Reinforcing structures

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CPC
H01L2224/02235

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02235Reinforcing structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,848,282
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,830,832
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,444,037
- Issue date Sep 13, 2022
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure
- Patent number 11,417,610
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,957,664
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,790,210
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 10,784,212
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,741,467
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure
- Patent number 10,522,481
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,490,474
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,340,208
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate
- Patent number 10,312,206
- Issue date Jun 4, 2019
- Au Optronics Corporation
- Jia-Hong Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,199,338
- Issue date Feb 5, 2019
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a post-passivation interconnect structure
- Patent number 10,121,749
- Issue date Nov 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,115,650
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabricating method thereof
- Patent number 10,115,686
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Li Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,014,267
- Issue date Jul 3, 2018
- Samsung Electronics Co., Ltd.
- Yong-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,941,140
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,780,024
- Issue date Oct 3, 2017
- Amkor Technology, Inc.
- In Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor package and fabricating method th...
- Patent number 9,620,460
- Issue date Apr 11, 2017
- Samsung Electronics Co., Ltd.
- Hyun-Pil Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure
- Patent number 9,613,914
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,607,962
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Kentaro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,576,874
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with post-passivation interconnect structure a...
- Patent number 9,443,812
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and fabrication method thereof
- Patent number 9,398,689
- Issue date Jul 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Cheng-An Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crack stopping structure in wafer level packaging (WLP)
- Patent number 9,379,065
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming stress-reduced conductiv...
- Patent number 9,349,700
- Issue date May 24, 2016
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
- Publication number 20240339422
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Dummy vias in WLP
- Publication number 20240055374
- Publication date Feb 15, 2024
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...
- Publication number 20240047400
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240047397
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Step Seal Ring and Methods Forming...
- Publication number 20230386908
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...
- Publication number 20230268303
- Publication date Aug 24, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230136019
- Publication date May 4, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL
- Publication number 20230106976
- Publication date Apr 6, 2023
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20230086907
- Publication date Mar 23, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230010383
- Publication date Jan 12, 2023
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210447
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20200402925
- Publication date Dec 24, 2020
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200381378
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20200211983
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PASSIVATION INTERCONNECT STRUCTURE
- Publication number 20200135659
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200043819
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-on-Interposer Assembly with Dam Structure and Method of Manufac...
- Publication number 20200035578
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE
- Publication number 20190081124
- Publication date Mar 14, 2019
- AU OPTRONICS CORPORATION
- Jia-Hong Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A POST-PASSIVATION INTERCONNECT STRUCTURE
- Publication number 20170338188
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20170278809
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-LI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20170162541
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20160284652
- Publication date Sep 29, 2016
- RENESAS ELECTRONICS CORPORATION
- Taku KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160276312
- Publication date Sep 22, 2016
- Kabushiki Kaisha Toshiba
- Shinya SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20160086900
- Publication date Mar 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150262957
- Publication date Sep 17, 2015
- Shinko Electric Industries Co., LTD.
- Yoshihiro Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE WITH TRENCH INSULATOR AND FABRICATION METHOD T...
- Publication number 20140319670
- Publication date Oct 30, 2014
- Wen-Cheng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stress-Reduced Conductiv...
- Publication number 20140319695
- Publication date Oct 30, 2014
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POST-PASSIVATION INTERCONNECT STRUCTURE A...
- Publication number 20140264837
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140252643
- Publication date Sep 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices having crack-inhibiting structures

Chip structure and method for forming the same

Semiconductor structure and manufacturing method thereof

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor devices having crack-inhibiting structures

Post-passivation interconnect structure

Multi-chip modules including stacked semiconductor dice

Semiconductor structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor devices having crack-inhibiting structures

Die-on-interposer assembly with dam structure and method of manufac...

Post-passivation interconnect structure

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor device

Array substrate

Semiconductor device and a method of manufacturing the same

Method of fabricating a post-passivation interconnect structure

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor structure and fabricating method thereof

Semiconductor device and method of manufacturing the same

Semiconductor devices and methods of manufacture thereof

Semiconductor package and manufacturing method thereof

Semiconductor chip, semiconductor package and fabricating method th...

Post-passivation interconnect structure

Semiconductor device and manufacturing method thereof

Semiconductor devices and methods of manufacture thereof

Semiconductor device with post-passivation interconnect structure a...

Substrate structure and fabrication method thereof

Crack stopping structure in wafer level packaging (WLP)

Semiconductor device and method of forming stress-reduced conductiv...

Patents Applicationslast 30 patents

SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION

CHIP STRUCTURE

Semiconductor Device and Method of Forming Dummy vias in WLP

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...

BUMP STRUCTURE AND METHOD OF MAKING THE SAME

Semiconductor Package Including Step Seal Ring and Methods Forming...

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

POST-PASSIVATION INTERCONNECT STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Die-on-Interposer Assembly with Dam Structure and Method of Manufac...

ARRAY SUBSTRATE

METHOD OF FABRICATING A POST-PASSIVATION INTERCONNECT STRUCTURE

SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF

Semiconductor Devices and Methods of Manufacture Thereof

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Devices and Methods of Manufacture Thereof

SEMICONDUCTOR PACKAGE

IMAGE SENSOR PACKAGE WITH TRENCH INSULATOR AND FABRICATION METHOD T...

Semiconductor Device and Method of Forming Stress-Reduced Conductiv...

SEMICONDUCTOR DEVICE WITH POST-PASSIVATION INTERCONNECT STRUCTURE A...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE