Release layers for moulds

Industry

CPC
H01L21/566

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/566Release layers for moulds

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,199,060
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Changbo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with cavity substrate
- Patent number 12,199,084
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit carrier with chip mounted thereon
- Patent number 12,198,993
- Issue date Jan 14, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,166,009
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,692
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 12,131,917
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release film and method of manufacturing release film
- Patent number 12,112,957
- Issue date Oct 8, 2024
- KOBAYASHI & CO., LTD.
- Keisuke Sakai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 12,094,835
- Issue date Sep 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacks and methods forming same
- Patent number 12,080,684
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,057,359
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,021,045
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 12,002,737
- Issue date Jun 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch BVA using reconstituted wafer with area array accessible...
- Patent number 11,990,382
- Issue date May 21, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
- Patent number 11,942,430
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release film and method of manufacturing release film
- Patent number 11,920,012
- Issue date Mar 5, 2024
- KOBAYASHI & CO., LTD.
- Keisuke Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,854,992
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,855,029
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with cavity substrate
- Patent number 11,855,059
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with alignment mark and manufacturing method...
- Patent number 11,842,902
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,837,526
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,837,578
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 11,837,556
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including different type semiconductor chips...
- Patent number 11,823,975
- Issue date Nov 21, 2023
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate and method for producing laminate
- Patent number 11,817,328
- Issue date Nov 14, 2023
- AGC Inc.
- Hirofumi Yamamoto
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Packaging method and packaging device for selectively encapsulating...
- Patent number 11,784,063
- Issue date Oct 10, 2023
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Jie Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250014913
- Publication date Jan 9, 2025
- Innolux Corporation
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR...
- Publication number 20250002719
- Publication date Jan 2, 2025
- Dow Toray Co., Ltd.
- Ryosuke YAMAZAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE SILICONE COMPOSITION, CURED OBJECT THEREFROM, AND METHOD FO...
- Publication number 20240384100
- Publication date Nov 21, 2024
- Dow Toray Co., Ltd.
- Ryosuke YAMAZAKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKS AND METHODS FORMING SAME
- Publication number 20240363590
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR
- Publication number 20240363519
- Publication date Oct 31, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355691
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...
- Publication number 20240347404
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM
- Publication number 20240304467
- Publication date Sep 12, 2024
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240304572
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240282674
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...
- Publication number 20240258243
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240234302
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASE FILM FOR SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREO...
- Publication number 20240222146
- Publication date Jul 4, 2024
- SILTECH CO., LTD.
- Goan-Hee Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
- Publication number 20240203895
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES
- Publication number 20240186301
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGES WITH 3D INTEGRATION
- Publication number 20240186303
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240178007
- Publication date May 30, 2024
- STMicroelectronics S.r.l.
- Marco ROVITTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240153785
- Publication date May 9, 2024
- Toyobo Co., Ltd.
- Tetsuo OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package with Cavity Substrate
- Publication number 20240105705
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088053
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD RELEASE FILM
- Publication number 20240075656
- Publication date Mar 7, 2024
- SUMITOMO BAKELITE CO., LTD.
- Shinichi Maesowa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR TREATMENT LIQUID AND METHOD FOR...
- Publication number 20240071782
- Publication date Feb 29, 2024
- Tokuyama Corporation
- Kohei SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047230
- Publication date Feb 8, 2024
- Resonac Corporation
- Tomoko HIGASHIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE
- Publication number 20240047231
- Publication date Feb 8, 2024
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047422
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047288
- Publication date Feb 8, 2024
- InnoLux Corporation
- Sheng-Nan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047297
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240047310
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Release layers for moulds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of fabricating the same

Fan-out package with cavity substrate

Manufacturing method of circuit carrier with chip mounted thereon

Semiconductor device packages and methods of manufacturing the same

Semiconductor package and manufacturing method thereof

Semiconductor packages and methods of forming same

Manufacturing method of package structure

Package structure with fan-out feature

Release film and method of manufacturing release film

Wire bonding method and apparatus for electromagnetic interference...

Formation method of chip package with fan-out structure

Die stacks and methods forming same

Semiconductor package and method of fabricating the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device and method of manufacture

Electronic package and method of fabricating the same

Fine pitch BVA using reconstituted wafer with area array accessible...

Stacked die modules for semiconductor device assemblies and methods...

Release film and method of manufacturing release film

Semiconductor structure and manufacturing method thereof

Semiconductor die connection system and method

Fan-out package with cavity substrate

Semiconductor package having an encapsulant comprising conductive f...

Semiconductor package with alignment mark and manufacturing method...

Semiconductor package structure and method for manufacturing the same

Package structure

Wire bonding method and apparatus for electromagnetic interference...

Semiconductor packages including different type semiconductor chips...

Laminate and method for producing laminate

Packaging method and packaging device for selectively encapsulating...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR...

CURABLE SILICONE COMPOSITION, CURED OBJECT THEREFROM, AND METHOD FO...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

DIE STACKS AND METHODS FORMING SAME

SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE

FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

RELEASE FILM FOR SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREO...

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

DOUBLE-SIDED MULTICHIP PACKAGES

MULTICHIP PACKAGES WITH 3D INTEGRATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC...

Fan-Out Package with Cavity Substrate

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MOLD RELEASE FILM

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

METHOD FOR PRODUCING SEMICONDUCTOR TREATMENT LIQUID AND METHOD FOR...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE

PACKAGE STRUCTURE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME