Quaternary Alloys

Industry

CPC
H01L2924/0134

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0134Quaternary Alloys

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,943,942
- Issue date Mar 26, 2024
- Sony Corporation
- Toshiki Moriwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum alloy material, and conductive member, conductive componen...
- Patent number 11,466,346
- Issue date Oct 11, 2022
- Furukawa Electric Co., Ltd.
- Hiroshi Kaneko
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Imaging device having a photoelectric conversion layer
- Patent number 11,145,835
- Issue date Oct 12, 2021
- Sony Corporation
- Toshiki Moriwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,468,375
- Issue date Nov 5, 2019
- Mitsubishi Electric Corporation
- Koji Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, solid state imaging apparatus, and method of pro...
- Patent number 10,236,396
- Issue date Mar 19, 2019
- Sony Corporation
- Toshiki Moriwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free soldering method and soldered article
- Patent number 10,002,845
- Issue date Jun 19, 2018
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive material, electronic device including anisot...
- Patent number 9,831,211
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip mounting portion on which a sepa...
- Patent number 9,478,483
- Issue date Oct 25, 2016
- Renesas Electronics Corporation
- Yukihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stud bump and package structure thereof and method of manufacturing...
- Patent number 9,425,168
- Issue date Aug 23, 2016
- Wire Technology Co., Ltd.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 9,269,644
- Issue date Feb 23, 2016
- Fuji Electric Co., Ltd.
- Yoshitaka Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode for low-leakage devices
- Patent number 9,245,941
- Issue date Jan 26, 2016
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,841,772
- Issue date Sep 23, 2014
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device including a semiconductor chip and metal foils
- Patent number 8,680,668
- Issue date Mar 25, 2014
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 8,674,520
- Issue date Mar 18, 2014
- Fujitsu Limited
- Nobuhiro Imaizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead component and method for manufacturing the same, and semicondu...
- Patent number 8,669,652
- Issue date Mar 11, 2014
- Hitachi Cable, Ltd.
- Shohei Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive fine particles, anisotropic electroconductive mat...
- Patent number 8,609,246
- Issue date Dec 17, 2013
- Sekisui Chemical Co., Ltd.
- Ren-de Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and semiconductor device
- Patent number 8,598,707
- Issue date Dec 3, 2013
- Mitsubishi Electric Corporation
- Akira Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and multil...
- Patent number 8,531,024
- Issue date Sep 10, 2013
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting member for connecting a semiconductor element and a fram...
- Patent number 8,525,330
- Issue date Sep 3, 2013
- Hitachi, Ltd.
- Masahide Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,518,744
- Issue date Aug 27, 2013
- Renesas Electronics Corporation
- Takashi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting between substrates, flip-chip mounting struct...
- Patent number 8,501,583
- Issue date Aug 6, 2013
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Junction body, semiconductor module, and manufacturing method for j...
- Patent number 8,471,386
- Issue date Jun 25, 2013
- Toyota Jidosha Kabushiki Kaisha
- Yasushi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mosfet package
- Patent number 8,455,986
- Issue date Jun 4, 2013
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 8,450,848
- Issue date May 28, 2013
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal packaging of a semiconductor device mounted on die pads
- Patent number 8,395,364
- Issue date Mar 12, 2013
- Renesas Electronics Corporation
- Yukihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,390,117
- Issue date Mar 5, 2013
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device, production method for the same, and substrate
- Patent number 8,368,234
- Issue date Feb 5, 2013
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package structure and method for the same
- Patent number 8,350,377
- Issue date Jan 8, 2013
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
- Publication number 20240105667
- Publication date Mar 28, 2024
- TANAKA DENSHI KOGYO K.K.
- Shuichi MITOMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Carrier Substrate
- Publication number 20240087979
- Publication date Mar 14, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE
- Publication number 20230230892
- Publication date Jul 20, 2023
- NEXPERIA B.V.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210399247
- Publication date Dec 23, 2021
- SONY CORPORATION
- Toshiki MORIWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM ALLOY MATERIAL, AND CONDUCTIVE MEMBER, CONDUCTIVE COMPONEN...
- Publication number 20200017938
- Publication date Jan 16, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Hiroshi KANEKO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190221540
- Publication date Jul 18, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20190172956
- Publication date Jun 6, 2019
- SONY CORPORATION
- Toshiki MORIWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE MATERIAL, ELECTRONIC DEVICE INCLUDING ANISOT...
- Publication number 20170062374
- Publication date Mar 2, 2017
- Industry-Academic Cooperation Foundation, Yonsei University
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Alloy
- Publication number 20160074971
- Publication date Mar 17, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Ken Tachibana
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT
- Publication number 20150262926
- Publication date Sep 17, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...
- Publication number 20150194409
- Publication date Jul 9, 2015
- WIRE TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode for Low-Leakage Devices
- Publication number 20140273427
- Publication date Sep 18, 2014
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition of Anisotropic Dielectric Layers Orientationally Matched...
- Publication number 20140264747
- Publication date Sep 18, 2014
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING THE SAME
- Publication number 20140080262
- Publication date Mar 20, 2014
- Fuji Electric Co., Ltd.
- Yoshitaka NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130264696
- Publication date Oct 10, 2013
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20130161823
- Publication date Jun 27, 2013
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130147064
- Publication date Jun 13, 2013
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DEVICE INCLUDING A SEMICONDUCTOR CHIP AND METAL FOILS
- Publication number 20130069211
- Publication date Mar 21, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009300
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...
- Publication number 20120292087
- Publication date Nov 22, 2012
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE-BONDED LED
- Publication number 20120256228
- Publication date Oct 11, 2012
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD COMPONENT AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDU...
- Publication number 20120248592
- Publication date Oct 4, 2012
- Hitachi Cable, Ltd.
- Shohei HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120217556
- Publication date Aug 30, 2012
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...
- Publication number 20120211899
- Publication date Aug 23, 2012
- FUJITSU LIMITED
- Nobuhiro IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND...
- Publication number 20120152510
- Publication date Jun 21, 2012
- NIPPON SOKEN, INC.
- Koji Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING MATERIAL, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20120098134
- Publication date Apr 26, 2012
- Masahide Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120001342
- Publication date Jan 5, 2012
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATO
- H01 - BASIC ELECTRIC ELEMENTS

Quaternary Alloys

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Aluminum alloy material, and conductive member, conductive componen...

Imaging device having a photoelectric conversion layer

Semiconductor device and method for manufacturing same

Method for soldering surface-mount component and surface-mount comp...

Electronic device including soldered surface-mount component

Electronic device, solid state imaging apparatus, and method of pro...

Lead-free soldering method and soldered article

Anisotropic conductive material, electronic device including anisot...

Semiconductor device having a chip mounting portion on which a sepa...

Stud bump and package structure thereof and method of manufacturing...

Method for producing semiconductor device

Electrode for low-leakage devices

Semiconductor device and method of manufacturing the same

Device including a semiconductor chip and metal foils

Semiconductor device, method for manufacturing the same, and power...

Lead component and method for manufacturing the same, and semicondu...

Electroconductive fine particles, anisotropic electroconductive mat...

Solder alloy and semiconductor device

Semiconductor chip assembly with post/base heat spreader and multil...

Connecting member for connecting a semiconductor element and a fram...

Method of manufacturing semiconductor device

Method for connecting between substrates, flip-chip mounting struct...

Junction body, semiconductor module, and manufacturing method for j...

Mosfet package

Semiconductor device and method for fabricating the same

Internal packaging of a semiconductor device mounted on die pads

Semiconductor device and method of manufacturing the same

Semiconductor device, production method for the same, and substrate

Semiconductor device package structure and method for the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

Carrier Substrate

CHIP-SCALE PACKAGE

DISPLAY PANEL

LIQUID METAL THERMAL INTERFACE

ELECTRONIC DEVICE

ALUMINUM ALLOY MATERIAL, AND CONDUCTIVE MEMBER, CONDUCTIVE COMPONEN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

IMAGING DEVICE

ANISOTROPIC CONDUCTIVE MATERIAL, ELECTRONIC DEVICE INCLUDING ANISOT...

Lead-Free Solder Alloy

ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT

STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...

Electrode for Low-Leakage Devices

Deposition of Anisotropic Dielectric Layers Orientationally Matched...

METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE

DEVICE INCLUDING A SEMICONDUCTOR CHIP AND METAL FOILS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...

DIE-BONDED LED

LEAD COMPONENT AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...

BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND...

CONNECTING MATERIAL, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...

SEMICONDUCTOR DEVICE