Reshaping the bump connector in the bonding apparatus

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CPC
H01L2224/8103

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8103Reshaping the bump connector in the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with nickel layer
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- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic component, wherein a semiconduct...
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- Issue date Dec 12, 2023
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer
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- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer and method fo...
- Patent number 11,302,537
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor chip
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- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
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- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on-package method
- Patent number 9,812,430
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit chip-to-chip interconnection scheme
- Patent number 4,937,653
- Issue date Jun 26, 1990
- American Telephone and Telegraph Company
- Greg E. Blonder
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
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- Publication date Nov 21, 2024
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- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
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- Publication date Oct 19, 2023
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- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL-COLOR LIGHT-EMITTING DIODE MICRO-DISPLAY AND THE FABRICATION M...
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- Publication date Aug 31, 2023
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
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Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER
- Publication number 20220238352
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Electronic Component, Wherein a Semiconduct...
- Publication number 20210351156
- Publication date Nov 11, 2021
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...
- Publication number 20210313195
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20180350767
- Publication date Dec 6, 2018
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- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20170179069
- Publication date Jun 22, 2017
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package-on-Package Method
- Publication number 20170040298
- Publication date Feb 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
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- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Reshaping the bump connector in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with nickel layer

Method for producing an electronic component, wherein a semiconduct...

Chip package structure with conductive adhesive layer

Chip package structure with conductive adhesive layer and method fo...

Method for producing semiconductor chip

Method for producing semiconductor package

Method of manufacturing an electronic device, and electronic device...

Package on-package method

Semiconductor integrated circuit chip-to-chip interconnection scheme

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

FULL-COLOR LIGHT-EMITTING DIODE MICRO-DISPLAY AND THE FABRICATION M...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER

Method for Producing an Electronic Component, Wherein a Semiconduct...

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE ADHESIVE LAYER AND METHOD FO...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

BALL GRID ARRAY SOLDER ATTACHMENT

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

BALL GRID ARRAY SOLDER ATTACHMENT

Package-on-Package Method

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...