Reflowing of solder coated conductors, not during connection of components

Industry

CPC
H05K2203/043

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/043Reflowing of solder coated conductors, not during connection of components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder balls metallised on the surface and calibrated for...
- Patent number 12,030,138
- Issue date Jul 9, 2024
- LIPCO INDUSTRIE
- Constantin Iacob
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow furnace
- Patent number 12,013,185
- Issue date Jun 18, 2024
- Illinois Tool Works Inc.
- Yuwei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 12,016,127
- Issue date Jun 18, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 12,010,794
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature selection through solder-ball population
- Patent number 11,948,807
- Issue date Apr 2, 2024
- International Business Machines Corporation
- Matthew Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering printed circuits using radiant heat
- Patent number 11,903,143
- Issue date Feb 13, 2024
- Microsoft Technology Licensing, LLC
- David Christopher Perna
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition for use in solder joints of printed circuit boards
- Patent number 11,832,386
- Issue date Nov 28, 2023
- Dell Products L.P.
- Deeder M. Aurongzeb
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Applying a solderable surface to conductive ink
- Patent number 11,805,603
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,751,369
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,596,072
- Issue date Feb 28, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized rework using liquid media soldering
- Patent number 11,445,650
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,310,950
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board interconnection and methods
- Patent number 11,304,308
- Issue date Apr 12, 2022
- Metrospec Technology, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,278,977
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation of solder bump for compatibility with printed electroni...
- Patent number 11,122,692
- Issue date Sep 14, 2021
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board having thermal through...
- Patent number 11,116,071
- Issue date Sep 7, 2021
- ZKW GROUP GMBH
- Erik Edlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 11,089,685
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating filling a plated through-hole of a circuit board with...
- Patent number 11,051,407
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Attaching an SMD to an insulating layer with a solder joint in a ca...
- Patent number 10,959,338
- Issue date Mar 23, 2021
- Safran Electronics & Defense
- Denis Lecordier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repairing defective through-holes
- Patent number 10,952,330
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
State detecting device
- Patent number 10,905,011
- Issue date Jan 26, 2021
- TDK Corporation
- Masafumi Kami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recondition process for BGA using flux
- Patent number 10,881,007
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Tim A. Bartsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux, solder paste, and method for forming solder bump
- Patent number 10,836,000
- Issue date Nov 17, 2020
- Tamura Corporation
- Masanori Shibasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250063665
- Publication date Feb 20, 2025
- TDK Corporation
- Yukari WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW FURNACE
- Publication number 20240344771
- Publication date Oct 17, 2024
- Illinois Tool Works Inc.
- Yuwei WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sulfide Solid-State Battery, Printed Circuit Board with Sulfide Sol...
- Publication number 20240120552
- Publication date Apr 11, 2024
- Toyota Jidosha Kabushiki Kaisha
- Shinji NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
- Publication number 20240057266
- Publication date Feb 15, 2024
- International Business Machines Corporation
- MARK K. HOFFMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLING METHOD OF ELECTRONIC MODULE
- Publication number 20230413450
- Publication date Dec 21, 2023
- Delta Electronics, Inc.
- Kun Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20230371221
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PANEL AESA WITH THERMAL MANAGEMENT
- Publication number 20230345616
- Publication date Oct 26, 2023
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING PRINTED CIRCUITS USING RADIANT HEAT
- Publication number 20230199971
- Publication date Jun 22, 2023
- Microsoft Technology Licensing, LLC
- David Christopher PERNA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS,...
- Publication number 20230038219
- Publication date Feb 9, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kyoka Susuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR...
- Publication number 20220339742
- Publication date Oct 27, 2022
- LIFCO INDUSTRIE
- Constantin IACOB
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEATURE SELECTION THROUGH SOLDER-BALL POPULATION
- Publication number 20220319867
- Publication date Oct 6, 2022
- International Business Machines Corporation
- Matthew Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20220232746
- Publication date Jul 21, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20220117087
- Publication date Apr 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Positioning and Fixing Structure
- Publication number 20210398886
- Publication date Dec 23, 2021
- Hitachi Astemo, Ltd.
- Binti Haridan FATIN FARHANAH
- G01 - MEASURING TESTING
Information Patent Application
PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONI...
- Publication number 20210400820
- Publication date Dec 23, 2021
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOCALIZED REWORK USING LIQUID MEDIA SOLDERING
- Publication number 20210120712
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20210120713
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
- Publication number 20200404795
- Publication date Dec 24, 2020
- International Business Machines Corporation
- MARK K. HOFFMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20200337152
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIRING DEFECTIVE THROUGH-HOLES
- Publication number 20200245469
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATTACHING AN SMD TO AN INSULATING LAYER WITH A SOLDER JOINT IN A CA...
- Publication number 20200214142
- Publication date Jul 2, 2020
- SAFRAN ELECTRONICS & DEFENSE
- Denis LECORDIER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FACILITATING FILLING A PLATED THROUGH-HOLE OF A CIRCUIT BOARD WITH...
- Publication number 20200128676
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STATE DETECTING DEVICE
- Publication number 20200100363
- Publication date Mar 26, 2020
- TDK Corporation
- Masafumi KAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20200093007
- Publication date Mar 19, 2020
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX, SOLDER PASTE, AND METHOD FOR FORMING SOLDER BUMP
- Publication number 20190084097
- Publication date Mar 21, 2019
- TAMURA CORPORATION
- Masanori SHIBASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20190029124
- Publication date Jan 24, 2019
- Samwon Act Co., Ltd
- Kyung Yul LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Circuit With Sensor Printed In Situ
- Publication number 20180249583
- Publication date Aug 30, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Randy L. Yach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY
- Publication number 20180182697
- Publication date Jun 28, 2018
- Intel Corporation
- Daewoong SUH
- H01 - BASIC ELECTRIC ELEMENTS

Reflowing of solder coated conductors, not during connection of components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package positioning and fixing structure

Stackable via package and method

Composite solder balls metallised on the surface and calibrated for...

Reflow furnace

Liquid metal infiltration rework of electronic assembly

Printed wiring board and method for manufacturing the same

Electrical devices with electrodes on softening polymers and method...

Feature selection through solder-ball population

Low cost panel AESA with thermal management

Soldering printed circuits using radiant heat

Solder composition for use in solder joints of printed circuit boards

Applying a solderable surface to conductive ink

Liquid metal infiltration rework of electronic assembly

Stackable via package and method

Electrical devices with electrodes on softening polymers and method...

Localized rework using liquid media soldering

Liquid metal infiltration rework of electronic assembly

Flexible circuit board interconnection and methods

Circuit board

Liquid metal infiltration rework of electronic assembly

Preparation of solder bump for compatibility with printed electroni...

Method for producing a printed circuit board having thermal through...

Stackable via package and method

Facilitating filling a plated through-hole of a circuit board with...

Attaching an SMD to an insulating layer with a solder joint in a ca...

Repairing defective through-holes

Lead free solder columns and methods for making same

State detecting device

Recondition process for BGA using flux

Flux, solder paste, and method for forming solder bump

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

REFLOW FURNACE

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

Sulfide Solid-State Battery, Printed Circuit Board with Sulfide Sol...

APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK

ASSEMBLING METHOD OF ELECTRONIC MODULE

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

STACKABLE VIA PACKAGE AND METHOD

LOW COST PANEL AESA WITH THERMAL MANAGEMENT

SOLDERING PRINTED CIRCUITS USING RADIANT HEAT

TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS,...

COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR...

FEATURE SELECTION THROUGH SOLDER-BALL POPULATION

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

STACKABLE VIA PACKAGE AND METHOD

Chip Package Positioning and Fixing Structure

PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONI...

LOCALIZED REWORK USING LIQUID MEDIA SOLDERING

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK

STACKABLE VIA PACKAGE AND METHOD

REPAIRING DEFECTIVE THROUGH-HOLES

ATTACHING AN SMD TO AN INSULATING LAYER WITH A SOLDER JOINT IN A CA...

FACILITATING FILLING A PLATED THROUGH-HOLE OF A CIRCUIT BOARD WITH...

STATE DETECTING DEVICE

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

FLUX, SOLDER PASTE, AND METHOD FOR FORMING SOLDER BUMP

CIRCUIT BOARD

Integrated Circuit With Sensor Printed In Situ

FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY