Refractory-metal alloys

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H01L23/53261

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53261Refractory-metal alloys

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Tungsten molybdenum structures
- Patent number 12,159,804
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten alloys in semiconductor devices
- Patent number 12,080,648
- Issue date Sep 3, 2024
- Intel Corporation
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor memory device having stacked shifted axis ch...
- Patent number 12,082,413
- Issue date Sep 3, 2024
- Kioxia Corporation
- Toshiyuki Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with air gap below landing pad and method for...
- Patent number 12,051,648
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Tsung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,963,357
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with doped via plug
- Patent number 11,908,740
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Po Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gap below landing pad and method for...
- Patent number 11,894,304
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Tsung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 11,749,608
- Issue date Sep 5, 2023
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal configuration and semiconductor device
- Patent number 11,705,399
- Issue date Jul 18, 2023
- Rohm Co., Ltd.
- Hideaki Yanagida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,688,684
- Issue date Jun 27, 2023
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Hyunyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having graphene-containing-structures
- Patent number 11,682,623
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite landing pad
- Patent number 11,587,876
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,563,028
- Issue date Jan 24, 2023
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts and interconnect structures in field-effect transistors
- Patent number 11,532,510
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with doped via plug
- Patent number 11,515,206
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Po Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free high aspect ratio metal alloy interconnects and method of...
- Patent number 11,443,983
- Issue date Sep 13, 2022
- Intel Corporation
- Shaestagir Chowdhury
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Terminal configuration and semiconductor device
- Patent number 11,404,375
- Issue date Aug 2, 2022
- Rohm Co., Ltd.
- Hideaki Yanagida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,328,993
- Issue date May 10, 2022
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single process for liner and metal fill
- Patent number 11,322,359
- Issue date May 3, 2022
- ELPIS TECHNOLOGIES INC.
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a homogeneous bottom electrode via (BEVA) top su...
- Patent number 11,315,861
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsia-Wei Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of designing a layout, method of making a semiconductor stru...
- Patent number 11,309,268
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Footing flare pedestal structure
- Patent number 11,302,639
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite landing pad for metal plug
- Patent number 11,282,790
- Issue date Mar 22, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 11,261,083
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,257,752
- Issue date Feb 22, 2022
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Hyunyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization
- Patent number 11,244,897
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten alloys in semiconductor devices
- Patent number 11,195,798
- Issue date Dec 7, 2021
- Intel Corporation
- Yang Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for use in harsh media
- Patent number 11,049,784
- Issue date Jun 29, 2021
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20250038051
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413083
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240381648
- Publication date Nov 14, 2024
- KIOXIA Corporation
- Toshiyuki SASAKI
- B24 - GRINDING POLISHING
Information Patent Application
FILTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20240379650
- Publication date Nov 14, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS
- Publication number 20240113027
- Publication date Apr 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP BELOW LANDING PAD AND METHOD FOR...
- Publication number 20240006321
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIH-TSUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...
- Publication number 20230411299
- Publication date Dec 21, 2023
- Lodestar Licensing Group, LLC
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...
- Publication number 20230369111
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230343702
- Publication date Oct 26, 2023
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230317608
- Publication date Oct 5, 2023
- Rohm Co., Ltd.
- Hideaki YANAGIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Graphene-Containing-Structures
- Publication number 20230307367
- Publication date Sep 28, 2023
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20230290679
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230122331
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- KOHJI KANAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH DOPED VIA PLUG
- Publication number 20230093608
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Po HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Graphene-Containing-Structures
- Publication number 20230015046
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP BELOW LANDING PAD AND METHOD FOR...
- Publication number 20230014071
- Publication date Jan 19, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-TSUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20220415825
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220328407
- Publication date Oct 13, 2022
- Rohm Co., Ltd.
- Hideaki YANAGIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING WIRING STRUCTURE
- Publication number 20220262738
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- Jangeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20220238451
- Publication date Jul 28, 2022
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220139827
- Publication date May 5, 2022
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- HYUNYOUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220122915
- Publication date Apr 21, 2022
- UNITED MICROELECTRONICS CORP.
- Yen-Tsai Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COMPOSITE LANDING PAD
- Publication number 20220108952
- Publication date Apr 7, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS
- Publication number 20220102209
- Publication date Mar 31, 2022
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE LANDING PAD FOR METAL PLUG
- Publication number 20220077061
- Publication date Mar 10, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN ALLOYS IN SEMICONDUCTOR DEVICES
- Publication number 20220059467
- Publication date Feb 24, 2022
- Intel Corporation
- Yang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION
- Publication number 20210313264
- Publication date Oct 7, 2021
- International Business Machines Corporation
- CHANRO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210296358
- Publication date Sep 23, 2021
- Samsung Electronics Co., Ltd.
- KOHJI KANAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210237293
- Publication date Aug 5, 2021
- KIOXIA Corporation
- Toshiyuki SASAKI
- G11 - INFORMATION STORAGE

Refractory-metal alloys

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tungsten molybdenum structures

Tungsten alloys in semiconductor devices

Vertical semiconductor memory device having stacked shifted axis ch...

Semiconductor device with air gap below landing pad and method for...

Nonvolatile memory device and method for fabricating the same

Semiconductor structure with doped via plug

Semiconductor device with air gap below landing pad and method for...

Cobalt based interconnects and methods of fabrication thereof

Semiconductor structure including buffer layer

Device packages including redistribution layers with carbon-based c...

Terminal configuration and semiconductor device

Semiconductor structure and method for fabricating the same

Integrated assemblies having graphene-containing-structures

Method for preparing semiconductor device with composite landing pad

Nonvolatile memory device and method for fabricating the same

Contacts and interconnect structures in field-effect transistors

Semiconductor structure with doped via plug

Void-free high aspect ratio metal alloy interconnects and method of...

Terminal configuration and semiconductor device

Cobalt based interconnects and methods of fabrication thereof

Single process for liner and metal fill

Method for forming a homogeneous bottom electrode via (BEVA) top su...

Method of designing a layout, method of making a semiconductor stru...

Footing flare pedestal structure

Semiconductor device with composite landing pad for metal plug

Fence structure to prevent stiction in a MEMS motion sensor

Semiconductor structure and method for fabricating the same

Back end of line metallization

Tungsten alloys in semiconductor devices

Semiconductor device for use in harsh media

Patents Applicationslast 30 patents

TUNGSTEN MOLYBDENUM STRUCTURES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

FILTER AND MANUFACTURING METHOD THEREFOR

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS

SEMICONDUCTOR DEVICE WITH AIR GAP BELOW LANDING PAD AND METHOD FOR...

DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...

INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE

Integrated Assemblies Having Graphene-Containing-Structures

TUNGSTEN MOLYBDENUM STRUCTURES

NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE WITH DOPED VIA PLUG

Integrated Assemblies Having Graphene-Containing-Structures

SEMICONDUCTOR DEVICE WITH AIR GAP BELOW LANDING PAD AND METHOD FOR...

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT CHIP INCLUDING WIRING STRUCTURE

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COMPOSITE LANDING PAD

ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS

SEMICONDUCTOR DEVICE WITH COMPOSITE LANDING PAD FOR METAL PLUG

TUNGSTEN ALLOYS IN SEMICONDUCTOR DEVICES

BACK END OF LINE METALLIZATION

NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME