Purification

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CPC
Y10S148/13

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

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Y10S148/13Purification

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structure and method for manufacturing the same
- Patent number 10,486,391
- Issue date Nov 26, 2019
- Honda Motor Co., Ltd.
- Katsuyuki Awano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible and elastic dielectric integrated circuit
- Patent number 7,911,012
- Issue date Mar 22, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd
- Glenn Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Stress-controlled dielectric integrated circuit
- Patent number 7,820,469
- Issue date Oct 26, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Flexible and elastic dielectric integrated circuit
- Patent number 7,763,948
- Issue date Jul 27, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Membrane IC fabrication
- Patent number 7,670,893
- Issue date Mar 2, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Lithography device for semiconductor circuit pattern generation
- Patent number 7,615,837
- Issue date Nov 10, 2009
- Taiwan Semiconductor Manufacturing Company
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of producing a complex structure by assembling stressed stru...
- Patent number 7,550,052
- Issue date Jun 23, 2009
- Commissariat a l'Energie Atomique
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-controlled dielectric integrated circuit
- Patent number 7,550,805
- Issue date Jun 23, 2009
- Elm Technology Corporation
- Glenn Joseph Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of making an integrated circuit
- Patent number 7,485,571
- Issue date Feb 3, 2009
- Elm Technology Corporation
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Membrane 3D IC fabrication
- Patent number 7,479,694
- Issue date Jan 20, 2009
- Elm Technology Corporation
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing external force detection sensor
- Patent number 7,393,714
- Issue date Jul 1, 2008
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Membrane 3D IC fabrication
- Patent number 7,385,835
- Issue date Jun 10, 2008
- Elm Technology Corporation
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Membrane 3D IC fabrication
- Patent number 7,307,020
- Issue date Dec 11, 2007
- Elm Technology Corporation
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing an external force detection sensor
- Patent number 7,067,344
- Issue date Jun 27, 2006
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 7,064,033
- Issue date Jun 20, 2006
- Denso Corporation
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an external force detection sensor
- Patent number 7,049,165
- Issue date May 23, 2006
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a vertical semiconductor device
- Patent number 6,949,434
- Issue date Sep 27, 2005
- Denso Corporation
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 6,903,417
- Issue date Jun 7, 2005
- Denso Corporation
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Membrane 3D IC fabrication
- Patent number 6,765,279
- Issue date Jul 20, 2004
- Elm Technology Corporation
- Glenn Joseph Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Stress controlled dielectric integrated circuit fabrication
- Patent number 6,713,327
- Issue date Mar 30, 2004
- Elm Technology Corporation
- Glenn Joseph Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Stress controlled dielectric integrated circuit fabrication
- Patent number 6,682,981
- Issue date Jan 27, 2004
- Elm Technology Corporation
- Glenn Joseph Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing member pattern and method of manufacturing...
- Patent number 6,653,232
- Issue date Nov 25, 2003
- Canon Kabushiki Kaisha
- Yoshimi Uda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 6,649,478
- Issue date Nov 18, 2003
- Denso Corporation
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,518,196
- Issue date Feb 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that exhibits decreased contact resistance bet...
- Patent number 6,498,366
- Issue date Dec 24, 2002
- Denso Corporation
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method for fabricating the same
- Patent number 6,472,703
- Issue date Oct 29, 2002
- Fujitsu Limited
- Shunji Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment process for molecular bonding and unbonding of two struct...
- Patent number 6,429,094
- Issue date Aug 6, 2002
- Commissariat a l'Energie Atomique
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High Density electronic circuit modules
- Patent number 6,424,020
- Issue date Jul 23, 2002
- Kopin Corporation
- Duy-Pach Vu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of transferring semiconductors
- Patent number 6,414,783
- Issue date Jul 2, 2002
- Kopin Corporation
- Paul M. Zavracky
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electro-magnetic lithographic alignment method
- Patent number 6,294,909
- Issue date Sep 25, 2001
- Glenn Joseph Leedy
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Flexible and elastic dielectric integrated circuit
- Publication number 20080302559
- Publication date Dec 11, 2008
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Method of producing a complex structure by assembling stressed stru...
- Publication number 20060141742
- Publication date Jun 29, 2006
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an external force detection sensor
- Publication number 20060110843
- Publication date May 25, 2006
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20050227438
- Publication date Oct 13, 2005
- DENSO CORPORATION
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODOF MAKING AN INTEGRATED CIRCUIT
- Publication number 20050176174
- Publication date Aug 11, 2005
- Elm Technology Corporation
- Glenn J. Leedy
- G02 - OPTICS
Information Patent Application
Lithography device for semiconductor circuit pattern generation
- Publication number 20050156265
- Publication date Jul 21, 2005
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Membrane 3D IC fabrication
- Publication number 20050082626
- Publication date Apr 21, 2005
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Flexible and elastic dielectric integrated circuit
- Publication number 20050082641
- Publication date Apr 21, 2005
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
STRESS-CONTROLLED DIELECTRIC INTEGRATED CIRCUIT
- Publication number 20050051841
- Publication date Mar 10, 2005
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20040241930
- Publication date Dec 2, 2004
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20040237327
- Publication date Dec 2, 2004
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Membrane IC fabrication
- Publication number 20040197951
- Publication date Oct 7, 2004
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Membrane 3D IC fabrication
- Publication number 20040150068
- Publication date Aug 5, 2004
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Membrane 3D IC fabrication
- Publication number 20040132303
- Publication date Jul 8, 2004
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Method of manufacturing an external force detection sensor
- Publication number 20040110318
- Publication date Jun 10, 2004
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20040036140
- Publication date Feb 26, 2004
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strees-controlled dielectric integrated circuit
- Publication number 20030218182
- Publication date Nov 27, 2003
- Glenn J. Leedy
- G02 - OPTICS
Information Patent Application
Membrane IC fabrication
- Publication number 20030057513
- Publication date Mar 27, 2003
- Elm Technology
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Active matrix display device
- Publication number 20030057425
- Publication date Mar 27, 2003
- Kopin Corporation
- Paul M. Zavracky
- G02 - OPTICS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20030052366
- Publication date Mar 20, 2003
- Yoshifumi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing member pattern and method of manufacturing...
- Publication number 20030027417
- Publication date Feb 6, 2003
- Yoshimi Uda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20020160619
- Publication date Oct 31, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory device and method for fabricating the same
- Publication number 20020056866
- Publication date May 16, 2002
- FUJITSU LIMITED
- Shunji Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Membrane 3D IC fabrication
- Publication number 20020045297
- Publication date Apr 18, 2002
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
TREATMENT PROCESS FOR MOLECULAR BONDING AND UNBONDING OF TWO STRUCT...
- Publication number 20020022337
- Publication date Feb 21, 2002
- CHRISTOPHE MALEVILLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making membrane integrated circuits
- Publication number 20020014673
- Publication date Feb 7, 2002
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Method of transferring semiconductors
- Publication number 20010019371
- Publication date Sep 6, 2001
- Kopin Corporation
- Paul M. Zavracky
- G02 - OPTICS

Purification

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structure and method for manufacturing the same

Flexible and elastic dielectric integrated circuit

Stress-controlled dielectric integrated circuit

Flexible and elastic dielectric integrated circuit

Membrane IC fabrication

Lithography device for semiconductor circuit pattern generation

Method of producing a complex structure by assembling stressed stru...

Stress-controlled dielectric integrated circuit

Method of making an integrated circuit

Membrane 3D IC fabrication

Method of manufacturing external force detection sensor

Membrane 3D IC fabrication

Membrane 3D IC fabrication

Method of manufacturing an external force detection sensor

Semiconductor device and method of manufacturing same

Method of manufacturing an external force detection sensor

Method of manufacturing a vertical semiconductor device

Power semiconductor device

Membrane 3D IC fabrication

Stress controlled dielectric integrated circuit fabrication

Stress controlled dielectric integrated circuit fabrication

Method of manufacturing member pattern and method of manufacturing...

Semiconductor device and method of manufacturing same

Method of manufacturing semiconductor device

Semiconductor device that exhibits decreased contact resistance bet...

Semiconductor memory device and method for fabricating the same

Treatment process for molecular bonding and unbonding of two struct...

High Density electronic circuit modules

Method of transferring semiconductors

Electro-magnetic lithographic alignment method

Patents Applicationslast 30 patents

Flexible and elastic dielectric integrated circuit

Method of producing a complex structure by assembling stressed stru...

Method of manufacturing an external force detection sensor

Semiconductor device and method of manufacturing same

METHODOF MAKING AN INTEGRATED CIRCUIT

Lithography device for semiconductor circuit pattern generation

Membrane 3D IC fabrication

Flexible and elastic dielectric integrated circuit

STRESS-CONTROLLED DIELECTRIC INTEGRATED CIRCUIT

Semiconductor device and method of manufacturing same

Semiconductor device and method of manufacturing same

Membrane IC fabrication

Membrane 3D IC fabrication

Membrane 3D IC fabrication

Method of manufacturing an external force detection sensor

Semiconductor device and method of manufacturing same

Strees-controlled dielectric integrated circuit

Membrane IC fabrication

Active matrix display device

Semiconductor device and method of manufacturing same

Method of manufacturing member pattern and method of manufacturing...

Method of manufacturing semiconductor device

Semiconductor memory device and method for fabricating the same

Membrane 3D IC fabrication

TREATMENT PROCESS FOR MOLECULAR BONDING AND UNBONDING OF TWO STRUCT...

Method of making membrane integrated circuits

Method of transferring semiconductors