Removing process residues from vertical substrate surfaces

Industry

CPC
Y10S438/963

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

Current Industry

Y10S438/963Removing process residues from vertical substrate surfaces

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a semiconductor device including treatment with...
- Patent number 8,951,844
- Issue date Feb 10, 2015
- Fujitsu Semiconductor Limited
- Naomi Yanai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a high capacitance diode
- Patent number 8,222,115
- Issue date Jul 17, 2012
- Semiconductor Components Industries, LLC
- David D. Marreiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Trench schottky barrier diode with differential oxide thickness
- Patent number 8,143,655
- Issue date Mar 27, 2012
- International Rectifier Corporation
- Davide Chiola
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a high capacitance diode and structure therefor
- Patent number 8,143,701
- Issue date Mar 27, 2012
- Semiconductor Components Industries, LLC
- David D. Marreiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for increasing the removal rate of photoresist layer
- Patent number 8,129,101
- Issue date Mar 6, 2012
- Wen-Hsien Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated method for removal of halogen residues from etched subst...
- Patent number 7,846,845
- Issue date Dec 7, 2010
- Applied Materials, Inc.
- Kenneth J. Bahng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device and method to eliminate shorting induced by via to metal mis...
- Patent number 7,675,179
- Issue date Mar 9, 2010
- Agere Systems Inc.
- Ranbir Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a high capacitance diode and structure therefor
- Patent number 7,666,751
- Issue date Feb 23, 2010
- Semiconductor Components Industries, LLC
- David D. Marreiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor devices
- Patent number 7,531,434
- Issue date May 12, 2009
- United Microelectronics Corp.
- Wen-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for the removal of sidewall residues
- Patent number 7,531,492
- Issue date May 12, 2009
- BASF SE
- Raimund Mellies
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method for producing a packaged integrated circuit
- Patent number 7,465,977
- Issue date Dec 16, 2008
- Microbridge Technologies Inc.
- Leslie M. Landsberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ultra thin back-illuminated photodiode array fabrication methods
- Patent number 7,462,553
- Issue date Dec 9, 2008
- Semicoa
- Richard A. Metzler
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Composition for the removing of sidewall residues
- Patent number 7,417,016
- Issue date Aug 26, 2008
- BASF SE
- Raimund Mellies
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method of manufacturing electronic device
- Patent number 7,347,951
- Issue date Mar 25, 2008
- Kabushiki Kaisha Toshiba
- Ikuo Uematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming dual damascenes with supercritical fluid treatments
- Patent number 7,332,449
- Issue date Feb 19, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench Schottky barrier diode with differential oxide thickness
- Patent number 7,323,402
- Issue date Jan 29, 2008
- International Rectifier Corporation
- Davide Chiola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing mottled etch in semiconductor fabricating process
- Patent number 7,276,452
- Issue date Oct 2, 2007
- Dongbu Electronics Co., Ltd.
- Hyung Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication therefor
- Patent number 7,273,824
- Issue date Sep 25, 2007
- United Microelectronics Corp.
- Yi-Ching Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Selective etching of carbon-doped low-k dielectrics
- Patent number 7,256,134
- Issue date Aug 14, 2007
- Applied Materials, Inc.
- Yunsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method to eliminate shorting induced by via to metal mis...
- Patent number 7,235,489
- Issue date Jun 26, 2007
- Agere Systems Inc.
- Ranbir Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device having a metal layer
- Patent number 7,208,424
- Issue date Apr 24, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing post-etch residue from wafer surface
- Patent number 7,192,878
- Issue date Mar 20, 2007
- United Microelectronics Corp.
- Cheng-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for processing samples
- Patent number 7,132,293
- Issue date Nov 7, 2006
- Hitachi, Ltd.
- Yoshimi Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for removal of photoresist mask used for making vias in low...
- Patent number 7,071,113
- Issue date Jul 4, 2006
- LSI Logic Corporation
- Yong-Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display device and fabricating method thereof, and r...
- Patent number 7,022,537
- Issue date Apr 4, 2006
- LG.Philips LCD Co., Ltd.
- Kyo Ho Moon
- G02 - OPTICS
Information Patent Grant
Method of manufacturing electronic device
- Patent number 7,018,552
- Issue date Mar 28, 2006
- Kabushiki Kaisha Toshiba
- Ikuo Uematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of treating surfaces of substrates
- Patent number 7,001,845
- Issue date Feb 21, 2006
- Micron Technology, Inc.
- Scott E. Moore
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for processing samples
- Patent number 6,989,228
- Issue date Jan 24, 2006
- Hitachi, Ltd.
- Masayuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ photoresist removal by an attachable chamber with light source
- Patent number 6,929,713
- Issue date Aug 16, 2005
- Taiwan Semiconductor Manufacturing Company
- Chiang Jen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench Schottky barrier diode
- Patent number 6,855,593
- Issue date Feb 15, 2005
- International Rectifier Corporation
- Kohji Andoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20120322226
- Publication date Dec 20, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Naomi Yanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HIGH CAPACITANCE DIODE
- Publication number 20120142171
- Publication date Jun 7, 2012
- David D. Marreiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HIGH CAPACITANCE DIODE AND STRUCTURE THEREFOR
- Publication number 20100072573
- Publication date Mar 25, 2010
- David D. Marreiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INCREASING THE REMOVAL RATE OF PHOTORESIST LAYER
- Publication number 20090169767
- Publication date Jul 2, 2009
- United Microelectronics Corp.
- Wen-Hsien Huang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FORMING A HIGH CAPACITANCE DIODE AND STRUCTURE THEREFOR
- Publication number 20090079032
- Publication date Mar 26, 2009
- David D. Marreiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR THE REMOVAL OF SIDEWALL RESIDUES
- Publication number 20080280803
- Publication date Nov 13, 2008
- Raimund Mellies
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTEGRATED METHOD FOR REMOVAL OF HALOGEN RESIDUES FROM ETCHED SUBST...
- Publication number 20080099040
- Publication date May 1, 2008
- Kenneth J. Bahng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Schottky barrier diode with differential oxide thickness
- Publication number 20080087896
- Publication date Apr 17, 2008
- International Rectifier Corporation
- Davide Chiola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming dual damascenes with supercritical fluid treatments
- Publication number 20070241455
- Publication date Oct 18, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD TO ELIMINATE SHORTING INDUCED BY VIA TO METAL MIS...
- Publication number 20070190803
- Publication date Aug 16, 2007
- Agere Systems Inc.
- Ranbir Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE
- Publication number 20070125750
- Publication date Jun 7, 2007
- Cheng-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF REMOVING PHOTORESIST AND FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20070093031
- Publication date Apr 26, 2007
- Wen-Hsien Huang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE
- Publication number 20060252256
- Publication date Nov 9, 2006
- Cheng-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composition for the removing of sidewall residues
- Publication number 20060086372
- Publication date Apr 27, 2006
- Raimund Mellies
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductive substrate cleaning systems
- Publication number 20060076040
- Publication date Apr 13, 2006
- Scott E. Moore
- B08 - CLEANING
Information Patent Application
Method for producing a packaged integrated circuit
- Publication number 20060063292
- Publication date Mar 23, 2006
- Leslie M Landsberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming a semiconductor device having a metal layer
- Publication number 20060063364
- Publication date Mar 23, 2006
- Tab A. Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[SEMICONDUCTOR STRUCTURE AND FABRICATION THEREFOR]
- Publication number 20060006545
- Publication date Jan 12, 2006
- Yi-Ching Wu
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing electronic device
- Publication number 20050277291
- Publication date Dec 15, 2005
- Kabushiki Kaisha Toshiba
- Ikuo Uematsu
- G02 - OPTICS
Information Patent Application
Device and method to eliminate shorting induced by via to metal mis...
- Publication number 20050260843
- Publication date Nov 24, 2005
- Agere Systems Inc.
- Ranbir Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra thin back-illuminated photodiode array fabrication methods
- Publication number 20050221541
- Publication date Oct 6, 2005
- Richard A. Metzler
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for removing mottled etch in semiconductor fabricating process
- Publication number 20050153568
- Publication date Jul 14, 2005
- DongbuAnam Semiconductor Inc.
- Kim Hyung Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench schottky barrier diode with differential oxide thickness
- Publication number 20050127465
- Publication date Jun 16, 2005
- International Rectifier Corporation
- Davide Chiola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective etching of carbon-doped low-k dielectrics
- Publication number 20050026430
- Publication date Feb 3, 2005
- APPLIED MATERIALS, INC.
- Yunsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of treating surfaces of substrates
- Publication number 20040224614
- Publication date Nov 11, 2004
- Scott E. Moore
- B08 - CLEANING
Information Patent Application
Method and apparatus for processing samples
- Publication number 20040219687
- Publication date Nov 4, 2004
- Yoshimi Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONTACT HOLE OF SEMICONDUCTOR DEVICE
- Publication number 20040214421
- Publication date Oct 28, 2004
- Ho Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid crystal display device and fabricating method thereof, and r...
- Publication number 20040091641
- Publication date May 13, 2004
- LG. Phillips LCD Co., Ltd.
- Kyo Ho Moon
- G02 - OPTICS
Information Patent Application
Liquid crystal display device and fabricating method thereof, and r...
- Publication number 20040091640
- Publication date May 13, 2004
- LG. Phillips LCD Co., Ltd.
- Kyo Ho Moon
- G02 - OPTICS
Information Patent Application
Process for removal of photoresist mask used for making vias in low...
- Publication number 20040072440
- Publication date Apr 15, 2004
- Yong-Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Removing process residues from vertical substrate surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of producing a semiconductor device including treatment with...

Method of forming a high capacitance diode

Trench schottky barrier diode with differential oxide thickness

Method of forming a high capacitance diode and structure therefor

Method for increasing the removal rate of photoresist layer

Integrated method for removal of halogen residues from etched subst...

Device and method to eliminate shorting induced by via to metal mis...

Method of forming a high capacitance diode and structure therefor

Method of fabricating semiconductor devices

Composition for the removal of sidewall residues

Method for producing a packaged integrated circuit

Ultra thin back-illuminated photodiode array fabrication methods

Composition for the removing of sidewall residues

Method of manufacturing electronic device

Method for forming dual damascenes with supercritical fluid treatments

Trench Schottky barrier diode with differential oxide thickness

Method for removing mottled etch in semiconductor fabricating process

Semiconductor structure and fabrication therefor

Selective etching of carbon-doped low-k dielectrics

Device and method to eliminate shorting induced by via to metal mis...

Method of forming a semiconductor device having a metal layer

Method for removing post-etch residue from wafer surface

Method and apparatus for processing samples

Process for removal of photoresist mask used for making vias in low...

Liquid crystal display device and fabricating method thereof, and r...

Method of manufacturing electronic device

Methods of treating surfaces of substrates

Method and apparatus for processing samples

In-situ photoresist removal by an attachable chamber with light source

Trench Schottky barrier diode

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PRODUCTION METHOD

METHOD OF FORMING A HIGH CAPACITANCE DIODE

METHOD OF FORMING A HIGH CAPACITANCE DIODE AND STRUCTURE THEREFOR

METHOD FOR INCREASING THE REMOVAL RATE OF PHOTORESIST LAYER

METHOD OF FORMING A HIGH CAPACITANCE DIODE AND STRUCTURE THEREFOR

COMPOSITION FOR THE REMOVAL OF SIDEWALL RESIDUES

INTEGRATED METHOD FOR REMOVAL OF HALOGEN RESIDUES FROM ETCHED SUBST...

Trench Schottky barrier diode with differential oxide thickness

Method for forming dual damascenes with supercritical fluid treatments

DEVICE AND METHOD TO ELIMINATE SHORTING INDUCED BY VIA TO METAL MIS...

METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE

METHODS OF REMOVING PHOTORESIST AND FABRICATING SEMICONDUCTOR DEVICES

METHOD FOR REMOVING POST-ETCH RESIDUE FROM WAFER SURFACE

Composition for the removing of sidewall residues

Semiconductive substrate cleaning systems

Method for producing a packaged integrated circuit

Method of forming a semiconductor device having a metal layer

[SEMICONDUCTOR STRUCTURE AND FABRICATION THEREFOR]

Method of manufacturing electronic device

Device and method to eliminate shorting induced by via to metal mis...

Ultra thin back-illuminated photodiode array fabrication methods

Method for removing mottled etch in semiconductor fabricating process

Trench schottky barrier diode with differential oxide thickness

Selective etching of carbon-doped low-k dielectrics

Methods of treating surfaces of substrates

Method and apparatus for processing samples

METHOD FOR FORMING CONTACT HOLE OF SEMICONDUCTOR DEVICE

Liquid crystal display device and fabricating method thereof, and r...

Liquid crystal display device and fabricating method thereof, and r...

Process for removal of photoresist mask used for making vias in low...