relative to the bonding areas

Industry

CPC
H01L2224/33104

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/33104relative to the bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for preparing the same
- Patent number 11,876,063
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,764,121
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Keun-Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,450,583
- Issue date Sep 20, 2022
- Samsung Electronics Co., Ltd.
- Keun-Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, interposer and semiconductor process for man...
- Patent number 9,947,635
- Issue date Apr 17, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387368
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240047394
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20230361027
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20230060355
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220415740
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Having an Installation Place for Electronic Compone...
- Publication number 20210351151
- Publication date Nov 11, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Robby Urbahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20200105637
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, INTERPOSER AND SEMICONDUCTOR PROCESS FOR MAN...
- Publication number 20180108634
- Publication date Apr 19, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20150060898
- Publication date Mar 5, 2015
- Reactive NanoTechnologies, Inc
- David Van Heerden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20110089462
- Publication date Apr 21, 2011
- David Van Heerden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

relative to the bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure and method for preparing the same

Semiconductor packages

Semiconductor packages

Semiconductor package, interposer and semiconductor process for man...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR PACKAGES

Circuit Carrier Having an Installation Place for Electronic Compone...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE, INTERPOSER AND SEMICONDUCTOR PROCESS FOR MAN...

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS