TREA

Redundant conductors or connections

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  • CPC
  • H05K2201/0979
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0979Redundant conductors or connections
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    NON-COPLANAR PARALLEL RESISTANCE-REDUCING CIRCUIT STRUCTURE
    • Publication number 20250126706
    • Publication date Apr 17, 2025
    • AAC MICROTECH (CHANGZHOU) CO., LTD.
    • Guohui Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND ELECTRONIC DEVICE
    • Publication number 20240292516
    • Publication date Aug 29, 2024
    • KYOCERA CORPORATION
    • Kouichirou SUGAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Conformal Wearable Battery
    • Publication number 20240224424
    • Publication date Jul 4, 2024
    • Inventus Power, Inc.
    • Paul John Kudrna
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIPLETS WITH CONNECTION POSTS
    • Publication number 20240170430
    • Publication date May 23, 2024
    • X Display Company Technology Limited
    • Carl Prevatte
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240008178
    • Publication date Jan 4, 2024
    • Nitto Denko Corporation
    • Shusaku SHIBATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT PACKAGE
    • Publication number 20230189437
    • Publication date Jun 15, 2023
    • ORPYX MEDICAL TECHNOLOGIES INC.
    • DAVID ALLAN VIBERG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Anti-Interference Circuit Board and Terminal
    • Publication number 20220117077
    • Publication date Apr 14, 2022
    • Huawei Technologies Co., Ltd
    • Dong Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD
    • Publication number 20220104354
    • Publication date Mar 31, 2022
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMMUNICATION MODULE
    • Publication number 20210298166
    • Publication date Sep 23, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Bo Hyun SEO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CIRCUIT PACKAGE
    • Publication number 20210251073
    • Publication date Aug 12, 2021
    • ORPYX MEDICAL TECHNOLOGIES INC.
    • DAVID ALLAN VIBERG
    • G01 - MEASURING TESTING
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20200281069
    • Publication date Sep 3, 2020
    • DENSO TEN LIMITED
    • Nobuhisa KATADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRU...
    • Publication number 20200267831
    • Publication date Aug 20, 2020
    • Murata Manufacturing Co., Ltd.
    • Hiromasa KOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRU...
    • Publication number 20200267832
    • Publication date Aug 20, 2020
    • Murata Manufacturing Co., Ltd.
    • Hiromasa KOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIPLETS WITH CONNECTION POSTS
    • Publication number 20200243467
    • Publication date Jul 30, 2020
    • X Display Company Technology Limited
    • Carl Prevatte
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CIRCUIT PACKAGE
    • Publication number 20200092991
    • Publication date Mar 19, 2020
    • ORPYX MEDICAL TECHNOLOGIES INC.
    • DAVID ALLAN VIBERG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING TH...
    • Publication number 20200044679
    • Publication date Feb 6, 2020
    • Samsung Electronics Co., Ltd.
    • Jinsu HEO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT SUBSTRATE
    • Publication number 20190394872
    • Publication date Dec 26, 2019
    • MITSUBISHI ELECTRIC CORPORATION
    • Norihiko AKASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20190373727
    • Publication date Dec 5, 2019
    • NGK Spark Plug Co., Ltd.
    • Takahiro HAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE, ELECTRONIC DEVICE, AND DESIGN SUPPORT METHOD OF SUBSTRATE
    • Publication number 20190229049
    • Publication date Jul 25, 2019
    • Fujitsu Limited
    • Takahito TAKEMOTO
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED CIRCUIT BOARD STRUCTURE
    • Publication number 20180332705
    • Publication date Nov 15, 2018
    • DENSO TEN LIMITED
    • Tamaki Kawabata
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER SIGNAL TRANSMISSION STRUCTURE AND DESIGN METHOD THEREOF
    • Publication number 20180302978
    • Publication date Oct 18, 2018
    • PEGATRON CORPORATION
    • Ching Ou Yang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    VEHICLE ACCESSORY CONTROL ARRANGEMENT
    • Publication number 20180065538
    • Publication date Mar 8, 2018
    • UUSI, LLC
    • David W. Shank
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20180005844
    • Publication date Jan 4, 2018
    • Shinko Electric Industries Co., Ltd.
    • Haruo Sorimachi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHARED RESISTOR PAD BYPASS
    • Publication number 20160270226
    • Publication date Sep 15, 2016
    • James Michael Parascandola
    • F21 - LIGHTING
  • Information Patent Application

    CONTACT ARRANGEMENT FOR A MULTI-LAYER CIRCUIT BOARD
    • Publication number 20160198563
    • Publication date Jul 7, 2016
    • Robert Bosch GMBH
    • Rainer Schaefer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRIC REDUNDANT CIRCUIT
    • Publication number 20150314880
    • Publication date Nov 5, 2015
    • ALENIA AERMACCHI S.p.A
    • Marco Francesco VERCELLESI
    • B64 - AIRCRAFT AVIATION COSMONAUTICS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    • Publication number 20140367152
    • Publication date Dec 18, 2014
    • Samsung Electro-Mechanics Co., Ltd.
    • Byoung Hwa LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR
    • Publication number 20140367154
    • Publication date Dec 18, 2014
    • Jun Muto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICES COMPRISING PRINTED CIRCUIT BOARDS
    • Publication number 20140355213
    • Publication date Dec 4, 2014
    • MAVEL S.R.L.
    • Davide BETTONI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20140332252
    • Publication date Nov 13, 2014
    • Unimicron Technology Corp.
    • Chun-Ting Lin
    • H01 - BASIC ELECTRIC ELEMENTS