Rare earth metals

Industry

CPC
H01L2924/01105

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01105Rare earth metals

Industries

Patents Grantslast 30 patents

Information Patent Grant
Alkali silicate glass based coating and method for applying
- Patent number 9,565,758
- Issue date Feb 7, 2017
- Rockwell Collins, Inc.
- Nathan P. Lower
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component module
- Patent number 9,214,617
- Issue date Dec 15, 2015
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of sealing and contacting substrates using laser light and e...
- Patent number 9,171,822
- Issue date Oct 27, 2015
- Corelase Oy
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 9,117,550
- Issue date Aug 25, 2015
- Bao Q. Tran
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,082,708
- Issue date Jul 14, 2015
- Sumitomo Bakelite Co., Ltd.
- Shinichi Zenbutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, cured prod...
- Patent number 8,963,344
- Issue date Feb 24, 2015
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,927,341
- Issue date Jan 6, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting semiconductor element bonded to a base by a silver c...
- Patent number 8,836,130
- Issue date Sep 16, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic headlight, method for production of an optoelectroni...
- Patent number 8,814,406
- Issue date Aug 26, 2014
- Osram Opto Semiconductors GmbH
- Johannes Baur
- F21 - LIGHTING
Information Patent Grant
Light-emitting diode arrangement and method for producing the same
- Patent number 8,796,115
- Issue date Aug 5, 2014
- Osram Opto Semiconductors GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,766,420
- Issue date Jul 1, 2014
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,679,898
- Issue date Mar 25, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,642,392
- Issue date Feb 4, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive applications using alkali silicate glass for electronics
- Patent number 8,637,980
- Issue date Jan 28, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alkali silicate glass based coating and method for applying
- Patent number 8,617,913
- Issue date Dec 31, 2013
- Rockwell Collins, Inc.
- Nathan P. Lower
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,610,291
- Issue date Dec 17, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,585,937
- Issue date Nov 19, 2013
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold wire for semiconductor element connection
- Patent number 8,415,797
- Issue date Apr 9, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Processes for forming photovoltaic devices
- Patent number 8,294,024
- Issue date Oct 23, 2012
- E I du Pont de Nemours and Company
- William J. Borland
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic component module
- Patent number 8,273,993
- Issue date Sep 25, 2012
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic headlight, method for production of an optoelectroni...
- Patent number 8,267,561
- Issue date Sep 18, 2012
- Osram Opto Semiconductors GmbH
- Johannes Baur
- F21 - LIGHTING
Information Patent Grant
Light-emitting diode arrangement and method for producing the same
- Patent number 8,154,040
- Issue date Apr 10, 2012
- Osram Opto Semiconductors GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold alloy wire for ball bonding
- Patent number 8,147,750
- Issue date Apr 3, 2012
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for magnetically-directed, self-assembly of th...
- Patent number 8,138,868
- Issue date Mar 20, 2012
- University of Florida Research Foundation, Inc.
- David Patrick Arnold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and methods of manufacturing the same
- Patent number 8,129,840
- Issue date Mar 6, 2012
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,119,040
- Issue date Feb 21, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device bonding wire and wire bonding method
- Patent number 8,102,061
- Issue date Jan 24, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY
- Publication number 20150069588
- Publication date Mar 12, 2015
- National Institute of Aerospace Associates
- Jin Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150054146
- Publication date Feb 26, 2015
- SUMITOMO BAKELITE CO., LTD.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140141550
- Publication date May 22, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING
- Publication number 20140102776
- Publication date Apr 17, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...
- Publication number 20130070428
- Publication date Mar 21, 2013
- CORELASE OY
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
- Publication number 20130000709
- Publication date Jan 3, 2013
- E I DU PONT DE NEMOURS AND COMPANY NORTH CAROLINA STATE UNIVERSITY
- WILLIAM J. BORLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20120305304
- Publication date Dec 6, 2012
- TOSHIBA MATERIALS CO., LTD.
- Hiromasa KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
- Publication number 20120299175
- Publication date Nov 29, 2012
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Optoelectronic Headlight, Method for Production of an Optoelectroni...
- Publication number 20120301982
- Publication date Nov 29, 2012
- Johannes BAUR
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120292774
- Publication date Nov 22, 2012
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...
- Publication number 20120261807
- Publication date Oct 18, 2012
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Light-Emitting Diode Arrangement and Method for Producing the Same
- Publication number 20120190140
- Publication date Jul 26, 2012
- Osram Opto Semiconductors GmbH
- Jörg Erich SORG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120175761
- Publication date Jul 12, 2012
- Shinichi Zenbutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120168927
- Publication date Jul 5, 2012
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20120153486
- Publication date Jun 21, 2012
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS THICK FILM EMBEDDED PASSIVE MATERIAL
- Publication number 20120118623
- Publication date May 17, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR D...
- Publication number 20110151588
- Publication date Jun 23, 2011
- COOLEDGE LIGHTING, INC.
- Ian Ashdown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110089549
- Publication date Apr 21, 2011
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE
- Publication number 20110058979
- Publication date Mar 10, 2011
- TANAKA DENSHI KOGYO K.K.
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110039394
- Publication date Feb 17, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Daiki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20110011618
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AU ALLOY WIRE FOR BALL BONDING
- Publication number 20100314156
- Publication date Dec 16, 2010
- TANAKA DENSHI KOGYO K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
GOLD ALLOY WIRE FOR BALL BONDING
- Publication number 20100226816
- Publication date Sep 9, 2010
- TANAKA DENSHI KOGYO K.K.
- Mitsuo Takada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Rare earth metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alkali silicate glass based coating and method for applying

Bonding structure of bonding wire

Electronic component module

Method of sealing and contacting substrates using laser light and e...

Nano memory, light, energy, antenna and strand-based systems and me...

Bonding wire for semiconductor device

Semiconductor device

Semiconductor device and production method therefor

Epoxy resin composition for semiconductor encapsulation, cured prod...

Semiconductor device and production method therefor

Light emitting semiconductor element bonded to a base by a silver c...

Optoelectronic headlight, method for production of an optoelectroni...

Light-emitting diode arrangement and method for producing the same

Semiconductor device

Semiconductor device and production method therefor

Semiconductor device and production method therefor

Adhesive applications using alkali silicate glass for electronics

Alkali silicate glass based coating and method for applying

Copper alloy bonding wire for semiconductor device

Glass thick film embedded passive material

Gold wire for semiconductor element connection

Processes for forming photovoltaic devices

Electronic component module

Optoelectronic headlight, method for production of an optoelectroni...

Light-emitting diode arrangement and method for producing the same

Gold alloy wire for ball bonding

Method and structure for magnetically-directed, self-assembly of th...

Semiconductor package and methods of manufacturing the same

Glass thick film embedded passive material

Semiconductor device bonding wire and wire bonding method

Patents Applicationslast 30 patents

HYBRID LOW METAL LOADING FLUX

RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING

SEMICONDUCTOR DEVICE

METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...

PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS

ELECTRONIC COMPONENT MODULE

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Optoelectronic Headlight, Method for Production of an Optoelectroni...

SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...

Light-Emitting Diode Arrangement and Method for Producing the Same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

GLASS THICK FILM EMBEDDED PASSIVE MATERIAL

BONDING WIRE FOR SEMICONDUCTOR DEVICE

METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR D...

BONDING STRUCTURE OF BONDING WIRE

SEMICONDUCTOR DEVICE

BONDING WIRE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

AU ALLOY WIRE FOR BALL BONDING

GOLD ALLOY WIRE FOR BALL BONDING

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR