Reinforcing structures

Industry

CPC
H01L2224/26155

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/26155Reinforcing structures

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing light emitting devices
- Patent number 12,080,695
- Issue date Sep 3, 2024
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having mechanical brace standoffs
- Patent number 12,080,623
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having high yield strength intermediate plate
- Patent number 12,009,332
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,791,324
- Issue date Oct 17, 2023
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,393,803
- Issue date Jul 19, 2022
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,011,451
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,825,803
- Issue date Nov 3, 2020
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light emitting device
- Patent number 10,461,065
- Issue date Oct 29, 2019
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 10,083,940
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly that includes stacked dice
- Patent number 9,991,243
- Issue date Jun 5, 2018
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,735,132
- Issue date Aug 15, 2017
- ChipMOS Technologies Inc.
- Cheng-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 9,685,426
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate warpage control using external frame stiffener
- Patent number 9,355,966
- Issue date May 31, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Adam Gallegos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-die stacking structure and method for making the same
- Patent number 9,214,438
- Issue date Dec 15, 2015
- Advanced Micro Devices (Shanghai) Co., Ltd.
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement of an electric and/or electronic component
- Patent number 9,177,934
- Issue date Nov 3, 2015
- Robert Bosch GmbH
- Christiane Frueh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240395786
- Publication date Nov 28, 2024
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS
- Publication number 20240363486
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230387063
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299247
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING MODULE AND ELECTRONIC DEVICE
- Publication number 20230207510
- Publication date Jun 29, 2023
- VIVO MOBILE COMMUNICATION CO., LTD.
- Yuegang ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20220270999
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210272875
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190157235
- Publication date May 23, 2019
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20180233477
- Publication date Aug 16, 2018
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY THAT INCLUDES STACKED DICE
- Publication number 20170323874
- Publication date Nov 9, 2017
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20170278827
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20160284669
- Publication date Sep 29, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140306338
- Publication date Oct 16, 2014
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20140111956
- Publication date Apr 24, 2014
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20130256016
- Publication date Oct 3, 2013
- Masakazu TAKESUE
- H01 - BASIC ELECTRIC ELEMENTS

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing light emitting devices

Integrated circuit packages having mechanical brace standoffs

Semiconductor device having high yield strength intermediate plate

Die attached leveling control by metal stopper bumps

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Light emitting device

Light emitting device

Packaged semiconductor devices and methods of packaging thereof

Integrated circuit package and method

Light emitting device

Method of manufacturing light emitting device

Package-on-package semiconductor device

Integrated circuit assembly that includes stacked dice

Semiconductor package

Package-on-package semiconductor device

Substrate warpage control using external frame stiffener

Die-die stacking structure and method for making the same

Connection arrangement of an electric and/or electronic component

Patents Applicationslast 30 patents

LIGHT EMITTING DEVICE

INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING MODULE AND ELECTRONIC DEVICE

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

Integrated Circuit Package and Method

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGING STRUCTURE

INTEGRATED CIRCUIT ASSEMBLY THAT INCLUDES STACKED DICE

PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME

JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF