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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/81815
Reflow soldering
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Patents Grants
last 30 patents
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Patent Grant
Integrated circuit package and method
Patent number
11,984,372
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Teng-Yuan Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with a barrier layer
Patent number
11,984,419
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device multilevel package substrate for improved electro...
Patent number
11,978,699
Issue date
May 7, 2024
Texas Instruments Incorporated
Sylvester Ankamah-Kusi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder ball application for singular die
Patent number
11,978,711
Issue date
May 7, 2024
Global Circuit Innovations Incorporated
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing substrate structure with filling material f...
Patent number
11,973,014
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chang-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for transferring electronic device
Patent number
11,973,054
Issue date
Apr 30, 2024
Stroke Precision Advanced Engineering Co., Ltd.
Yu-Min Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
Patent number
11,955,346
Issue date
Apr 9, 2024
Micron Technology, Inc.
Shijian Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advanced info POP and method of forming thereof
Patent number
11,955,460
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Da Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stencil printing flux for attaching light emitting diodes
Patent number
11,949,053
Issue date
Apr 2, 2024
Lumileds LLC
Chee-Jong Loh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with transmissive layer and manufacturing meth...
Patent number
11,942,581
Issue date
Mar 26, 2024
Amkor Technology Singapore Holding Pte Ltd.
David Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a redistribution layer
Patent number
11,935,856
Issue date
Mar 19, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser reflow apparatus and laser reflow method
Patent number
11,935,863
Issue date
Mar 19, 2024
Disco Corporation
Satoshi Kobayashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip package assembly
Patent number
11,929,308
Issue date
Mar 12, 2024
Texas Instruments Incorporated
Steffany Ann Lacierda Moreno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,929,316
Issue date
Mar 12, 2024
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for packing optimization of semiconductor devices
Patent number
11,916,033
Issue date
Feb 27, 2024
Amkor Technology Singapore Holding Pte Ltd.
Glenn Rinne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for repairing a light-emitting device and a method for manuf...
Patent number
11,916,041
Issue date
Feb 27, 2024
ASTI GLOBAL INC., TAIWAN
Chien-Shou Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device interconnection systems and methods
Patent number
11,916,039
Issue date
Feb 27, 2024
Teledyne FLIR Commercial Systems, Inc.
Richard E. Bornfreund
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
Patent number
11,908,820
Issue date
Feb 20, 2024
Intel Corporation
Chandramouleeswaran Subramani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,901,277
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Ting Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,901,279
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Ting Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with routing patch and conductive interconnec...
Patent number
11,901,335
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with integrated heat distribution and manufact...
Patent number
11,901,343
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a chip-card module with soldered electron...
Patent number
11,894,295
Issue date
Feb 6, 2024
Linxens Holding
Christophe Mathieu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
Patent number
11,894,330
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temperature hierarchy solder bonding
Patent number
11,887,956
Issue date
Jan 30, 2024
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-sided partial molded SIP module
Patent number
11,887,863
Issue date
Jan 30, 2024
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
Publication number
20240162163
Publication date
May 16, 2024
TEXAS INSTRUMENTS INCORPORATED
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Double-Sided Partial Molded SiP Module
Publication number
20240153783
Publication date
May 9, 2024
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
Publication number
20240145368
Publication date
May 2, 2024
Intel Corporation
Jackson Chung Peng KONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145418
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Junghoo Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
Publication number
20240145420
Publication date
May 2, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
Publication number
20240131633
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Hidefumi YASUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
Publication number
20240136322
Publication date
Apr 25, 2024
LG Innotek Co., Ltd.
Tae Sup CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
Publication number
20240128185
Publication date
Apr 18, 2024
PANJIT INTERNATIONAL INC.
Chung Hsiung Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
Publication number
20240128230
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Sinyeop LEE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
Publication number
20240113069
Publication date
Apr 4, 2024
NXP USA, Inc.
Kabir Mirpuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240113089
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tian Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...
Publication number
20240105671
Publication date
Mar 28, 2024
Stroke Precision Advanced Engineering Co., Ltd.
Chien-Shou Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
Publication number
20240096771
Publication date
Mar 21, 2024
TEXAS INSTRUMENTS INCORPORATED
Osvaldo Lopez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240096777
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Jaesun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING
Publication number
20240079358
Publication date
Mar 7, 2024
Micron Technology, Inc.
Siva Sai Kishore Palli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS
Publication number
20240079306
Publication date
Mar 7, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
Publication number
20240079371
Publication date
Mar 7, 2024
GLOBALFOUNDRIES U.S. Inc.
John C. MALINOWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES
Publication number
20240071933
Publication date
Feb 29, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240071952
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chiang Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
Publication number
20240071981
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
Publication number
20240072008
Publication date
Feb 29, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jinchang ZHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
Publication number
20240072032
Publication date
Feb 29, 2024
QUALCOMM Incorporated
Yanmei SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20240071973
Publication date
Feb 29, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
Publication number
20240071974
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20240071990
Publication date
Feb 29, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING DISPLAY PANEL
Publication number
20240072027
Publication date
Feb 29, 2024
SAMSUNG DISPLAY CO., LTD.
Jeong Won HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240063208
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-Yen Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Structure with Warpage Tuning Layer
Publication number
20240063083
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chieh-Lung Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CRACK ARREST FEATURES FOR MIULTILEVEL PACKAGE SUBSTRATE
Publication number
20240063107
Publication date
Feb 22, 2024
TEXAS INSTRUMENTS INCORPORATED
Jason Colte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER
Publication number
20240055376
Publication date
Feb 15, 2024
INFINEON TECHNOLOGIES AG
Michael Stadler
H01 - BASIC ELECTRIC ELEMENTS