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CPC
B28D5/0023

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0023rectilinearly

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method
- Patent number 11,420,294
- Issue date Aug 23, 2022
- Disco Corporation
- Jingshi Chi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nitride semiconductor light-emitting element, method for manufactur...
- Patent number 11,309,688
- Issue date Apr 19, 2022
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Daisuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor light-emitting device and semic...
- Patent number 11,283,233
- Issue date Mar 22, 2022
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Hitoshi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of cleaving of buried defects
- Patent number 11,137,356
- Issue date Oct 5, 2021
- SELA SEMICONDUCTOR ENGINEERING LABORATORIES LTD.
- Vladimir Zheleznyak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for cleaving a liquid sample
- Patent number 11,119,012
- Issue date Sep 14, 2021
- IB Labs, Inc.
- Dimitry Boguslavsky
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for dividing workpiece
- Patent number 10,818,523
- Issue date Oct 27, 2020
- Disco Corporation
- Chris Mihai
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device and method for cleaving a substrate
- Patent number 10,773,420
- Issue date Sep 15, 2020
- LATTICEGEAR, LLC
- Gal Moyal
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Wafer group, wafer manufacturing device, and wafer manufacturing me...
- Patent number 10,319,807
- Issue date Jun 11, 2019
- Dowa Electronics Materials Co., Ltd.
- Shinya Shoji
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device and method for cleaving
- Patent number 10,065,340
- Issue date Sep 4, 2018
- LatticeGear, LLC
- Gal Moyal
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Capacitive clamping process for cleaving work pieces using crack pr...
- Patent number 9,718,215
- Issue date Aug 1, 2017
- Halo Industries, Inc.
- Andrew Bollman
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate cutting device and method
- Patent number 8,991,673
- Issue date Mar 31, 2015
- Soitec
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device and method for cutting off substrate of fragile material
- Patent number 8,276,796
- Issue date Oct 2, 2012
- Mitsuboshi Diamond Industrial Co., Ltd.
- Yuki Nishisaka
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate cutting device and method
- Patent number 8,083,115
- Issue date Dec 27, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device and method for cutting an assembly
- Patent number 7,892,946
- Issue date Feb 22, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Flat display panel and method of dividing the flat display panel
- Patent number 7,439,665
- Issue date Oct 21, 2008
- Mitsuboshi Diamond Industrial Co., Ltd.
- Haruo Wakayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate layer cutting device and method
- Patent number 7,406,994
- Issue date Aug 5, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device and method for cutting an assembly
- Patent number 7,232,738
- Issue date Jun 19, 2007
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate layer cutting device and method
- Patent number 7,189,304
- Issue date Mar 13, 2007
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate cutting device and method
- Patent number 7,182,234
- Issue date Feb 27, 2007
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer dividing method and apparatus
- Patent number 7,063,083
- Issue date Jun 20, 2006
- Disco Corporation
- Naoki Ohmiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate cleaving tool and method
- Patent number 6,554,046
- Issue date Apr 29, 2003
- Silicon Genesis Corporation
- Michael A. Bryan
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Nozzle for cleaving substrates
- Patent number 6,513,564
- Issue date Feb 4, 2003
- Silicon Genesis Corporation
- Michael A. Bryan
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor wafer cleaving method and apparatus
- Patent number 6,513,694
- Issue date Feb 4, 2003
- The Furukawa Electric Co., Ltd.
- Jie Xu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for producing semiconductor element
- Patent number 6,488,021
- Issue date Dec 3, 2002
- Matsushita Electronics Corporation
- Keiji Yamane
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for singulation of integrated circuit devices
- Patent number 6,475,878
- Issue date Nov 5, 2002
- Dusan Slepcevic
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Manufacturing method for monolithic ceramic part and cutting device...
- Patent number 6,374,820
- Issue date Apr 23, 2002
- Murata Manufacturing Co., Ltd.
- Yoshinori Sakamoto
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for handling laser bars
- Patent number 6,267,282
- Issue date Jul 31, 2001
- Agere Systems Optoelectronics Guardian Corp.
- Joseph Michael Freund
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Nozzle for cleaving substrates
- Patent number 6,263,941
- Issue date Jul 24, 2001
- Silicon Genesis Corporation
- Michael A. Bryan
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Anvil pad configuration for laser cleaving
- Patent number 6,247,625
- Issue date Jun 19, 2001
- Lucent Technologies, Inc.
- Utpal Kumar Chakrabarti
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for cleaving crystals
- Patent number 6,223,961
- Issue date May 1, 2001
- Sela Semiconductor Engineering
- Dmitri Boguslavsky
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
DIVIDING APPARATUS
- Publication number 20230278260
- Publication date Sep 7, 2023
- Disco Corporation
- Shinya ARUGA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20190160597
- Publication date May 30, 2019
- Disco Corporation
- Jingshi CHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEVICE AND METHOD FOR CLEAVING A SUBSTRATE
- Publication number 20190054658
- Publication date Feb 21, 2019
- LatticeGear, LLC
- Gal Moyal
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER GROUP, WAFER MANUFACTURING DEVICE, AND WAFER MANUFACTURING ME...
- Publication number 20180026092
- Publication date Jan 25, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Shinya SHOJI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEVICE AND METHOD FOR CLEAVING
- Publication number 20170087744
- Publication date Mar 30, 2017
- LatticeGear, LLC
- Gal Moyal
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Capacitive Clamping Process for Cleaving Work Pieces Using Crack Pr...
- Publication number 20160303764
- Publication date Oct 20, 2016
- Halo Industries, Inc.
- Andrew Bollman
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
SPLITTING APPARATUS
- Publication number 20140166716
- Publication date Jun 19, 2014
- GENESIS PHOTONICS INC.
- Tai-Cheng Tsai
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Device and Method for Cleaving.
- Publication number 20130119106
- Publication date May 16, 2013
- LatticeGear, LLC
- Gal Moyal
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER SPLITTING APPARATUS AND WAFER SPLITTING PROCESS
- Publication number 20120160227
- Publication date Jun 28, 2012
- LEXTAR ELECTRONICS CORP.
- Chien-Sen Weng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SUBSTRATE CUTTING DEVICE AND METHOD
- Publication number 20120048906
- Publication date Mar 1, 2012
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SCRIBING APPARATUS FOR THIN FILM SOLAR CELLS
- Publication number 20110179934
- Publication date Jul 28, 2011
- Masanobu SOYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL
- Publication number 20100065599
- Publication date Mar 18, 2010
- MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- Yuki Nishisaka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DEVICE AND METHOD FOR CUTTING AN ASSEMBLY
- Publication number 20070148915
- Publication date Jun 28, 2007
- S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES S.A.,
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SUBSTRATE LAYER CUTTING DEVICE AND METHOD
- Publication number 20070122926
- Publication date May 31, 2007
- S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SUBSTRATE CUTTING DEVICE AND METHOD
- Publication number 20070119893
- Publication date May 31, 2007
- S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Breaking device for separating ceramic printed circuit boards
- Publication number 20060261117
- Publication date Nov 23, 2006
- Josef Konrad
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wafer dividing method and apparatus
- Publication number 20060016443
- Publication date Jan 26, 2006
- DISCO CORPORATION
- Naoki Ohmiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and method for cutting an assembly
- Publication number 20050009297
- Publication date Jan 13, 2005
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Substrate cutting device and method
- Publication number 20050000649
- Publication date Jan 6, 2005
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Flat display panel and method of dividing the flat display panel
- Publication number 20040245913
- Publication date Dec 9, 2004
- Haruo Wakayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Substrate layer cutting device and method
- Publication number 20040144487
- Publication date Jul 29, 2004
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND APPARATUS FOR CLEAVING A SEMICONDUCTOR WAFER
- Publication number 20020026862
- Publication date Mar 7, 2002
- JULIUS R. NAVITSKY
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Nozzle for cleaving substrates
- Publication number 20020023725
- Publication date Feb 28, 2002
- Michael Bryan
- B28 - WORKING CEMENT, CLAY, OR STONE

rectilinearly

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer processing method

Nitride semiconductor light-emitting element, method for manufactur...

Method of fabricating semiconductor light-emitting device and semic...

System and method of cleaving of buried defects

Device and method for cleaving a liquid sample

Apparatus for dividing workpiece

Device and method for cleaving a substrate

Wafer group, wafer manufacturing device, and wafer manufacturing me...

Device and method for cleaving

Capacitive clamping process for cleaving work pieces using crack pr...

Substrate cutting device and method

Device and method for cutting off substrate of fragile material

Substrate cutting device and method

Device and method for cutting an assembly

Flat display panel and method of dividing the flat display panel

Substrate layer cutting device and method

Device and method for cutting an assembly

Substrate layer cutting device and method

Substrate cutting device and method

Wafer dividing method and apparatus

Substrate cleaving tool and method

Nozzle for cleaving substrates

Semiconductor wafer cleaving method and apparatus

Method and apparatus for producing semiconductor element

Method for singulation of integrated circuit devices

Manufacturing method for monolithic ceramic part and cutting device...

Method and apparatus for handling laser bars

Nozzle for cleaving substrates

Anvil pad configuration for laser cleaving

Apparatus for cleaving crystals

Patents Applicationslast 30 patents

DIVIDING APPARATUS

WAFER PROCESSING METHOD

DEVICE AND METHOD FOR CLEAVING A SUBSTRATE

WAFER GROUP, WAFER MANUFACTURING DEVICE, AND WAFER MANUFACTURING ME...

DEVICE AND METHOD FOR CLEAVING

Capacitive Clamping Process for Cleaving Work Pieces Using Crack Pr...

SPLITTING APPARATUS

Device and Method for Cleaving.

WAFER SPLITTING APPARATUS AND WAFER SPLITTING PROCESS

SUBSTRATE CUTTING DEVICE AND METHOD

SCRIBING APPARATUS FOR THIN FILM SOLAR CELLS

DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL

DEVICE AND METHOD FOR CUTTING AN ASSEMBLY

SUBSTRATE LAYER CUTTING DEVICE AND METHOD

SUBSTRATE CUTTING DEVICE AND METHOD

Breaking device for separating ceramic printed circuit boards

Wafer dividing method and apparatus

Device and method for cutting an assembly

Substrate cutting device and method

Flat display panel and method of dividing the flat display panel

Substrate layer cutting device and method

METHOD AND APPARATUS FOR CLEAVING A SEMICONDUCTOR WAFER

Nozzle for cleaving substrates