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Circuit board
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Patent number 11,291,123
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Issue date Mar 29, 2022
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SAMWON ACT CO., LTD.
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Kyung Yul Lee
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Tin or tin alloy plating solution
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Patent number 11,268,203
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Issue date Mar 8, 2022
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Mitsubishi Materials Corporation
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Mami Watanabe
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Tin or tin alloy plating solution
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Patent number 11,162,182
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Issue date Nov 2, 2021
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Mitsubishi Materials Corporation
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Mami Watanabe
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Insulated circuit board
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Patent number 11,013,107
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Issue date May 18, 2021
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Mitsubishi Materials Corporation
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Takeshi Kitahara
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Bellows interconnect
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Patent number 9,801,277
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Issue date Oct 24, 2017
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Flextronics AP, LLC
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Weifeng Liu
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H01 - BASIC ELECTRIC ELEMENTS
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Printed wiring board
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Patent number 9,699,920
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Issue date Jul 4, 2017
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Ibiden Co., Ltd.
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Kota Noda
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H01 - BASIC ELECTRIC ELEMENTS
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Security mesh and method of making
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Patent number 9,565,777
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Issue date Feb 7, 2017
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International Business Machines Corporation
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Charles L. Arvin
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Wiring board and semiconductor device
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Patent number 9,155,195
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Issue date Oct 6, 2015
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Shinko Electric Industries Co., Ltd.
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Junichi Nakamura
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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