Patent Application
20230047768
The subject matter herein generally relates to printed circuit boards, and more particularly, to a circuit board including fine wiring and a method for manufacturing the circuit board.
Electronic devices, such as mobile phones, tablet computers, or personal digital assistants, usually have circuit boards. Component density in such electronic devices is always increasing, but the traces of the wiring layer of the circuit board must also become slimmer. Such circuit board may be manufactured by a subtractive or semi-additive method.
The subtractive method includes steps of electroplating copper on a copper substrate, and etching the electroplated copper and a copper foil of the copper substrate through an exposure and development process to obtain desired wiring patterns. However, the copper wirings applying this subtractive process have undercut during the etching, especially when the wiring patterns need narrow lines width and line space. In addition, the etching process causes a waste of copper, which is toxic.
The semi-additive method includes steps of covering a dry film on the copper substrate, electroplating copper in opening of the dry film, and then etching a portion of the copper foil exposed from the electroplated copper. Although the semi-additive method can avoid the undercut in the copper wirings, the copper electroplating process may also cause pollution in the environment.
Improvement in the art is desired.
Implementations of the present technology will now be described, by way of embodiment, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
The present disclosure provides a method for manufacturing a circuit board. The method can be used to manufacture a double-sided circuit board and a multilayer circuit board. Referring to
In block 101, referring to
In an embodiment, the base layer 10 is made of an insulating resin, such as epoxy resin, polypropylene (PP), BT resin, and polyphenylene oxide (PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).
The first through hole 11 may be formed by punching or laser drilling.
In block 102, referring to
Referring to
In block 103, referring to
In an embodiment, a first photomask 30 covers each first photosensitive resin layer 20. The first photomask 30 has first openings 31 corresponding to the first portion 21. That is, the first portion 21 is exposed from the first photomask 30. The second portion 22 is covered by the first photomask 30. Therefore, when light is emitted toward the first photosensitive resin layer 20, compositions in the first portion 21 are polymerized under the light, causing solidification of the first portion 21. Compositions in the second portion 22 are not polymerized since the second portion 22 is not irradiated by the light (that is, the second portion 22 remains unsolidified).
In block 104, referring to
The second portion 22 may be removed by an alkaline developing solution. The developing solution can include 1% of NaCO3 by amount. The second portion 22 at least is immersed in the developing solution. Since the second portion 22 is not treated by the exposure process, the second portion 22 can react with the developing solution and be removed. The silver particles in the removed second portion 22 can be recycled and reused, saving the costs of raw material.
The first bottom wiring 40 also infills the first through hole 11 to form a first conductive block 41. The first bottom wiring 40 includes a photosensitive resin and the silver particles disposed in the photosensitive resin. The silver particles are electrically conductive, that is, the silver particles render the first conductive block 41 to be electrically conductive.
In other embodiments, the first bottom wiring 40 may also be formed by photolithography.
In block 105, referring to
Since the width of the second end 402 is greater than the width of the first end 401, the first electroplated copper wiring 42 can be firmly held above the base layer 10 by the second end 402 of the first bottom wiring 40, preventing separation of the first electroplated copper wiring 42 from the base layer 10.
In an embodiment, a dry film (not shown) may cover the first bottom wiring 40. The dry film defines openings for exposing the second end 402 of the first bottom wiring 40. A width of the openings is slightly greater than the width of the second end 402. Then, copper is electroplated into the openings of the dry film to obtain the first electroplated copper wiring 42. Since the width of the openings is slightly greater than the width of the second end 402, the first electroplated copper wiring 42 covers the second end 402, and at the same time it covers the first sidewall 403 of the first bottom wiring 40.
Since the copper is not electroplated on the whole surface of the board, so there is no need to etch the first electroplated copper wiring 42 afterwards, which saves the costs of raw material.
In an embodiment, a line width L of the first wiring layer 44 is less than 20 microns. A line space S of the first wiring layer 44 is less than 20 microns. In another embodiment, the first wiring layer 44 may also have a fatter line space, for example, the line space S may also be greater than 1000 microns.
In block 106, referring to
In an embodiment, the first protection layer 46 may be a solder resist layer or a cover film (CVL), for example, the first protection layer 46 may include a solder resist ink. The first protection layer 46 prevents oxidation of the first wiring layer 44. Short-circuiting during soldering of the first wiring layer 44 is also avoided.
Another embodiment of the method for manufacturing a multilayer circuit board is presented. The method is provided by way of example, as there are a variety of ways to carry out the method. Referring to
In block 206, referring to
In an embodiment, the insulating layer 51 is made of an insulating resin, such as epoxy resin, polypropylene, BT resin, polyphenylene ether, polypropylene, polyimide, polyester, ethylene phthalate, and polyethylene naphthalate. The insulating layer 51 can be made of same material as that of the base layer 10. The insulating layer 51 may also be made of a material which is different from that of the base layer 10.
In block 207, referring to
The second through hole 52 can be formed by punching or laser drilling.
In block 208, referring to
The third portion 601 is designed to correspond to the desired wiring patterns.
In block 209, referring to
In an embodiment, a second photomask 70 covers each second photosensitive resin layer 60. The second photomask 70 defines second openings 71 corresponding to the third portion 601. That is, the third portion 601 is exposed from the second photomask 70. The fourth portion 602 is covered by the second photomask 70. Therefore, when light irradiates the second photosensitive resin layer 60, compositions in the third portion 601 are polymerized under the light, causing solidification of the third portion 601. Compositions in the fourth portion 602 are not polymerized since the fourth portion 602 is not irradiated by the light (that is, the fourth portion 602 remains unsolidified).
In block 210, referring to
In an embodiment, a width W4 of the fourth end 802 is greater than a width W3 of the third end 801. The width is defined as a dimension of the third end 801 or the fourth end 802 along the extending direction of the base layer 10.
The fourth portion 602 can be removed by an alkaline developing solution. The developing solution can include 1% NaCO3 by amount. The fourth portion 602 at least is immersed in the developing solution. Since the fourth portion 602 is not treated by the exposure process, the fourth portion 602 can react with the developing solution and be removed. The silver particles in the removed fourth portion 602 can be recycled and reused, saving the costs of raw material.
In block 211, referring to
Since the width of the fourth end 802 is greater than the width of the third end 801, the second electroplated copper wiring 82 can be firmly held above the base layer 10 by the fourth end 802 of the second bottom wiring 80, preventing separation of the second electroplated copper wiring 82 from the base layer 10.
In an embodiment, a dry film (not shown) may cover the second bottom wiring 80. The dry film defines openings for exposing the fourth end 802 of the second bottom wiring 80. A width of the opening is slightly greater than the width of the fourth end 802. Then, copper is electroplated in the openings of the dry film to obtain the second electroplated copper wiring 82. Since the width of the openings is slightly greater than the width of the fourth end 802, the second electroplated copper wiring 82 covers the fourth end 802, and at the same time covers the second sidewall 803 of the second bottom wiring 80.
Since copper is not electroplated on the whole surface of the board, so there is no need to etch the second electroplated copper wiring 82 afterwards, which saves the costs of raw material.
In an embodiment, a line width of the second wiring layer 84 is less than 20 microns. A line space of the second wiring layer 84 is less than 20 microns. In another embodiment, the second wiring layer 84 may also have a larger line space, for example, the line space may also be greater than 1000 microns.
In block 212, referring to
In an embodiment, the second protection layer 90 may be a solder resist layer or a cover film (CVL). The second protection layer 90 prevents oxidation of the second wiring layer 84. Short-circuiting during soldering of the second wiring layer 84 is also avoided.
The base layer 10 defines a first through hole 11 penetrating the base layer 10. The first bottom wiring 40 also infills the first through hole 11 to form a first conductive block 41, which electrically connects the two first wiring layers 44 together.
In an embodiment, the circuit board 100 may also include a first protection layer 46 covering each first wiring layer 44.
The circuit board 200 further includes an adhesive layer 50 and an insulating layer 51 sequentially disposed on each of the first wiring layers 44. Each insulating layer 51 and the corresponding adhesive layer 50 define a second through hole 52.
The circuit board 200 further includes a second wiring layer 84 disposed on each insulating layer 51. Each second wiring layer 84 includes a second bottom wiring 80 disposed on the insulating layer 51. The second bottom wiring 80 includes a third end 801 facing the base layer 10, a fourth end 802 opposite to the third end 801, and a second sidewall 803 connecting the third end 801 and the fourth end 802. In an embodiment, a width W4 of the fourth end 802 is greater than a width W3 of the third end 801. Each second wiring layer 84 also includes a second electroplated copper wiring 82 disposed on the fourth end 802 and the second sidewall 803 of the second bottom wiring 80. The second bottom wiring 80 further infills the second through hole 52 to form a second conductive block 81, which electrically connects the second wiring layer 84 to the first wiring layer 44.
In an embodiment, the circuit board 200 may further include a second protection layer 90 disposed on each second wiring layer 84.
The method of the present disclosure manufactures a circuit board with fine and narrow wiring patterns. The electroplated copper disposed on the bottom wiring decreases the resistance of the wiring patterns. The method does not electroplate copper on the whole surface of the board, so there is no need to etch the electroplated copper afterwards, and pollution by the etched electroplated copper is reduced. Moreover, the silver particles in the removed photosensitive resin layer after the development process can be recycled and reused, saving the costs of raw material.
Even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202010797851.9 | Aug 2020 | CN | national |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 17038244 | Sep 2020 | US |
| Child | 17979150 | US |
