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H01L2224/3016

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3016Random layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a recurrent neural network computer
- Patent number 11,489,012
- Issue date Nov 1, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Elisa Vianello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of automatic fluid dispensing for imprint lithography processes
- Patent number 9,223,202
- Issue date Dec 29, 2015
- Board of Regents, The University of Texas System
- Byung-Jin Choi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device with heat dissipation
- Patent number 8,581,390
- Issue date Nov 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/O pad structures for integrated circuit devices
- Patent number 7,898,088
- Issue date Mar 1, 2011
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using semiconductor chip
- Patent number 7,002,185
- Issue date Feb 21, 2006
- Rohm Co., Ltd.
- Shinji Isokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220278069
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION
- Publication number 20130264698
- Publication date Oct 10, 2013
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/O PAD STRUCTURES FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20090091016
- Publication date Apr 9, 2009
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Automatic Fluid Dispensing for Imprint Lithography Processes
- Publication number 20080199816
- Publication date Aug 21, 2008
- THE UNIVERSITY OF TEXAS BOARD OF REGENTS
- Byung J. Choi
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor device using semiconductor chip
- Publication number 20050242424
- Publication date Nov 3, 2005
- Rohm Co., Ltd.
- Shinji Isokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system of automatic fluid dispensing for imprint lithogr...
- Publication number 20020094496
- Publication date Jul 18, 2002
- Byung J. Choi
- B82 - NANO-TECHNOLOGY

Random layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure and formation method of chip package with protective lid

Method of producing a recurrent neural network computer

Method for transferring and placing a semiconductor device on a sub...

Bond materials with enhanced plasma resistant characteristics and a...

Method for producing structured sintered connection layers, and sem...

Methods of manufacturing a semiconductor device

Method of automatic fluid dispensing for imprint lithography processes

Semiconductor device with heat dissipation

I/O pad structures for integrated circuit devices

Semiconductor device using semiconductor chip

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH PROTECTIVE LID

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

Method for Producing Structured Sintered Connection Layers, and Sem...

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION

I/O PAD STRUCTURES FOR INTEGRATED CIRCUIT DEVICES

Method of Automatic Fluid Dispensing for Imprint Lithography Processes

Semiconductor device using semiconductor chip

Method and system of automatic fluid dispensing for imprint lithogr...