Quinary Alloys

Industry

CPC
H01L2924/0135

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0135Quinary Alloys

Industries

Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having first and second terminals
- Patent number 11,011,484
- Issue date May 18, 2021
- Kioxia Corporation
- Hiroyuki Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and BGA ball
- Patent number 10,068,869
- Issue date Sep 4, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyohiro Hine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stud bump and package structure thereof and method of manufacturing...
- Patent number 9,425,168
- Issue date Aug 23, 2016
- Wire Technology Co., Ltd.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction body, semiconductor module, and manufacturing method for j...
- Patent number 8,471,386
- Issue date Jun 25, 2013
- Toyota Jidosha Kabushiki Kaisha
- Yasushi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material, method for manufacturing the same, joined body, me...
- Patent number 8,283,783
- Issue date Oct 9, 2012
- Toyota Jidosha Kabushiki Kaisha
- Yasushi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor package using a fluxing under...
- Patent number 8,273,606
- Issue date Sep 25, 2012
- Henkel Corporation
- Chew B. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 7,888,173
- Issue date Feb 15, 2011
- Fuji Electric Device Technology Co., Ltd.
- Harutaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material and electronic assembly having such a th...
- Patent number 7,311,967
- Issue date Dec 25, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Product using Zn-Al alloy solder
- Patent number 6,563,225
- Issue date May 13, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, and manufacturing method of the same
- Patent number 6,087,715
- Issue date Jul 11, 2000
- Kabushiki Kaisha Toshiba
- Kanako Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and manufacturing method of the same
- Patent number 5,937,279
- Issue date Aug 10, 1999
- Kabushiki Kaisha Toshiba
- Kanako Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum alloy solder material, its manufacturing method, brazing s...
- Patent number 5,837,388
- Issue date Nov 17, 1998
- The Furukawa Electric Co., Ltd.
- Takeyoshi Doko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
- Publication number 20240105667
- Publication date Mar 28, 2024
- TANAKA DENSHI KOGYO K.K.
- Shuichi MITOMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210074657
- Publication date Mar 11, 2021
- KIOXIA Corporation
- Hiroyuki Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND BGA BALL
- Publication number 20160163668
- Publication date Jun 9, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIRO HINE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT
- Publication number 20150262926
- Publication date Sep 17, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...
- Publication number 20120292087
- Publication date Nov 22, 2012
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JUNCTION BODY, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR J...
- Publication number 20110291282
- Publication date Dec 1, 2011
- Toyota Jidosha Kabushiki Kaisha
- Yasushi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE USING A FLUXING UNDER...
- Publication number 20110065242
- Publication date Mar 17, 2011
- Chew B. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100276803
- Publication date Nov 4, 2010
- PANASONIC CORPORATION
- Takayuki Higuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER MATERIAL, METHOD FOR MANUFACTURING THE SAME, JOINED BODY, ME...
- Publication number 20100193801
- Publication date Aug 5, 2010
- TOYOTA JIDOSHA KABUSHIKI KAISHA
- Yasushi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20090246910
- Publication date Oct 1, 2009
- Fuji Electric Device Technology Co., LTD.
- Harutaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interface material and electronic assembly having such a th...
- Publication number 20030077478
- Publication date Apr 24, 2003
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Product using Zn-Al alloy solder
- Publication number 20020149114
- Publication date Oct 17, 2002
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Quinary Alloys

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead-free solder joining of electronic structures

Semiconductor device having first and second terminals

Lead-free solder joining of electronic structures

Method for soldering surface-mount component and surface-mount comp...

Electronic device including soldered surface-mount component

Mounting structure and BGA ball

Stud bump and package structure thereof and method of manufacturing...

Junction body, semiconductor module, and manufacturing method for j...

Solder material, method for manufacturing the same, joined body, me...

Method of fabricating a semiconductor package using a fluxing under...

Semiconductor device manufacturing method

Thermal interface material and electronic assembly having such a th...

Product using Zn-Al alloy solder

Semiconductor device, and manufacturing method of the same

Semiconductor device, and manufacturing method of the same

Aluminum alloy solder material, its manufacturing method, brazing s...

Patents Applicationslast 30 patents

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

SEMICONDUCTOR DEVICE

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

MOUNTING STRUCTURE AND BGA BALL

ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT

METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...

JUNCTION BODY, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR J...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE USING A FLUXING UNDER...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SOLDER MATERIAL, METHOD FOR MANUFACTURING THE SAME, JOINED BODY, ME...

Semiconductor device manufacturing method

Thermal interface material and electronic assembly having such a th...

Product using Zn-Al alloy solder