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H01L2224/8493

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240072009
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230114535
- Publication date Apr 13, 2023
- STMicroelectronics S.r.l
- Matteo DE SANTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP INTERCONNECT WITH MICRO CONTACT HEADS
- Publication number 20220181290
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Emmanuel Silvestre RAMOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Related Methods
- Publication number 20200286865
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS