Redundant conductors or connections

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CPC
H05K2201/0979

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0979Redundant conductors or connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-interference circuit board and terminal
- Patent number 11,903,122
- Issue date Feb 13, 2024
- Huawei Technologies Co., Ltd.
- Dong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout structure of a flexible circuit board
- Patent number 11,812,554
- Issue date Nov 7, 2023
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit package
- Patent number 11,659,657
- Issue date May 23, 2023
- ORPYX MEDICAL TECHNOLOGIES INC.
- David Allan Viberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chiplets with connection posts
- Patent number 11,552,034
- Issue date Jan 10, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,495,560
- Issue date Nov 8, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redundant trace fuse for a conformal wearable battery
- Patent number 11,477,885
- Issue date Oct 18, 2022
- Inventus Power, Inc.
- Michael M. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board and electronic device including th...
- Patent number 11,362,697
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Jinsu Heo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chiplets with connection posts
- Patent number 11,276,657
- Issue date Mar 15, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate, electronic component, and mounting stru...
- Patent number 11,259,401
- Issue date Feb 22, 2022
- Murata Manufacturing Co., Ltd.
- Hiromasa Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate, electronic component, and mounting stru...
- Patent number 11,224,119
- Issue date Jan 11, 2022
- Murata Manufacturing Co., Ltd.
- Hiromasa Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent conductor and display device including same
- Patent number 11,219,125
- Issue date Jan 4, 2022
- Samsung SDI Co., Ltd.
- Oh Hyeon Hwang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for providing an electrical connection and printed circuit b...
- Patent number 11,219,119
- Issue date Jan 4, 2022
- Advantest Corporation
- Sylvia Ehrler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication module
- Patent number 11,206,731
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Bo Hyun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of supplying electrical power from rigid printed circuit boa...
- Patent number 11,184,981
- Issue date Nov 23, 2021
- Adventive IP Bank
- Richard K Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 11,057,985
- Issue date Jul 6, 2021
- DENSO TEN Limited
- Nobuhisa Katada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit package
- Patent number 11,026,325
- Issue date Jun 1, 2021
- ORPYX MEDICAL TECHNOLOGIES INC.
- David Allan Viberg
- G01 - MEASURING TESTING
Information Patent Grant
High-frequency component
- Patent number 10,912,188
- Issue date Feb 2, 2021
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 10,905,008
- Issue date Jan 26, 2021
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit substrate
- Patent number 10,827,603
- Issue date Nov 3, 2020
- Mitsubishi Electric Corporation
- Norihiko Akashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate
- Patent number 10,820,426
- Issue date Oct 27, 2020
- Unimicron Technology Corp.
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, electronic device, and design support method of substrate
- Patent number 10,777,497
- Issue date Sep 15, 2020
- Fujitsu Limited
- Takahito Takemoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printable component structure with electrical contact
- Patent number 10,777,521
- Issue date Sep 15, 2020
- X Display Company Technology Limited
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement electrical connectors
- Patent number 10,741,945
- Issue date Aug 11, 2020
- FCI USA LLC
- Thomas Brungard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter circuit, multiplexer, and module
- Patent number 10,700,666
- Issue date Jun 30, 2020
- Taiyo Yuden Co., Ltd.
- Sachiko Tanaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flexible circuit structures including connection arrangement connec...
- Patent number 10,681,805
- Issue date Jun 9, 2020
- KARDIUM INC.
- Daniel Robert Weinkam
- G01 - MEASURING TESTING
Information Patent Grant
Illuminated display
- Patent number 10,665,153
- Issue date May 26, 2020
- LIGHTNTEC GMBH & CO. KG
- Manuel Huebner
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printed circuit board structure
- Patent number 10,638,605
- Issue date Apr 28, 2020
- DENSO TEN Limited
- Tamaki Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with at least one integrated precision resistor
- Patent number 10,627,429
- Issue date Apr 21, 2020
- JUMATECH GMBH
- Markus Wölfel
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20240292516
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Kouichirou SUGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Wearable Battery
- Publication number 20240224424
- Publication date Jul 4, 2024
- Inventus Power, Inc.
- Paul John Kudrna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240008178
- Publication date Jan 4, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT PACKAGE
- Publication number 20230189437
- Publication date Jun 15, 2023
- ORPYX MEDICAL TECHNOLOGIES INC.
- DAVID ALLAN VIBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anti-Interference Circuit Board and Terminal
- Publication number 20220117077
- Publication date Apr 14, 2022
- Huawei Technologies Co., Ltd
- Dong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD
- Publication number 20220104354
- Publication date Mar 31, 2022
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION MODULE
- Publication number 20210298166
- Publication date Sep 23, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Bo Hyun SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT PACKAGE
- Publication number 20210251073
- Publication date Aug 12, 2021
- ORPYX MEDICAL TECHNOLOGIES INC.
- DAVID ALLAN VIBERG
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20200281069
- Publication date Sep 3, 2020
- DENSO TEN LIMITED
- Nobuhisa KATADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRU...
- Publication number 20200267831
- Publication date Aug 20, 2020
- Murata Manufacturing Co., Ltd.
- Hiromasa KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRU...
- Publication number 20200267832
- Publication date Aug 20, 2020
- Murata Manufacturing Co., Ltd.
- Hiromasa KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20200243467
- Publication date Jul 30, 2020
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT PACKAGE
- Publication number 20200092991
- Publication date Mar 19, 2020
- ORPYX MEDICAL TECHNOLOGIES INC.
- DAVID ALLAN VIBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING TH...
- Publication number 20200044679
- Publication date Feb 6, 2020
- Samsung Electronics Co., Ltd.
- Jinsu HEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT SUBSTRATE
- Publication number 20190394872
- Publication date Dec 26, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Norihiko AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20190373727
- Publication date Dec 5, 2019
- NGK Spark Plug Co., Ltd.
- Takahiro HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, ELECTRONIC DEVICE, AND DESIGN SUPPORT METHOD OF SUBSTRATE
- Publication number 20190229049
- Publication date Jul 25, 2019
- Fujitsu Limited
- Takahito TAKEMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE
- Publication number 20180332705
- Publication date Nov 15, 2018
- DENSO TEN LIMITED
- Tamaki Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SIGNAL TRANSMISSION STRUCTURE AND DESIGN METHOD THEREOF
- Publication number 20180302978
- Publication date Oct 18, 2018
- PEGATRON CORPORATION
- Ching Ou Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICLE ACCESSORY CONTROL ARRANGEMENT
- Publication number 20180065538
- Publication date Mar 8, 2018
- UUSI, LLC
- David W. Shank
- B60 - VEHICLES IN GENERAL
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20180005844
- Publication date Jan 4, 2018
- Shinko Electric Industries Co., Ltd.
- Haruo Sorimachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHARED RESISTOR PAD BYPASS
- Publication number 20160270226
- Publication date Sep 15, 2016
- James Michael Parascandola
- F21 - LIGHTING
Information Patent Application
CONTACT ARRANGEMENT FOR A MULTI-LAYER CIRCUIT BOARD
- Publication number 20160198563
- Publication date Jul 7, 2016
- Robert Bosch GMBH
- Rainer Schaefer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC REDUNDANT CIRCUIT
- Publication number 20150314880
- Publication date Nov 5, 2015
- ALENIA AERMACCHI S.p.A
- Marco Francesco VERCELLESI
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20140367152
- Publication date Dec 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Hwa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR
- Publication number 20140367154
- Publication date Dec 18, 2014
- Jun Muto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES COMPRISING PRINTED CIRCUIT BOARDS
- Publication number 20140355213
- Publication date Dec 4, 2014
- MAVEL S.R.L.
- Davide BETTONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140332252
- Publication date Nov 13, 2014
- Unimicron Technology Corp.
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL AND MECHANICAL INTERCONNECTION FOR ELECTRONIC COMPONENTS
- Publication number 20140321075
- Publication date Oct 30, 2014
- Apple Inc.
- Kuo-Hua SUNG
- H01 - BASIC ELECTRIC ELEMENTS

Redundant conductors or connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chiplets with connection posts

Anti-interference circuit board and terminal

Layout structure of a flexible circuit board

Printed circuit boards with plated blind slots for improved vertica...

Flexible circuit package

Chiplets with connection posts

Chiplets with connection posts

Redundant trace fuse for a conformal wearable battery

Multilayer printed circuit board and electronic device including th...

Chiplets with connection posts

Resin multilayer substrate, electronic component, and mounting stru...

Resin multilayer substrate, electronic component, and mounting stru...

Transparent conductor and display device including same

Method for providing an electrical connection and printed circuit b...

Communication module

Method of supplying electrical power from rigid printed circuit boa...

Printed wiring board

Flexible circuit package

High-frequency component

Wiring board

Printed circuit substrate

Carrier substrate

Substrate, electronic device, and design support method of substrate

Printable component structure with electrical contact

Replacement electrical connectors

Filter circuit, multiplexer, and module

Flexible circuit structures including connection arrangement connec...

Illuminated display

Printed circuit board structure

Printed circuit board with at least one integrated precision resistor

Patents Applicationslast 30 patents

WIRING BOARD AND ELECTRONIC DEVICE

Conformal Wearable Battery

CHIPLETS WITH CONNECTION POSTS

WIRING CIRCUIT BOARD

FLEXIBLE CIRCUIT PACKAGE

Anti-Interference Circuit Board and Terminal

LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD

COMMUNICATION MODULE

FLEXIBLE CIRCUIT PACKAGE

PRINTED WIRING BOARD

RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRU...

RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRU...

CHIPLETS WITH CONNECTION POSTS

FLEXIBLE CIRCUIT PACKAGE

MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING TH...

PRINTED CIRCUIT SUBSTRATE

WIRING BOARD

SUBSTRATE, ELECTRONIC DEVICE, AND DESIGN SUPPORT METHOD OF SUBSTRATE

PRINTED CIRCUIT BOARD STRUCTURE

POWER SIGNAL TRANSMISSION STRUCTURE AND DESIGN METHOD THEREOF

VEHICLE ACCESSORY CONTROL ARRANGEMENT

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SHARED RESISTOR PAD BYPASS

CONTACT ARRANGEMENT FOR A MULTI-LAYER CIRCUIT BOARD

ELECTRIC REDUNDANT CIRCUIT

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR

ELECTRONIC DEVICES COMPRISING PRINTED CIRCUIT BOARDS

CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF

ELECTRICAL AND MECHANICAL INTERCONNECTION FOR ELECTRONIC COMPONENTS