Reinforcing structures

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CPC
H01L2224/48992

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48992Reinforcing structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and manufacturing methods for the same
- Patent number 11,735,559
- Issue date Aug 22, 2023
- SK hynix Inc.
- Chan Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 11,557,566
- Issue date Jan 17, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods for the same
- Patent number 11,437,342
- Issue date Sep 6, 2022
- SK hynix Inc.
- Chan Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,177,187
- Issue date Nov 16, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bond wire support systems and methods
- Patent number 11,049,836
- Issue date Jun 29, 2021
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 10,672,676
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 10,643,970
- Issue date May 5, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 10,224,306
- Issue date Mar 5, 2019
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protective material with a first pH f...
- Patent number 10,037,965
- Issue date Jul 31, 2018
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 9,984,947
- Issue date May 29, 2018
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flow over wire die attach film and conductive molding compound to p...
- Patent number 9,953,933
- Issue date Apr 24, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 9,728,476
- Issue date Aug 8, 2017
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for protecting copper wire bonds on aluminum pads of a semic...
- Patent number 9,508,622
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of manufacturing the same
- Patent number 9,252,123
- Issue date Feb 2, 2016
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device manufacturing method and sensor device
- Patent number 9,209,319
- Issue date Dec 8, 2015
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 9,171,821
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 8,952,549
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips having double adhesive insulating layer...
- Patent number 8,841,776
- Issue date Sep 23, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having multiple wire bonds for a bond area and methods thereof
- Patent number 8,791,007
- Issue date Jul 29, 2014
- Spansion LLC
- Gin Ghee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Brace for long wire bond
- Patent number 8,692,134
- Issue date Apr 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,609,527
- Issue date Dec 17, 2013
- Oki Semiconductor Co., Ltd.
- Isao Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection element for a semiconductor component and method for pro...
- Patent number 8,581,371
- Issue date Nov 12, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312947
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...
- Publication number 20240014168
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...
- Publication number 20240014165
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...
- Publication number 20230395558
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230140664
- Publication date May 4, 2023
- Mitsubishi Electric Corporation
- Yusuke KAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20230121780
- Publication date Apr 20, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME
- Publication number 20220359453
- Publication date Nov 10, 2022
- SK HYNIX INC.
- Chan Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20220320056
- Publication date Oct 6, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME
- Publication number 20210210458
- Publication date Jul 8, 2021
- SK HYNIX INC.
- Chan Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20200227382
- Publication date Jul 16, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE SUPPORT SYSTEMS AND METHODS
- Publication number 20190326247
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW DAVID ROMIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20190148334
- Publication date May 16, 2019
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES
- Publication number 20190035761
- Publication date Jan 31, 2019
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180269121
- Publication date Sep 20, 2018
- Amkor Technology, Inc.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20180122770
- Publication date May 3, 2018
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170338163
- Publication date Nov 23, 2017
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160372441
- Publication date Dec 22, 2016
- Fujitsu Limited
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPLEMENTING WIRE BONDS
- Publication number 20140264952
- Publication date Sep 18, 2014
- Power Integrations, Inc.
- Jayson M. DENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transducer Assembly for an Imaging Device
- Publication number 20140257107
- Publication date Sep 11, 2014
- VOLCANO CORPORATION
- Cheryl Rice
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Packages and Methods of Manufacturing the Same
- Publication number 20130241055
- Publication date Sep 19, 2013
- Samsung Electronics Co., Ltd.
- Jin-Young Jung
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20130200514
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING MULTIPLE WIRE BONDS FOR A BOND AREA AND METHODS THEREOF
- Publication number 20130134578
- Publication date May 30, 2013
- SPANSION LLC
- Gin Ghee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE
- Publication number 20130113055
- Publication date May 9, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130093080
- Publication date Apr 18, 2013
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming an electrical connection between an electronic c...

Light-emitting substrate, method of manufacturing light-emitting su...

Sensor package and manufacturing method thereof

Semiconductor packages and manufacturing methods for the same

Sensor package and manufacturing method thereof

Method for forming an electrical connection between an electronic c...

Semiconductor packages and manufacturing methods for the same

Sensor package and manufacturing method thereof

Bond wire support systems and methods

Reinforcement for electrical connectors

Sensor package and manufacturing method thereof

Method for forming an electrical connection between an electronic c...

Method for forming an electrical connection between an electronic c...

Semiconductor device having a protective material with a first pH f...

Fingerprint sensor and manufacturing method thereof

Flow over wire die attach film and conductive molding compound to p...

Fingerprint sensor and manufacturing method thereof

Method for protecting copper wire bonds on aluminum pads of a semic...

Multi-chip package and method of manufacturing the same

Sensor device manufacturing method and sensor device

Semiconductor packages and methods of manufacturing the same

Semiconductor module system having encapsulated through wire interc...

Through wire interconnect (TWI) for semiconductor components having...

Semiconductor packages and methods of manufacturing the same

Stacked semiconductor chips having double adhesive insulating layer...

Device having multiple wire bonds for a bond area and methods thereof

Method for fabricating a through wire interconnect (TWI) on a semic...

Brace for long wire bond

Method of manufacturing semiconductor device

Connection element for a semiconductor component and method for pro...

Patents Applicationslast 30 patents

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...

SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...

SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

BOND WIRE SUPPORT SYSTEMS AND METHODS

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SUPPLEMENTING WIRE BONDS

Transducer Assembly for an Imaging Device

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

Through Wire Interconnect (TWI) For Semiconductor Components Having...

Multi-Chip Packages and Methods of Manufacturing the Same

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

DEVICE HAVING MULTIPLE WIRE BONDS FOR A BOND AREA AND METHODS THEREOF

SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME