relative to the bonding area

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H01L2224/32104

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32104relative to the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 12,072,588
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Yoo Jeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode structure for improving bonding yield
- Patent number 11,631,788
- Issue date Apr 18, 2023
- Lextar Electronics Corporation
- Shiou-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 11,587,901
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attached to a die pad having a concave structure
- Patent number 10,825,756
- Issue date Nov 3, 2020
- Kabushiki Kaisha Toshiba
- Hideharu Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device
- Patent number 10,490,518
- Issue date Nov 26, 2019
- AZBIL CORPORATION
- Shinichi Ike
- G01 - MEASURING TESTING
Information Patent Grant
Anisotropic conductive film
- Patent number 10,424,538
- Issue date Sep 24, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated millimeter-wave chip package
- Patent number 9,941,226
- Issue date Apr 10, 2018
- Industrial Technology Research Institute
- Cheng-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin power transistor and synchronous buck converter having c...
- Patent number 9,779,967
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Juan A Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable apparatus, IC packaging structure, IC packaging object, an...
- Patent number 9,443,809
- Issue date Sep 13, 2016
- UPI Semiconductor Corporation
- Chau-Chun Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components assembly
- Patent number 9,204,530
- Issue date Dec 1, 2015
- Panasonic Corporation
- Hiromitsu Takashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically bonded arrays of transfer printed active components
- Patent number 9,049,797
- Issue date Jun 2, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240369888
- Publication date Nov 7, 2024
- SAMSUNG DISPLAY CO., LTD.
- YOO JEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240282682
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR C...
- Publication number 20240222263
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230178461
- Publication date Jun 8, 2023
- Rohm Co., Ltd.
- Kenji HAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20220375892
- Publication date Nov 24, 2022
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20220310545
- Publication date Sep 29, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE STRUCTURE FOR IMPROVING BONDING YIELD
- Publication number 20220158037
- Publication date May 19, 2022
- Lextar Electronics Corporation
- Shiou-Yi KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220104343
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ji-Young OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210384281
- Publication date Dec 9, 2021
- SAMSUNG DISPLAY CO., LTD.
- YOO JEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASURING DEVICE
- Publication number 20190035751
- Publication date Jan 31, 2019
- AZBIL CORPORATION
- Shinichi Ike
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...
- Publication number 20170294398
- Publication date Oct 12, 2017
- Kabushiki Kaisha Toshiba
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN POWER TRANSISTOR AND SYNCHRONOUS BUCK CONVERTER HAVING C...
- Publication number 20160005627
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Juan A HERBSOMMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150262847
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Naoyuki KOMUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS ASSEMBLY
- Publication number 20130265729
- Publication date Oct 10, 2013
- PANASONIC CORPORATION
- Hiromitsu TAKASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Power Transistor and Synchronous Buck Converter Having C...
- Publication number 20120256239
- Publication date Oct 11, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Juan A. HERBSOMMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

relative to the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Light-emitting diode structure for improving bonding yield

Semiconductor device with redistribution structure and method for f...

Chip attached to a die pad having a concave structure

Measuring device

Anisotropic conductive film

Laser assisted transfer welding process

Integrated millimeter-wave chip package

Ultra-thin power transistor and synchronous buck converter having c...

Portable apparatus, IC packaging structure, IC packaging object, an...

Electronic components assembly

Laser assisted transfer welding process

Electrically bonded arrays of transfer printed active components

Patents Applicationslast 30 patents

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE

CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR C...

SEMICONDUCTOR DEVICE

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...

LIGHT-EMITTING DIODE STRUCTURE FOR IMPROVING BONDING YIELD

STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE

MEASURING DEVICE

SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BO...

ULTRA-THIN POWER TRANSISTOR AND SYNCHRONOUS BUCK CONVERTER HAVING C...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENTS ASSEMBLY

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

Ultra-Thin Power Transistor and Synchronous Buck Converter Having C...

LASER ASSISTED TRANSFER WELDING PROCESS