Redistribution layers [RDL] for bonding areas

Industry

CPC
H01L2224/023

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/023Redistribution layers [RDL] for bonding areas

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip stacking structures and methods for forming the same
- Patent number 12,166,012
- Issue date Dec 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 12,165,969
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,166,009
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,159,858
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit device with bonding stru...
- Patent number 12,159,831
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,874
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 12,154,876
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing three-dimensional integrated circuit struc...
- Patent number 12,136,619
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode module and display device having the same
- Patent number 12,136,616
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngki Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,131,986
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 12,132,021
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structure and method of manufacture
- Patent number 12,131,984
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for wafer scale chip package
- Patent number 12,125,811
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,125,768
- Issue date Oct 22, 2024
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,125,741
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for integrated circuit structure and forming the...
- Patent number 12,125,746
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforcement structures in a redistribution...
- Patent number 12,119,303
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS
- Publication number 20240413237
- Publication date Dec 12, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES
- Publication number 20240413105
- Publication date Dec 12, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...
- Publication number 20240413107
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Morio IWAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE
- Publication number 20240404954
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20240395748
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240395752
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Channels in Encapsulant...
- Publication number 20240395647
- Publication date Nov 28, 2024
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...
- Publication number 20240395674
- Publication date Nov 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF
- Publication number 20240395741
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20240395742
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYERS WITH ROUNDED CORNERS
- Publication number 20240387244
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Mingni CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...
- Publication number 20240387498
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing The Same
- Publication number 20240387196
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240387421
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Hyungsun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387359
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...
- Publication number 20240381605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240379567
- Publication date Nov 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
- Publication number 20240379593
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Redistribution layers [RDL] for bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabricating active-bridge-coupled GPU chiplets

Stacked semiconductor devices and methods of forming same

Method of fabricating redistribution circuit structure

Embedded metal insulator metal structure

Flip-chip stacking structures and methods for forming the same

Integrated circuit device and method

Semiconductor device packages and methods of manufacturing the same

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor package and method of fabricating the same

Method of manufacturing integrated circuit device with bonding stru...

Semiconductor device

Semiconductor interconnect structure and method

Semiconductor device and method having a through substrate via and...

Package structure and method of fabrcating the same

Semiconductor packages and methods of forming same

Integrated chip for standard logic performance improvement having a...

Integrated fan-out package and the methods of manufacturing

Methods of manufacturing three-dimensional integrated circuit struc...

Method of fabricating a semiconductor device

Light emitting diode module and display device having the same

Electronic apparatus including antennas and directors

Semiconductor package and manufacturing method thereof

Method for fabricating semiconductor package

Heterogeneous fan-out structure and method of manufacture

Semiconductor structure and method for wafer scale chip package

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Semiconductor package and method of fabricating semiconductor package

Passivation layer for integrated circuit structure and forming the...

Chip package structure with bump

Package structure with reinforcement structures in a redistribution...

Patents Applicationslast 30 patents

MIM Capacitor in IC Heterogenous Integration

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS

CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES

SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...

Multi-Die Package Structures Including Redistribution Layers

METHOD OF FORMING PACKAGE

Semiconductor Interconnect Structure and Method

BONDING STRUCTURE AND METHOD OF FORMING SAME

Semiconductor Device and Method of Forming Channels in Encapsulant...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...

METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

Chip Package Structure with Bump

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

PASSIVATION LAYERS WITH ROUNDED CORNERS

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...

Semiconductor Package and Method of Manufacturing The Same

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

REDUCTION OF CRACKS IN PASSIVATION LAYER

METHOD OF FORMING PACKAGE STRUCTURE