Reinforcing structures

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CPC
H01L2224/10155

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/10155Reinforcing structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,170,260
- Issue date Dec 17, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for underfilling using spacers
- Patent number 11,948,809
- Issue date Apr 2, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package connector structure and method therefor
- Patent number 11,721,642
- Issue date Aug 8, 2023
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,139,282
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, electronic substrate, and method for producing electron...
- Patent number 10,833,050
- Issue date Nov 10, 2020
- Lenovo (Singapore) Pte. Ltd.
- Tadashi Kosuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 9,842,819
- Issue date Dec 12, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection for chip scale packaging
- Patent number 9,515,038
- Issue date Dec 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate warpage control using external frame stiffener
- Patent number 9,355,966
- Issue date May 31, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Adam Gallegos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and an alignment plate for engaging a stiffener frame and a...
- Patent number 9,349,628
- Issue date May 24, 2016
- Advanced Micro Devices, Inc.
- Wei-Chin Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming hydrophobic surfaces on semiconductor device str...
- Patent number 8,932,933
- Issue date Jan 13, 2015
- Micron Technology, Inc.
- Ian C. Laboriante
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Use of a local constraint to enhance attachment of an IC device to...
- Patent number 8,432,034
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Eric Vance Kline
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR UNDERFILLING USING SPACERS
- Publication number 20230082626
- Publication date Mar 16, 2023
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE CONNECTOR STRUCTURE AND METHOD THEREFOR
- Publication number 20220406728
- Publication date Dec 22, 2022
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220285304
- Publication date Sep 8, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, ELECTRONIC SUBSTRATE, AND METHOD FOR PRODUCING ELECTRON...
- Publication number 20200373277
- Publication date Nov 26, 2020
- LENOVO (SINGAPORE) PTE. LTD.
- Tadashi Kosuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200035655
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO-CHIANG TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20170053886
- Publication date Feb 23, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connection for Chip Scale Packaging
- Publication number 20150235976
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...
- Publication number 20150084187
- Publication date Mar 26, 2015
- Micron Technology, Inc.
- Ian C. Laboriante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER FRAME FIXTURE
- Publication number 20140237815
- Publication date Aug 28, 2014
- Advanced Micro Devices, Inc.
- Wei-Chin Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...
- Publication number 20130292647
- Publication date Nov 7, 2013
- Micron Technology, Inc.
- Ian C. Laboriante
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20130256889
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20120309133
- Publication date Dec 6, 2012
- PANASONIC CORPORATION
- Yoshiyuki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of a Local Constraint to Enhance Attachment of an IC Device to...
- Publication number 20120299201
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Eric V. Kline
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20090039495
- Publication date Feb 12, 2009
- Sharp Kabushiki Kaisha
- Kenichi Yamashita
- G02 - OPTICS

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Light-emitting device and displayer

Method for underfilling using spacers

Semiconductor device package connector structure and method therefor

Semiconductor package structure and method for manufacturing the same

Interposer, electronic substrate, and method for producing electron...

Tall and fine pitch interconnects

Tall and fine pitch interconnects

Tall and fine pitch interconnects

Electrical connection for chip scale packaging

Substrate warpage control using external frame stiffener

Method and an alignment plate for engaging a stiffener frame and a...

Methods of forming hydrophobic surfaces on semiconductor device str...

Use of a local constraint to enhance attachment of an IC device to...

Patents Applicationslast 30 patents

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

METHOD FOR UNDERFILLING USING SPACERS

SEMICONDUCTOR DEVICE PACKAGE CONNECTOR STRUCTURE AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Light-Emitting Device and Displayer

INTERPOSER, ELECTRONIC SUBSTRATE, AND METHOD FOR PRODUCING ELECTRON...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

TALL AND FINE PITCH INTERCONNECTS

Tall and Fine Pitch Interconnects

TALL AND FINE PITCH INTERCONNECTS

Electrical Connection for Chip Scale Packaging

METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...

STIFFENER FRAME FIXTURE

METHODS OF FORMING HYDROPHOBIC SURFACES ON SEMICONDUCTOR DEVICE STR...

SUBSTRATE AND SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MOUNTING METHOD

Use of a Local Constraint to Enhance Attachment of an IC Device to...

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME