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H01L2224/05097

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05097Random arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Detection pad structure for analysis in a semiconductor device
- Patent number 12,072,374
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist collapse method for forming a physical unclonable function
- Patent number 9,190,360
- Issue date Nov 17, 2015
- GLOBALFOUNDRIES Inc.
- Kai D. Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad supporting structure and integrated circuit for crack s...
- Patent number 8,080,881
- Issue date Dec 20, 2011
- Vanguard International Semiconductor Corporation
- Sheng-Hsiung Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure having dummy plugs and/or patterns formed therea...
- Patent number 8,030,781
- Issue date Oct 4, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paths for transmitting an electrical signal through an e...
- Patent number 7,812,462
- Issue date Oct 12, 2010
- National Semiconductor Corporation
- Stephen Gee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for making the same that provide...
- Patent number 6,756,675
- Issue date Jun 29, 2004
- Seiko Epson Corporation
- Kazuo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for making the same that provide...
- Patent number 6,100,589
- Issue date Aug 8, 2000
- Seiko Epson Corporation
- Kazuo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE
- Publication number 20220326301
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180090458
- Publication date Mar 29, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES
- Publication number 20170271286
- Publication date Sep 21, 2017
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PAD SUPPORTING STRUCTURE AND INTEGRATED CIRCUIT
- Publication number 20100176515
- Publication date Jul 15, 2010
- Vanguard International Semiconductor Corporation
- Sheng-Hsiung TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PATHS FOR TRANSMITTING AN ELECTRICAL SIGNAL THROUGH AN E...
- Publication number 20100109167
- Publication date May 6, 2010
- National Semiconductor Corporation
- Stephen GEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...
- Publication number 20100072632
- Publication date Mar 25, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS

Random arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detection pad structure for analysis in a semiconductor device

Photoresist collapse method for forming a physical unclonable function

Contact pad supporting structure and integrated circuit for crack s...

Bond pad structure having dummy plugs and/or patterns formed therea...

Conductive paths for transmitting an electrical signal through an e...

Semiconductor device and a method for making the same that provide...

Semiconductor device and a method for making the same that provide...

Patents Applicationslast 30 patents

DISPLAY DEVICE

DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES

CONTACT PAD SUPPORTING STRUCTURE AND INTEGRATED CIRCUIT

CONDUCTIVE PATHS FOR TRANSMITTING AN ELECTRICAL SIGNAL THROUGH AN E...

BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...