TREA

Reinforcing structures

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Industry

  • CPC
  • H01L2224/40997
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40997Reinforcing structures
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor module
    • Patent number 10,770,400
    • Issue date Sep 8, 2020
    • Kabushiki Kaisha Toyota Jidoshokki
    • Naoki Kato
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
    • Publication number 20230326901
    • Publication date Oct 12, 2023
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230071827
    • Publication date Mar 9, 2023
    • Fuji Electric Co., Ltd.
    • Kousuke KOMATSU
    • H01 - BASIC ELECTRIC ELEMENTS