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Resin particles

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  • CPC
  • H05K2201/0212
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0212Resin particles
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
    • Publication number 20250048560
    • Publication date Feb 6, 2025
    • SEKISUI CHEMICAL CO., LTD.
    • Satoru KUROZUMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250008645
    • Publication date Jan 2, 2025
    • IBIDEN CO., LTD.
    • Youhong WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...
    • Publication number 20240343027
    • Publication date Oct 17, 2024
    • LG ELECTRONICS INC.
    • Takashi KINO
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...
    • Publication number 20240334614
    • Publication date Oct 3, 2024
    • SOLUM CO., LTD.
    • Jun Kyu Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240284606
    • Publication date Aug 22, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240268034
    • Publication date Aug 8, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jesang Park
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICRO LIGHT-EMITTING PACKAGE
    • Publication number 20240268019
    • Publication date Aug 8, 2024
    • Lextar Electronics Corporation
    • Hsin-Lun SU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240268038
    • Publication date Aug 8, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240244762
    • Publication date Jul 18, 2024
    • IBIDEN CO., LTD.
    • Nobuhisa KURODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE ELECTRONIC COMPONENT
    • Publication number 20240222026
    • Publication date Jul 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Heon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAMERA MODULE PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE...
    • Publication number 20240224419
    • Publication date Jul 4, 2024
    • TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    • KUEI-FENG PENG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240206051
    • Publication date Jun 20, 2024
    • Murata Manufacturing Co., Ltd.
    • Kaori KOIZUMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240155778
    • Publication date May 9, 2024
    • Shinko Electric Industries Co., Ltd.
    • Akihiro TAKEUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...
    • Publication number 20240147627
    • Publication date May 2, 2024
    • Panasonic Intellectual Property Management Co., Ltd.
    • Tomohiro FUKAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD, METAL-CLAD LAMI...
    • Publication number 20240147609
    • Publication date May 2, 2024
    • Panasonic Intellectual Property Management Co., Ltd.
    • Tomohiro FUKAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240107685
    • Publication date Mar 28, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240107684
    • Publication date Mar 28, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC CIRCUIT MODULE
    • Publication number 20240090134
    • Publication date Mar 14, 2024
    • MURATA MANUFACTURING CO., LTD.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND PRODUCT
    • Publication number 20240090175
    • Publication date Mar 14, 2024
    • Beji SASAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROTECTION CIRCUIT UNIT AND METHOD OF BONDING LEAD PORTIONS AND PRO...
    • Publication number 20240074061
    • Publication date Feb 29, 2024
    • LG ENERGY SOLUTION, LTD.
    • Sang Jin KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20240057255
    • Publication date Feb 15, 2024
    • ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
    • Stanley Buchert
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC CIRCUIT MODULE
    • Publication number 20230413418
    • Publication date Dec 21, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Toru Komatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230276570
    • Publication date Aug 31, 2023
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    • Publication number 20230232540
    • Publication date Jul 20, 2023
    • Sumitomo Electric Industries, Ltd.
    • Shoichiro SAKAI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    METHOD FOR PRODUCING ELECTRICAL CIRCUITRY ON FILLED ORGANIC POLYMERS
    • Publication number 20230225058
    • Publication date Jul 13, 2023
    • DUPONT SAFETY & CONSTRUCTION, INC.
    • Timothy Scott Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20230209729
    • Publication date Jun 29, 2023
    • Shinko Electric Industries Co., Ltd.
    • Junichi NAKAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMBEDDED PRINTED CIRCUIT BOARD
    • Publication number 20230199967
    • Publication date Jun 22, 2023
    • Shinko Electric Industries Co., Ltd.
    • Seiji Sato
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITION FOR FORMING A CONFORMAL COATING ON AN ELECTRONIC DEVICE
    • Publication number 20230193045
    • Publication date Jun 22, 2023
    • actnano, Inc.
    • Syed Taymur Ahmad
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230080335
    • Publication date Mar 16, 2023
    • IBIDEN CO., LTD.
    • Satoru KAWAI
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    INTERCONNECT SUBSTRATE
    • Publication number 20230054390
    • Publication date Feb 23, 2023
    • Shinko Electric Industries Co., Ltd.
    • Rie MIZUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR