Reinforcing the conductive pattern

Industry

CPC
H05K3/24

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/24Reinforcing the conductive pattern

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar lightwave circuit structure based on printed circuit board a...
- Patent number 12,137,519
- Issue date Nov 5, 2024
- Soochow University
- Mingdi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste stencil with aperture wall coating
- Patent number 12,069,810
- Issue date Aug 20, 2024
- SanDisk Technologies, Inc.
- Fakhrozi Bin Che Ani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module and manufacturing method thereof
- Patent number 12,058,814
- Issue date Aug 6, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with heat dissipation function
- Patent number 12,052,827
- Issue date Jul 30, 2024
- Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated glass cloth, prepreg, and printed wiring board
- Patent number 12,041,727
- Issue date Jul 16, 2024
- Nitto Boseki Co., LTD
- Kazutaka Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board, and wiring board
- Patent number 12,028,989
- Issue date Jul 2, 2024
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of packaging substrate deformation
- Patent number 11,974,390
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Bhuvaneshwaran Vijayakumar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Machining station and method for machining workpieces
- Patent number 11,963,305
- Issue date Apr 16, 2024
- Skybrain Vermögensverwaltungs GmbH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with solder mask on internal copper pad
- Patent number 11,910,540
- Issue date Feb 20, 2024
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,903,141
- Issue date Feb 13, 2024
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,871,513
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible printed circuit and manufacturing method thereof, and disp...
- Patent number 11,839,025
- Issue date Dec 5, 2023
- Beijing BOE Optoelectronics Technology Co., Ltd
- Xiaoxia Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applying a solderable surface to conductive ink
- Patent number 11,805,603
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240431024
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
- Publication number 20240328023
- Publication date Oct 3, 2024
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGING SUBSTRATES HAVING REDUCED DEFORMATION AND METHODS RELATED...
- Publication number 20240324095
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Bhuvaneshwaran VIJAYAKUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PLATING APPARATUS
- Publication number 20240314936
- Publication date Sep 19, 2024
- EBARA CORPORATION
- Tsubasa ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240306292
- Publication date Sep 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kyehwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board
- Publication number 20240298412
- Publication date Sep 5, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20240284592
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHENG-YU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240237200
- Publication date Jul 11, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT LED DISPLAY DEVICE INTEGRATED WITH SMPS AND MANUFACTURI...
- Publication number 20240234393
- Publication date Jul 11, 2024
- LEORIA Inc.
- Jun Cheol KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240206078
- Publication date Jun 20, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Youngkyun Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240164017
- Publication date May 16, 2024
- Nitto Denko Corporation
- Hideki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...
- Publication number 20240164012
- Publication date May 16, 2024
- Nikon Corporation
- Shohei KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...
- Publication number 20240107678
- Publication date Mar 28, 2024
- NGK Electronics Devices, Inc.
- Kota KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
- Publication number 20240057266
- Publication date Feb 15, 2024
- International Business Machines Corporation
- MARK K. HOFFMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240049398
- Publication date Feb 8, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE
- Publication number 20240042898
- Publication date Feb 8, 2024
- Joyson Safety Systems Acquisition LLC
- David Wilson
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD TO WHICH 3D FORMED ELECTROMAGNETIC SHIELDING FILM IS...
- Publication number 20240040760
- Publication date Feb 1, 2024
- 3M Innovative Properties Company
- Chao Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230422393
- Publication date Dec 28, 2023
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN-INDIUM ALLOY ELECTROPLATING SOLUTION
- Publication number 20230383430
- Publication date Nov 30, 2023
- NEW MEXICO TECH UNIVERSITY RESEARCH PARK CORPORATION
- Bhaskar S. MAJUMDAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20230389172
- Publication date Nov 30, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION...
- Publication number 20230363084
- Publication date Nov 9, 2023
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Hui LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20230345632
- Publication date Oct 26, 2023
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS
- Publication number 20230345633
- Publication date Oct 26, 2023
- Kent Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Reinforcing the conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible printed circuit board and method of manufacturing flexible...

Methods and systems of forming metal interconnect layers using engi...

Printed circuit board and method of producing printed circuit board

Planar lightwave circuit structure based on printed circuit board a...

Patterned article including electrically conductive elements

Flexible circuit board

Panel molded electronic assemblies with multi-surface conductive co...

Electromagnetic wave transmission board comprising an inner board w...

Solder paste stencil with aperture wall coating

Circuit board and method for manufacturing the same

Power module and manufacturing method thereof

Circuit board with heat dissipation function

Manufacturing method of circuit board

Patterned conductive article

Surface-treated glass cloth, prepreg, and printed wiring board

Method for manufacturing wiring board, and wiring board

Printed circuit board with stacked passive components

Redistribution plate

Radio frequency transmission line with finish plating on conductive...

Reduction of packaging substrate deformation

Machining station and method for machining workpieces

Multilayer substrate and a manufacturing method of the multilayer s...

Circuit board with solder mask on internal copper pad

Method for manufacturing wiring board

Printed circuit board and method of manufacturing the same

Multilayer wiring substrate

Plated metallization structures

Flexible printed circuit and manufacturing method thereof, and disp...

Multilayer coil circuit substrate

Applying a solderable surface to conductive ink

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM

PACKAGING SUBSTRATES HAVING REDUCED DEFORMATION AND METHODS RELATED...

PLATING APPARATUS

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PATTERNED CONDUCTIVE ARTICLE

Circuit board

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

WIRING BOARD

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

TRANSPARENT LED DISPLAY DEVICE INTEGRATED WITH SMPS AND MANUFACTURI...

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

WIRING CIRCUIT BOARD

METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...

METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...

APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE

CIRCUIT BOARD TO WHICH 3D FORMED ELECTROMAGNETIC SHIELDING FILM IS...

WIRING BOARD

TIN-INDIUM ALLOY ELECTROPLATING SOLUTION

MANUFACTURING METHOD OF CIRCUIT BOARD

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION...

FLEXIBLE CIRCUIT BOARD

PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS