Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Industry

CPC
H05K3/245

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring substrate
- Patent number 11,871,513
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applying a solderable surface to conductive ink
- Patent number 11,805,603
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,240,912
- Issue date Feb 1, 2022
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite transparent conductors and methods of forming the same
- Patent number 11,224,130
- Issue date Jan 11, 2022
- Cambrios Film Solutions Corporation
- David Jones
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microcircuit forming method and etching fluid composition
- Patent number 11,089,691
- Issue date Aug 10, 2021
- Inktec Co., Ltd.
- Su Han Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper-ceramic composite
- Patent number 11,021,406
- Issue date Jun 1, 2021
- Heraeus Deutschland GmbH & Co. KG
- Kai Herbst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-ceramic composite
- Patent number 10,941,080
- Issue date Mar 9, 2021
- Heraeus Deutschland GmbH & Co. KG
- Kai Herbst
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Nanowire-based transparent conductors and applications thereof
- Patent number 10,749,048
- Issue date Aug 18, 2020
- Cambrios Film Solutions Corporation
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic device
- Patent number 10,481,709
- Issue date Nov 19, 2019
- Jui-Jen Yueh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive patterns and methods of using them
- Patent number 10,462,908
- Issue date Oct 29, 2019
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing of multi-layer circuits
- Patent number 10,446,412
- Issue date Oct 15, 2019
- PRINTCB LTD.
- Yiftah Karni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for stencil printing during manufacture of printed circuit b...
- Patent number 10,426,039
- Issue date Sep 24, 2019
- Fu Tai Hua Industry (Shenzhen) Co., Ltd.
- Xue-Qin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reinforcing conductor tracks of a circuit board
- Patent number 10,276,482
- Issue date Apr 30, 2019
- Continental Automotive GmbH
- Detlev Bagung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite transparent conductors and methods of forming the same
- Patent number 10,244,637
- Issue date Mar 26, 2019
- Cambrios Film Solutions Corporation
- David Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of producing the same
- Patent number 10,212,810
- Issue date Feb 19, 2019
- Toppan Printing Co., Ltd.
- Takanori Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED light arrangement with flexible circuit board having graphite s...
- Patent number 10,094,516
- Issue date Oct 9, 2018
- NeoGraf Solutions, LLC
- Alexander J. Augoustidis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support entering into the fabrication of an electronic device, corr...
- Patent number 9,980,374
- Issue date May 22, 2018
- INGENICO GROUP
- Stephane Pavageau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 9,967,976
- Issue date May 8, 2018
- Sumitomo Electric Industries, Ltd.
- Kazuhiro Miyata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board made of AIN with copper structures
- Patent number 9,717,149
- Issue date Jul 25, 2017
- CeramTec GmbH
- Alexander Dohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thick film circuits with conductive components formed using differe...
- Patent number 9,681,559
- Issue date Jun 13, 2017
- GM Global Technology Operations LLC
- Lisa M Albaugh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a high-aspect ratio conductive pattern on a su...
- Patent number 9,615,463
- Issue date Apr 4, 2017
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transparent electrode
- Patent number 9,608,226
- Issue date Mar 28, 2017
- Konica Minolta, Inc.
- Takatoshi Suematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive pattern and substrate having conductiv...
- Patent number 9,578,752
- Issue date Feb 21, 2017
- LG Chem, Ltd.
- Jung-Ho Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board with graphite substrate and circuit arrangem...
- Patent number 9,546,763
- Issue date Jan 17, 2017
- GrafTech International Holdings Inc.
- Alexander J. Augoustidis
- F21 - LIGHTING
Information Patent Grant
Display device with flexible circuit board having graphite substrate
- Patent number 9,546,764
- Issue date Jan 17, 2017
- GrafTech International Holdings Inc.
- Alexander J. Augoustidis
- F21 - LIGHTING
Information Patent Grant
Antenna and communication apparatus as well as manufacturing method...
- Patent number 9,520,644
- Issue date Dec 13, 2016
- Shuhou Co., Ltd.
- Kouji Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having bypass pad
- Patent number 9,449,716
- Issue date Sep 20, 2016
- Samsung Electronics Co., Ltd.
- Sang-Guk Han
- G11 - INFORMATION STORAGE
Information Patent Grant
Metallized via-holed ceramic substrate, and method for manufacture...
- Patent number 9,307,637
- Issue date Apr 5, 2016
- Tokuyama Corporation
- Naoto Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed differential wiring in glass ceramic MCMS
- Patent number 9,232,645
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Jinwoo Choi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240237200
- Publication date Jul 11, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
- Publication number 20240057266
- Publication date Feb 15, 2024
- International Business Machines Corporation
- MARK K. HOFFMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20220124908
- Publication date Apr 21, 2022
- Murata Manufacturing Co., Ltd.
- Masao KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF
- Publication number 20210028321
- Publication date Jan 28, 2021
- Cambrios Film Solutions Corporation
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Application
APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
- Publication number 20200404795
- Publication date Dec 24, 2020
- International Business Machines Corporation
- MARK K. HOFFMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20200296839
- Publication date Sep 17, 2020
- Murata Manufacturing Co., Ltd.
- Masao KONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME
- Publication number 20190191569
- Publication date Jun 20, 2019
- Cambrios Film Solutions Corporation
- David Jones
- B82 - NANO-TECHNOLOGY
Information Patent Application
COPPER-CERAMIC COMPOSITE
- Publication number 20190084893
- Publication date Mar 21, 2019
- Heraeus Deutschland GmbH & Co. KG
- Kai Herbst
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170347459
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20170273197
- Publication date Sep 21, 2017
- Toppan Printing Co., Ltd.
- Takanori OHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR STENCIL PRINTING DURING MANUFACTURE OF PRINTED CIRCUIT B...
- Publication number 20170150610
- Publication date May 25, 2017
- FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- XUE-QIN ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A PATTERNED FILM, METHOD FOR MANUFACTURING OPTIC...
- Publication number 20160219717
- Publication date Jul 28, 2016
- Canon Kabushiki Kaisha
- Toshiki Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH SENSOR
- Publication number 20150116242
- Publication date Apr 30, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Beom Seok OH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE, TRANSPARENT ELECTRO...
- Publication number 20150053950
- Publication date Feb 26, 2015
- Konica Minolta, Inc.
- Takatoshi Suematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Manufacturing Electronic Devices
- Publication number 20150047187
- Publication date Feb 19, 2015
- AbleGo Technology Co., Ltd.
- Shu-Hui Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPR...
- Publication number 20150021071
- Publication date Jan 22, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF
- Publication number 20140338735
- Publication date Nov 20, 2014
- CAMBRIOS TECHNOLOGIES CORPORATION
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME
- Publication number 20140284088
- Publication date Sep 25, 2014
- Kiyotaka Nakamura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CIRCUIT BOARD MADE OF AIN WITH COPPER STRUCTURES
- Publication number 20140284087
- Publication date Sep 25, 2014
- CERAMTEC GMBH
- Alexander Dohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING BYPASS PAD
- Publication number 20140097865
- Publication date Apr 10, 2014
- Samsung Electronics Co., Ltd.
- Sang-Guk Han
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOA...
- Publication number 20140020938
- Publication date Jan 23, 2014
- FUJIFILM CORPORATION
- Hiroshi MATAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Pattern and Method of Making
- Publication number 20130248608
- Publication date Sep 26, 2013
- Avery Dennison Corporation
- James P. COLEMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METALLIZED VIA-HOLED CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURE...
- Publication number 20130186675
- Publication date Jul 25, 2013
- Naoto TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-HOLED CERAMIC SUBSTRATE, METALIIZED VIA-HOLED CERAMIC SUBSTRATE...
- Publication number 20130146340
- Publication date Jun 13, 2013
- Tokuyama Corporation
- Naoto Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrates and Method of Preparing the Same
- Publication number 20130071615
- Publication date Mar 21, 2013
- Kazuhiro MURATA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE...
- Publication number 20130008586
- Publication date Jan 10, 2013
- Murata Manufacturing Co., Ltd.
- Yutaka FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING BYPASS PAD
- Publication number 20120292091
- Publication date Nov 22, 2012
- Sang-Guk Han
- G01 - MEASURING TESTING
Information Patent Application
PRINTING METHOD FOR PRINTING ELECTRONIC DEVICES AND RELATIVE CONTRO...
- Publication number 20120223046
- Publication date Sep 6, 2012
- Applied Material, Inc.
- Marco Galiazzo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING COMPONENT BUILT-IN MODULE AND COMPONENT BUI...
- Publication number 20120218721
- Publication date Aug 30, 2012
- Murata Manufacturing Co., Ltd.
- Shigeo NISHIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDABLE CONDUCTIVE INK
- Publication number 20120119159
- Publication date May 17, 2012
- Joel S. Douglas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer wiring substrate

Applying a solderable surface to conductive ink

Circuit board

Multilayer wiring substrate

Composite transparent conductors and methods of forming the same

Microcircuit forming method and etching fluid composition

Copper-ceramic composite

Copper-ceramic composite

Nanowire-based transparent conductors and applications thereof

Electronic device

Conductive patterns and methods of using them

Printing of multi-layer circuits

Method for stencil printing during manufacture of printed circuit b...

Method for reinforcing conductor tracks of a circuit board

Composite transparent conductors and methods of forming the same

Printed wiring board and method of producing the same

LED light arrangement with flexible circuit board having graphite s...

Support entering into the fabrication of an electronic device, corr...

Substrate for printed circuit board, printed circuit board, and met...

Circuit board made of AIN with copper structures

Thick film circuits with conductive components formed using differe...

Method for producing a high-aspect ratio conductive pattern on a su...

Method for manufacturing transparent electrode

Method of forming conductive pattern and substrate having conductiv...

Flexible circuit board with graphite substrate and circuit arrangem...

Display device with flexible circuit board having graphite substrate

Antenna and communication apparatus as well as manufacturing method...

Circuit board having bypass pad

Metallized via-holed ceramic substrate, and method for manufacture...

High speed differential wiring in glass ceramic MCMS

Patents Applicationslast 30 patents

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK

MULTILAYER WIRING SUBSTRATE

NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF

APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK

MULTILAYER WIRING SUBSTRATE

COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME

COPPER-CERAMIC COMPOSITE

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME

METHOD FOR STENCIL PRINTING DURING MANUFACTURE OF PRINTED CIRCUIT B...

METHOD FOR FORMING A PATTERNED FILM, METHOD FOR MANUFACTURING OPTIC...

TOUCH SENSOR

METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE, TRANSPARENT ELECTRO...

Method and Apparatus for Manufacturing Electronic Devices

CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPR...

NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF

CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME

CIRCUIT BOARD MADE OF AIN WITH COPPER STRUCTURES

CIRCUIT BOARD HAVING BYPASS PAD

METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOA...

Conductive Pattern and Method of Making

METALLIZED VIA-HOLED CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURE...

VIA-HOLED CERAMIC SUBSTRATE, METALIIZED VIA-HOLED CERAMIC SUBSTRATE...

Substrates and Method of Preparing the Same

CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE...

CIRCUIT BOARD HAVING BYPASS PAD

PRINTING METHOD FOR PRINTING ELECTRONIC DEVICES AND RELATIVE CONTRO...

METHOD OF MANUFACTURING COMPONENT BUILT-IN MODULE AND COMPONENT BUI...

BONDABLE CONDUCTIVE INK