relative to the bonding areas

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H01L2224/17104

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17104relative to the bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist structure to mitigate solder bridge risk
- Patent number 11,967,547
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 11,894,332
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with efficient word line hook-up
- Patent number 11,894,056
- Issue date Feb 6, 2024
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional integrated system of dram chip and preparation me...
- Patent number 11,854,939
- Issue date Dec 26, 2023
- Fudan University
- Bao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package structure
- Patent number 11,469,208
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 11,410,952
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 11,177,237
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 11,024,594
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules
- Patent number 11,018,123
- Issue date May 25, 2021
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 10,804,244
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules
- Patent number 10,741,532
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,734,347
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 10,714,441
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming high routing density int...
- Patent number 10,580,749
- Issue date Mar 3, 2020
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 10,535,632
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor package and manufacturing method thereof
- Patent number 10,510,709
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-chip structure and methods of manufacture
- Patent number 10,340,241
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low CTE interposer
- Patent number 10,319,673
- Issue date Jun 11, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,312,210
- Issue date Jun 4, 2019
- Mediatek Inc.
- Ching-Liou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,290,600
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable sacrificial connections for semiconductor devices
- Patent number 10,217,677
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Alexandre Christian Volatier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-resilient chip structure and dicing process
- Patent number 10,211,175
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK
- Publication number 20240222247
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240153860
- Publication date May 9, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20240136317
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
- Publication number 20240021558
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Triple-Sided Module
- Publication number 20230343704
- Publication date Oct 26, 2023
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY WITH EFFICIENT WORD LINE HOOK-UP
- Publication number 20230268001
- Publication date Aug 24, 2023
- SANDISK TECHNOLOGIES LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Application
DOUBLE RESIST STRUCTURE FOR ELECTRODEPOSITION BONDING
- Publication number 20230245997
- Publication date Aug 3, 2023
- International Business Machines Corporation
- KOKI NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230230946
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Seongyo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED SYSTEM OF DRAM CHIP AND PREPARATION ME...
- Publication number 20230098556
- Publication date Mar 30, 2023
- Fudan University
- Bao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20230091131
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A PAD INTERCONNECT COMPRISING A...
- Publication number 20230070275
- Publication date Mar 9, 2023
- QUALCOMM Incorporated
- Anirudh BHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK
- Publication number 20230061167
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST RELIABLE FAN-OUT FAN-IN CHIP SCALE PACKAGE
- Publication number 20220392817
- Publication date Dec 8, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method, Semiconductor Assembly and Electron...
- Publication number 20220246576
- Publication date Aug 4, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220068742
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Cheng-Hui WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Package Structure
- Publication number 20210288012
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200411474
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIN-PUU JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- Publication number 20200335465
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES
- Publication number 20200235086
- Publication date Jul 23, 2020
- International Business Machines Corporation
- Effendi LEOBANDUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST RELIABLE FAN-OUT FAN-IN CHIP SCALE PACKAGE
- Publication number 20200203242
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200152603
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIN-PUU JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20200118962
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES
- Publication number 20190279971
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Effendi LEOBANDUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20190259724
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXTERNALLY ACCESSIBLE WIREBONDS
- Publication number 20190206827
- Publication date Jul 4, 2019
- Intel Corporation
- HANY ESKANDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Package Structure
- Publication number 20190096839
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

relative to the bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure

Solder resist structure to mitigate solder bridge risk

Substrate and package structure

Non-volatile memory with efficient word line hook-up

Three-dimensional integrated system of dram chip and preparation me...

Method of manufacturing semiconductor package structure

Chip package structure

Filter and capacitor using redistribution layer and micro bump layer

Semiconductor chip with patterned underbump metallization and polym...

Manufacturing method of semiconductor package

Surface mounting semiconductor components

Bonded structures for package and substrate

Substrate and package structure

Multi-chip modules

Chip package structure and method for forming the same

Semiconductor package structure and method of manufacturing the same

Multi-chip modules

Dummy flip chip bumps for reducing stress

Method of manufacturing chip-on-chip structure comprising sinterted...

Filter and capacitor using redistribution layer and micro bump layer

Semiconductor device and method of forming high routing density int...

Semiconductor package structure and method of manufacturing the same

Semicondcutor package and manufacturing method thereof

Bonded structures for package and substrate

Chip-on-chip structure and methods of manufacture

Low CTE interposer

Semiconductor package

Dummy flip chip bumps for reducing stress

Removable sacrificial connections for semiconductor devices

Stress-resilient chip structure and dicing process

Patents Applicationslast 30 patents

SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK

ELECTRONIC DEVICE

SUBSTRATE AND PACKAGE STRUCTURE

CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF

Triple-Sided Module

NON-VOLATILE MEMORY WITH EFFICIENT WORD LINE HOOK-UP

DOUBLE RESIST STRUCTURE FOR ELECTRODEPOSITION BONDING

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL INTEGRATED SYSTEM OF DRAM CHIP AND PREPARATION ME...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE COMPRISING A SUBSTRATE WITH A PAD INTERCONNECT COMPRISING A...

SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK

LOW COST RELIABLE FAN-OUT FAN-IN CHIP SCALE PACKAGE

CHIP PACKAGE STRUCTURE

Semiconductor Packaging Method, Semiconductor Assembly and Electron...

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Substrate and Package Structure

CHIP PACKAGE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

Filter and Capacitor Using Redistribution Layer and Micro Bump Layer

MULTI-CHIP MODULES

LOW COST RELIABLE FAN-OUT FAN-IN CHIP SCALE PACKAGE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Bonded Structures for Package and Substrate

MULTI-CHIP MODULES

Dummy Flip Chip Bumps for Reducing Stress

SEMICONDUCTOR PACKAGE WITH EXTERNALLY ACCESSIBLE WIREBONDS

Substrate and Package Structure