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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/566
Release layers for moulds
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Patents Grants
last 30 patents
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Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
Patent number
11,942,430
Issue date
Mar 26, 2024
Micron Technology, Inc.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Release film and method of manufacturing release film
Patent number
11,920,012
Issue date
Mar 5, 2024
KOBAYASHI & CO., LTD.
Keisuke Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,854,992
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die connection system and method
Patent number
11,855,029
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package with cavity substrate
Patent number
11,855,059
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
Patent number
11,842,946
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Xinyu Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with alignment mark and manufacturing method...
Patent number
11,842,902
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for manufacturing the same
Patent number
11,837,526
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Yang-Che Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,837,578
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
Patent number
11,837,556
Issue date
Dec 5, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Shaowu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages including different type semiconductor chips...
Patent number
11,823,975
Issue date
Nov 21, 2023
SK hynix Inc.
Hyun Chul Seo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminate and method for producing laminate
Patent number
11,817,328
Issue date
Nov 14, 2023
AGC Inc.
Hirofumi Yamamoto
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Packaging method and packaging device for selectively encapsulating...
Patent number
11,784,063
Issue date
Oct 10, 2023
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
Jie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally conductive material in the recess of an encapsulant and s...
Patent number
11,756,802
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packages and methods of manufacturing the same
Patent number
11,742,324
Issue date
Aug 29, 2023
Advanced Semiconductor Engineering, Inc.
Tang-Yuan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System for thinning substrate
Patent number
11,728,190
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device and semiconductor process
Patent number
11,721,645
Issue date
Aug 8, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Long Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with integrated voltage regulator
Patent number
11,715,691
Issue date
Aug 1, 2023
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package component, semiconductor package and manufacturing method t...
Patent number
11,682,619
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of fabricating the same
Patent number
11,682,648
Issue date
Jun 20, 2023
Samsung Electronics Co., Ltd.
Changbo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package with double-sided molding
Patent number
11,670,618
Issue date
Jun 6, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure
Patent number
11,640,954
Issue date
May 2, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Jeng-Nan Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin bonded interposer package
Patent number
11,621,243
Issue date
Apr 4, 2023
Amkor Technology Singapore Holding Pte Ltd.
Christopher J. Berry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,610,854
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package, packaging substrate, and methods for fabricatin...
Patent number
11,600,571
Issue date
Mar 7, 2023
Siliconware Precision Industries Co., Ltd.
Jun-Chang Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminate and method for producing laminate
Patent number
11,594,426
Issue date
Feb 28, 2023
AGC Inc.
Hirofumi Yamamoto
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Liquid compression molding encapsulants
Patent number
11,578,202
Issue date
Feb 14, 2023
Henkel AG & Co. KGaA
Jie Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin molding apparatus including release film feeder
Patent number
11,569,097
Issue date
Jan 31, 2023
Samsung Electronics Co., Ltd.
Chae-hun Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for removing a film from a surface
Patent number
11,548,273
Issue date
Jan 10, 2023
ASMPT SINGAPORE PTE. LTD.
Ji Yuan Hao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package electronic device
Patent number
11,552,005
Issue date
Jan 10, 2023
Texas Instruments Incorporated
Abram M. Castro
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Fan-Out Package with Cavity Substrate
Publication number
20240105705
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240088053
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHEN-HUA YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLD RELEASE FILM
Publication number
20240075656
Publication date
Mar 7, 2024
SUMITOMO BAKELITE CO., LTD.
Shinichi Maesowa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
Publication number
20240071865
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Xinyu Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR TREATMENT LIQUID AND METHOD FOR...
Publication number
20240071782
Publication date
Feb 29, 2024
Tokuyama Corporation
Kohei SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240047230
Publication date
Feb 8, 2024
Resonac Corporation
Tomoko HIGASHIUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE
Publication number
20240047231
Publication date
Feb 8, 2024
Hitachi Astemo, Ltd.
Yasuhiro TSUYUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20240047422
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240047288
Publication date
Feb 8, 2024
InnoLux Corporation
Sheng-Nan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
Publication number
20240047297
Publication date
Feb 8, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240047310
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing company Ltd.
YANG-CHE CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING OPTICAL DEVICE
Publication number
20240038747
Publication date
Feb 1, 2024
SEIKO NPC CORPORATION
Takahiro NAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical Circuit Body, Power Converter, and Electrical Circuit Bo...
Publication number
20240038611
Publication date
Feb 1, 2024
Hitachi Astemo, Ltd.
Ning TANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240030121
Publication date
Jan 25, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240014049
Publication date
Jan 11, 2024
Samsung Electronics Co., Ltd.
Chulho Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
Publication number
20240006377
Publication date
Jan 4, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20230411349
Publication date
Dec 21, 2023
Advanced Semiconductor Engineering, Inc.
Tang-Yuan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING S...
Publication number
20230395398
Publication date
Dec 7, 2023
AGC Inc.
Seigo KOTERA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230395452
Publication date
Dec 7, 2023
InnoLux Corporation
Cheng-Chi WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20230387059
Publication date
Nov 30, 2023
Samsung Electronics Co., Ltd.
Changbo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20230348759
Publication date
Nov 2, 2023
AGC Inc.
Satoshi TAKENAKA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
Publication number
20230343612
Publication date
Oct 26, 2023
Samsung Electronics Co., Ltd.
Minkyu Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE
Publication number
20230343666
Publication date
Oct 26, 2023
HARVATEK CORPORATION
Chin-Jui LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
Publication number
20230317693
Publication date
Oct 5, 2023
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230260899
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and Mould for Encapsulating Electronic Components Mounted on...
Publication number
20230211531
Publication date
Jul 6, 2023
BESI NETHERLANDS B.V.
Wilhelmus Gerardus Joseph Gal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATE AND METHOD FOR PRODUCING LAMINATE
Publication number
20230187227
Publication date
Jun 15, 2023
AGC Inc.
Hirofumi YAMAMOTO
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Application
METHOD OF PLACING PROTECTIVE MEMBER ON WORKPIECE
Publication number
20230187226
Publication date
Jun 15, 2023
Disco Corporation
Hideji HORITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTI...
Publication number
20230178385
Publication date
Jun 8, 2023
Showa Denko Materials Co., Ltd.
Takahiro KURODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RELEASE FILM FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THE...
Publication number
20230178383
Publication date
Jun 8, 2023
SILTECH CO., LTD.
Goan-Hee Yoon
B32 - LAYERED PRODUCTS