relative to the bonding areas

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H01L2224/14104

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14104relative to the bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 11,837,567
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package including a first s...
- Patent number 11,646,299
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,410,900
- Issue date Aug 9, 2022
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a first sub-package stacked atop a...
- Patent number 11,239,217
- Issue date Feb 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,957,719
- Issue date Mar 23, 2021
- Renesas Electronics Corporation
- Akihiko Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,943,881
- Issue date Mar 9, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with rigid under bump metallurgy (UBM) stack
- Patent number 10,756,040
- Issue date Aug 25, 2020
- Mediatek Inc.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component with geometrically adapted contact structure and method f...
- Patent number 10,741,723
- Issue date Aug 11, 2020
- Osram Opto Semiconductors GmbH
- Alexander F. Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple sized bump bonds
- Patent number 10,727,192
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connectivity of die to a host substrate
- Patent number 10,707,160
- Issue date Jul 7, 2020
- Infineon Technologies Americas Corp.
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 10,665,518
- Issue date May 26, 2020
- ROHM CO., LTD.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,822
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 10,475,779
- Issue date Nov 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,304,867
- Issue date May 28, 2019
- Renesas Electronics Corporation
- Akihiko Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode for a semiconductor device of a ball grid array (BGA) type
- Patent number 10,283,472
- Issue date May 7, 2019
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor formed on heavily doped substrate
- Patent number 10,217,810
- Issue date Feb 26, 2019
- Microchip Technology Incorporated
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,211,176
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,838
- Issue date Dec 25, 2018
- Samsung Electronics Co., Ltd.
- Soojeoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 10,134,653
- Issue date Nov 20, 2018
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method of fabricating a packaged...
- Patent number 10,115,675
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-passivation ball grid array pads
- Patent number 10,103,116
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip flexibly applied to various routing structures a...
- Patent number 10,002,850
- Issue date Jun 19, 2018
- SK hynix Inc.
- Sang Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing solder pad topology differences by planarization
- Patent number 9,935,069
- Issue date Apr 3, 2018
- Lumileds LLC
- Jipu Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,929,185
- Issue date Mar 27, 2018
- Renesas Electronics Corporation
- Akihiko Yoshioka
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,847,324
- Issue date Dec 19, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a thin wafer without a c...
- Patent number 9,842,775
- Issue date Dec 12, 2017
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connectivity of die to a host substrate
- Patent number 9,831,168
- Issue date Nov 28, 2017
- Infineon Technologies Americas Corp.
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234251
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Thereof
- Publication number 20240021564
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION
- Publication number 20230395486
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...
- Publication number 20230386950
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230223369
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH HIGH-DENSITY INTERCONNECTS
- Publication number 20230073823
- Publication date Mar 9, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20220336305
- Publication date Oct 20, 2022
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Thereof
- Publication number 20220278066
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A FIRST S...
- Publication number 20220102328
- Publication date Mar 31, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210305223
- Publication date Sep 30, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183801
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20200251394
- Publication date Aug 6, 2020
- ROHM CO., LTD.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200235131
- Publication date Jul 23, 2020
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20190244978
- Publication date Aug 8, 2019
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190164922
- Publication date May 30, 2019
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20190109108
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20190051572
- Publication date Feb 14, 2019
- ROHM CO., LTD.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RIGID UNDER BUMP METALLURGY (UBM) STACK
- Publication number 20180233474
- Publication date Aug 16, 2018
- MEDIATEK INC.
- Ta-Jen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180175067
- Publication date Jun 21, 2018
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180108633
- Publication date Apr 19, 2018
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE
- Publication number 20180076124
- Publication date Mar 15, 2018
- Infineon Technologies Americas Corp.
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20180026023
- Publication date Jan 25, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING A PACKAGED...
- Publication number 20170373016
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20170365571
- Publication date Dec 21, 2017
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR CHIP USING THE SAME
- Publication number 20170317056
- Publication date Nov 2, 2017
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20170263520
- Publication date Sep 14, 2017
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN-PASSIVATION BALL GRID ARRAY PADS
- Publication number 20170221846
- Publication date Aug 3, 2017
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS

relative to the bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having electrode pads arranged between groups...

Semiconductor package and method of forming thereof

Semiconductor package

Method of manufacturing a semiconductor package including a first s...

Semiconductor device having electrode pads arranged between groups...

Semiconductor package including a first sub-package stacked atop a...

Semiconductor device and a method of manufacturing the same

Semiconductor package

Semiconductor package with rigid under bump metallurgy (UBM) stack

Component with geometrically adapted contact structure and method f...

Multiple sized bump bonds

Electrical connectivity of die to a host substrate

Semiconductor device having electrode pads arranged between groups...

Expanded head pillar for bump bonds

Semiconductor device

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and a method of manufacturing the same

Electrode for a semiconductor device of a ball grid array (BGA) type

Capacitor formed on heavily doped substrate

Semiconductor package

Semiconductor device

Semiconductor device having electrode pads arranged between groups...

Packaged semiconductor device and method of fabricating a packaged...

Open-passivation ball grid array pads

Semiconductor chip flexibly applied to various routing structures a...

Reducing solder pad topology differences by planarization

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and method of forming a thin wafer without a c...

Electrical connectivity of die to a host substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

Semiconductor Package and Method of Forming Thereof

BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION

3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

PACKAGE COMPRISING A SUBSTRATE WITH HIGH-DENSITY INTERCONNECTS

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

Semiconductor Package and Method of Forming Thereof

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A FIRST S...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

EXPANDED HEAD PILLAR FOR BUMP BONDS

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

EXPANDED HEAD PILLAR FOR BUMP BONDS

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR PACKAGE WITH RIGID UNDER BUMP METALLURGY (UBM) STACK

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE

Semiconductor Device and Method of Forming a Vertical Interconnect...

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING A PACKAGED...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR CHIP USING THE SAME

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

OPEN-PASSIVATION BALL GRID ARRAY PADS