- Publication number 20130175664
- Publication date Jul 11, 2013
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Application
Carbon Nanotube Contact Structures For Use With Semiconductor Dies...
- Publication number 20130140057
- Publication date Jun 6, 2013
- FormFactor, Inc.
- John K. Gritters
- B82 - NANO-TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130126215
- Publication date May 23, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE-INCORPORATED CAPACITOR, CAPACITOR-INCORPORATING SUBSTRATE...
- Publication number 20130120902
- Publication date May 16, 2013
- SANYO ELECTRIC CO., LTD.
- Hitoshi Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERDIGITATED FOIL INTERCONNECT FOR REAR-CONTACT SOLAR CELLS
- Publication number 20130112233
- Publication date May 9, 2013
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120247814
- Publication date Oct 4, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FORMING FLEXIBLE SUBSTRATES USING PUNCH PRESS TYPE TECH...
- Publication number 20120234586
- Publication date Sep 20, 2012
- Applied Materials, Inc.
- JOHN TELLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Punching metal foil

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for printing solder paste and other viscous materials at hi...

LED lamp having metal PCB bent polyhedrally and manufacturing metho...

Systems for printing solder paste and other viscous materials at hi...

Localized rework using liquid media soldering

Circuit board

Tin or tin alloy plating solution

Modulated inductance module

Tin or tin alloy plating solution

Insulated circuit board

Three-dimensional packaging structure and packaging method of power...

Method of manufacturing a circuit board by punching

Power management module and method of manufacture

Interdigitated foil interconnect for rear-contact solar cells

Three-dimensional packaging structure and packaging method of power...

Solder application stamp for applying solder on contact locations p...

Conductive connecting member and manufacturing method of same

Method for producing portable data carriers

Electrical components and method of manufacture

Solder precoating method and workpiece for electronic equipment

Bellows interconnect

Nano-copper via fill for enhanced thermal conductivity of plated th...

Printed wiring board

Portable electronic device contact puck alignment

Security mesh and method of making

Method of manufacturing a circuit board by punching

Wiring board and method for manufacturing wiring board

Wiring board and semiconductor device

Wiring substrate and method of manufacturing the same

Manufacturing method of solder transfer substrate, solder precoatin...

Non-random array anisotropic conductive film (ACF) and manufacturin...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING A PRINTED CIRCUIT BO...

ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...

LOCALIZED REWORK USING LIQUID MEDIA SOLDERING

TIN OR TIN ALLOY PLATING SOLUTION

TIN OR TIN ALLOY PLATING SOLUTION

LED LAMP HAVING METAL PCB BENT POLYHEDRALLY AND MANUFACUTRING METHO...

METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING

METHOD FOR PRODUCING AN ELECTRIC COMPONENT CARRIER FOR AUTOMOBILE A...

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

WIRING BOARD AND ELECTRONIC DEVICE

THREE-DIMENSIONAL PACKAGING STRUCTURE AND PACKAGING METHOD OF POWER...

METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRO...

PORTABLE ELECTRONIC DEVICE CONTACT PUCK ALIGNMENT

Method for Producing Portable Data Carriers

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURIN...

Thin Film Deposition of Materials by External Induced Release from...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

Method and Device for Producing an Electric Contact Sensor Plate

METAL FOIL PATTERN LAMINATE, METHOD FOR PUNCHING METAL FOIL, CIRCUI...

WIRING BOARD AND SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...

Power Management Module and Method of Manufacture

Carbon Nanotube Contact Structures For Use With Semiconductor Dies...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE-INCORPORATED CAPACITOR, CAPACITOR-INCORPORATING SUBSTRATE...

INTERDIGITATED FOIL INTERCONNECT FOR REAR-CONTACT SOLAR CELLS

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PROCESS FOR FORMING FLEXIBLE SUBSTRATES USING PUNCH PRESS TYPE TECH...