B. Aspar, et al. , Basic Mechanisms involved in a Smart-Cut Process, 1997 Microelectronic Engineering 36 pp. 233-240.* |
M. Bruel et al. , Smart Cut: A promising New SOI material Technology, 1995, Proceedings 1995 IEE International SOi conference, Oct. 1995.* |
W. P. Maszara, et al., Journal of Applied Physics, vol. 64, No. 10, pp. 4943-4950, “Bonding of Silicon Wafers For Silicon-On-Insulator”, Nov. 15, 1988. |
R. Stengl, et al., Japanese Journal of Applied Physics, vol. 28, No. 10, pp. 1735-1741, “A Model For The Silicon Wafer Bonding Process”, Oct. 1989. |
Michel Bruel, Nuclear Instruments and Methods in Physics Research B, vol. 108, pp. 313-319, “Application of Hydrogen Ion Beams to Silicon on Insulator Material Technology”, 1996. |