relative to the bonding area

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H01L2224/32012

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32012relative to the bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for preparing the same
- Patent number 11,876,063
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,710,719
- Issue date Jul 25, 2023
- Sumitomo Electric Device Innovations, Inc.
- Taketo Kawano
- G02 - OPTICS
Information Patent Grant
Chip attached to a die pad having a concave structure
- Patent number 10,825,756
- Issue date Nov 3, 2020
- Kabushiki Kaisha Toshiba
- Hideharu Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices including stacked semiconductor chips
- Patent number 10,483,243
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Donghyun Kim
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor devices including stacked semiconductor chips
- Patent number 10,199,355
- Issue date Feb 5, 2019
- Samsung Electronics Co., Ltd.
- Donghyun Kim
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Direct die solder of gallium arsenide integrated circuit dies and m...
- Patent number 9,530,719
- Issue date Dec 27, 2016
- Skyworks Solutions, Inc.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip affixed to substrate...
- Patent number 9,524,949
- Issue date Dec 20, 2016
- Dexerials Corporation
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,368,374
- Issue date Jun 14, 2016
- Dexerials Corporation
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack die structure for stress reduction and facilitation of electr...
- Patent number 8,686,547
- Issue date Apr 1, 2014
- Marvell International Ltd.
- Huahung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,654,554
- Issue date Feb 18, 2014
- Honda Motor Co., Ltd.
- Shinsei Seki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240047394
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20230060355
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20210313297
- Publication date Oct 7, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Taketo KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180308790
- Publication date Oct 25, 2018
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki YOSHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including Stacked Semiconductor Chips
- Publication number 20170154873
- Publication date Jun 1, 2017
- Samsung Electronics Co., Ltd.
- Donghyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130016548
- Publication date Jan 17, 2013
- Honda Motor Co., Ltd.
- Shinsei SEKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...
- Publication number 20110273847
- Publication date Nov 10, 2011
- Hong-Sik Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110237028
- Publication date Sep 29, 2011
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...
- Publication number 20070256761
- Publication date Nov 8, 2007
- Indium Corporation of America
- Hong-Sik Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

relative to the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure and method for preparing the same

Method for manufacturing electronic device

Chip attached to a die pad having a concave structure

Low-temperature bonding with spaced nanorods and eutectic alloys

Semiconductor devices including stacked semiconductor chips

Semiconductor devices including stacked semiconductor chips

Direct die solder of gallium arsenide integrated circuit dies and m...

Semiconductor device having semiconductor chip affixed to substrate...

Method of manufacturing semiconductor device

Stack die structure for stress reduction and facilitation of electr...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR MODULE

Semiconductor Devices Including Stacked Semiconductor Chips

SEMICONDUCTOR DEVICE

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...