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H01L2224/8393

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,635
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a back via stack
- Patent number 11,935,908
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Mihye Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,862,601
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- Min Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device
- Patent number 11,742,319
- Issue date Aug 29, 2023
- Innolux Corporation
- Yi-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical wafer alignment detection for bonding process
- Patent number 11,688,717
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor structure
- Patent number 11,658,070
- Issue date May 23, 2023
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,410,966
- Issue date Aug 9, 2022
- Samsung Display Co., Ltd.
- Min Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED-OLED hybrid self-emissive display
- Patent number 11,380,738
- Issue date Jul 5, 2022
- HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
- Lei Zhang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bonded die assembly containing a manganese-containing oxide bonding...
- Patent number 11,362,079
- Issue date Jun 14, 2022
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,923,465
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for direct bonding of III-V semiconductor substrates with a...
- Patent number 10,586,783
- Issue date Mar 10, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polymer-assisted chip transfer
- Patent number 10,388,516
- Issue date Aug 20, 2019
- Facebook Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including inverted memory stack str...
- Patent number 10,381,362
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips and method...
- Patent number 10,354,985
- Issue date Jul 16, 2019
- Samsung Electronics Co., Ltd.
- Won-Gi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules with semiconductor dies bonded to a metal foil
- Patent number 10,192,849
- Issue date Jan 29, 2019
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded electronics package
- Patent number 10,141,203
- Issue date Nov 27, 2018
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded semiconductor dev...
- Patent number 9,653,438
- Issue date May 16, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectric packages having deformed bonded leads and methods the...
- Patent number 6,848,173
- Issue date Feb 1, 2005
- Tessera, Inc.
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
- Publication number 20230420437
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME
- Publication number 20230387373
- Publication date Nov 30, 2023
- Nichia Corporation.
- Hiroki TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
- Publication number 20230282612
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230282618
- Publication date Sep 7, 2023
- UltraMemory Inc.
- Ichiro HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
- Publication number 20230087367
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
- Publication number 20230066893
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220352117
- Publication date Nov 3, 2022
- SAMSUNG DISPLAY CO., LTD.
- Min Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME
- Publication number 20220336427
- Publication date Oct 20, 2022
- Seoul Viosys Co., Ltd.
- Jong Min JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220093462
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220084884
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING A BACK VIA STACK
- Publication number 20220028915
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- Mihye JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220020656
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
- Publication date Dec 23, 2021
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS
- Publication number 20210358883
- Publication date Nov 18, 2021
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210125956
- Publication date Apr 29, 2021
- SAMSUNG DISPLAY CO., LTD.
- Min Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20190273075
- Publication date Sep 5, 2019
- Samsung Electronics Co., Ltd.
- WON-GI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively parallel transfer of microLED devices
- Publication number 20180190614
- Publication date Jul 5, 2018
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20170365591
- Publication date Dec 21, 2017
- Samsung Electronics Co., Ltd.
- WON-GI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATES
- Publication number 20170133347
- Publication date May 11, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hubert MORICEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEV...
- Publication number 20160056136
- Publication date Feb 25, 2016
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making microelectronic assemblies
- Publication number 20050155223
- Publication date Jul 21, 2005
- Tessera, Inc.
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages having deformed bonded leads and methods t...
- Publication number 20020068426
- Publication date Jun 6, 2002
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode and display apparatus having the same

Semiconductor package and method of fabricating the same

Electronic device and display device using the same

Image sensor including a back via stack

Display device and method of manufacturing the same

Seal ring structures and methods of forming same

Method of manufacturing electronic device

Mechanical wafer alignment detection for bonding process

Method of forming semiconductor structure

Display device and method of manufacturing the same

LED-OLED hybrid self-emissive display

Bonded die assembly containing a manganese-containing oxide bonding...

Seal ring structures and methods of forming same

Semiconductor device having stacked semiconductor chips and method...

Seal ring structures and methods of forming same

Micro-selective sintering laser systems and methods thereof

Method for direct bonding of III-V semiconductor substrates with a...

Seal ring structures and methods of forming same

Method for polymer-assisted chip transfer

Three-dimensional memory device including inverted memory stack str...

Semiconductor device having stacked semiconductor chips and method...

Semiconductor modules with semiconductor dies bonded to a metal foil

Electrical interconnect structure for an embedded electronics package

UV-curable anisotropic conductive adhesive

Electrical interconnect structure for an embedded semiconductor dev...

Microelectric packages having deformed bonded leads and methods the...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

Integrated Circuit Package and Method

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

IMAGE SENSOR INCLUDING A BACK VIA STACK

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

Massively parallel transfer of microLED devices

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

SEMICONDUCTOR DEVICE HAVING STACKED SEMICONDUCTOR CHIPS AND METHOD...

METHOD FOR MANUFACTURING SUBSTRATES

ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEV...

Methods of making microelectronic assemblies

Microelectronic packages having deformed bonded leads and methods t...