Resist stripping

Industry

CPC
H01J2237/3342

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/3342Resist stripping

Industries

Patents Grantslast 30 patents

Information Patent Grant
Gas distribution plate with UV blocker
- Patent number 12,130,561
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas supply ring and substrate processing apparatus
- Patent number 12,087,553
- Issue date Sep 10, 2024
- Tokyo Electron Limited
- Yoshitomo Konta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 12,051,589
- Issue date Jul 30, 2024
- Lam Research Corporation
- David Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,020,942
- Issue date Jun 25, 2024
- ULVAC, Inc.
- Taichi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 11,784,047
- Issue date Oct 10, 2023
- Lam Research Corporation
- David Charles Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal etching with in situ plasma ashing
- Patent number 11,699,596
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing substrate
- Patent number 11,658,036
- Issue date May 23, 2023
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing target object
- Patent number 11,380,551
- Issue date Jul 5, 2022
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 11,183,383
- Issue date Nov 23, 2021
- Lam Research Corporation
- David Charles Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 11,031,245
- Issue date Jun 8, 2021
- Lan Research Corporation
- David Charles Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma spreading apparatus and method of spreading plasma in proces...
- Patent number 10,840,068
- Issue date Nov 17, 2020
- Yield Engineering Systems, Inc.
- William Moffat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support with thermal zones for semiconductor processing
- Patent number 10,720,346
- Issue date Jul 21, 2020
- Lam Research Corporation
- Harmeet Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatuses and substrate processing methods
- Patent number 10,566,181
- Issue date Feb 18, 2020
- ASM IP Holding B.V.
- Yukihiro Mori
- B08 - CLEANING
Information Patent Grant
Method of processing target object
- Patent number 10,475,659
- Issue date Nov 12, 2019
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing contact areas on a semiconductor substrate
- Patent number 10,332,850
- Issue date Jun 25, 2019
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing target object
- Patent number 10,217,643
- Issue date Feb 26, 2019
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implanted photoresist stripping process
- Patent number 10,078,266
- Issue date Sep 18, 2018
- Mattson Technology, Inc.
- Wei-Hua Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dose implantation strip (HDIS) in H2 base chemistry
- Patent number 9,941,108
- Issue date Apr 10, 2018
- Novellus Systems, Inc.
- Haruhiro Harry Goto
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 9,824,893
- Issue date Nov 21, 2017
- Lam Research Corporation
- David Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating plate with heating zones for substrate processing and metho...
- Patent number 9,646,861
- Issue date May 9, 2017
- Lam Research Corporation
- Harmeet Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bare aluminum baffles for resist stripping chambers
- Patent number 8,859,432
- Issue date Oct 14, 2014
- Lam Research Corporation
- Fred D. Egley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High dose implantation strip (HDIS) in H2 base chemistry
- Patent number 8,641,862
- Issue date Feb 4, 2014
- Novellus Systems, Inc.
- Haruhiro Harry Goto
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Manufacturing method for wiring
- Patent number 8,460,857
- Issue date Jun 11, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bare aluminum baffles for resist stripping chambers
- Patent number 8,313,635
- Issue date Nov 20, 2012
- Lam Research Corporation
- Fred D. Egley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma ashing apparatus and endpoint detection process
- Patent number 8,268,181
- Issue date Sep 18, 2012
- Axcelis Technologies, Inc.
- Aseem Kumar Srivastava
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
High dose implantation strip (HDIS) in H2 base chemistry
- Patent number 8,193,096
- Issue date Jun 5, 2012
- Novellus Systems, Inc.
- Haruhiro Harry Goto
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Advanced processing technique and system for preserving tungsten in...
- Patent number 8,093,157
- Issue date Jan 10, 2012
- Mattson Technology, Inc.
- Li Diao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for wiring
- Patent number 8,053,174
- Issue date Nov 8, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas distribution plate assembly for plasma reactors
- Patent number 7,892,357
- Issue date Feb 22, 2011
- Axcelis Technologies, Inc.
- Aseem K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare aluminum baffles for resist stripping chambers
- Patent number 7,811,409
- Issue date Oct 12, 2010
- Lam Research Corporation
- Fred D. Egley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD
- Publication number 20240304453
- Publication date Sep 12, 2024
- Ulvac, Inc.
- Taichi SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REMOVABLE MASK LAYER TO REDUCE OVERHANG DURING RE-SPUTTER PROCESS I...
- Publication number 20240249920
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Wenting HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240030010
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20240030031
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- David Charles Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE...
- Publication number 20240021413
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- JAEHYUN PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230282447
- Publication date Sep 7, 2023
- TOKYO ELECTRON LIMITED
- Takahiro YONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING CARRIER AND SUBSTRATE TREATING SYSTEM
- Publication number 20220367155
- Publication date Nov 17, 2022
- SEMES CO., LTD.
- MUN GI JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20220344167
- Publication date Oct 27, 2022
- Ulvac, Inc.
- Taichi SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METAL ETCHING WITH IN SITU PLASMA ASHING
- Publication number 20220336228
- Publication date Oct 20, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hsing-Hsiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SUPPLY RING AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20220108873
- Publication date Apr 7, 2022
- TOKYO ELECTRON LIMITED
- Yoshitomo KONTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20220093367
- Publication date Mar 24, 2022
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Strip Tool With Movable Insert
- Publication number 20220068611
- Publication date Mar 3, 2022
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- B08 - CLEANING
Information Patent Application
TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20220005694
- Publication date Jan 6, 2022
- LAM RESEARCH CORPORATION
- David Charles Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20210242019
- Publication date Aug 5, 2021
- LAM RESEARCH CORPORATION
- David Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Spreading Apparatus And System
- Publication number 20210013013
- Publication date Jan 14, 2021
- YIELD ENGINEERING SYSTEMS, INC.
- WILLIAM MOFFAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20200219725
- Publication date Jul 9, 2020
- LAM RESEARCH CORPORATION
- David Charles Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL ETCHING WITH IN SITU PLASMA ASHING
- Publication number 20200176269
- Publication date Jun 4, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hsing-Hsiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ASHING OF COATED SUBSTRATES
- Publication number 20200126769
- Publication date Apr 23, 2020
- HZO, Inc.
- Robert Askin
- B08 - CLEANING
Information Patent Application
Plasma Processing Apparatus and Methods
- Publication number 20190198301
- Publication date Jun 27, 2019
- Mattson Technology, Inc.
- Shawming Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING TARGET OBJECT
- Publication number 20190088496
- Publication date Mar 21, 2019
- TOKYO ELECTRON LIMITED
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20180012759
- Publication date Jan 11, 2018
- LAM RESEARCH CORPORATION
- David Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DOSE IMPLANTATION STRIP (HDIS) IN H2 BASE CHEMISTRY
- Publication number 20140182619
- Publication date Jul 3, 2014
- Novellus Systems, Inc.
- Haruhiro Harry Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DOPING METHOD AND APPARATUS
- Publication number 20130323916
- Publication date Dec 5, 2013
- PANASONIC CORPORATION
- Tomohiro Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE ALUMINUM BAFFLES FOR RESIST STRIPPING CHAMBERS
- Publication number 20130056022
- Publication date Mar 7, 2013
- LAM RESEARCH CORPORATION
- Fred D. Egley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH DOSE IMPLANTATION STRIP (HDIS) IN H2 BASE CHEMISTRY
- Publication number 20120211473
- Publication date Aug 23, 2012
- Haruhiro Harry Goto
- C01 - INORGANIC CHEMISTRY
Information Patent Application
PLASMA MEDIATED ASHING PROCESSES
- Publication number 20120024314
- Publication date Feb 2, 2012
- Axcelis Technologies, Inc.
- SHIJIAN LUO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
BARE ALUMINUM BAFFLES FOR RESIST STRIPPING CHAMBERS
- Publication number 20100319813
- Publication date Dec 23, 2010
- LAM RESEARCH CORPORATION
- Fred D. Egley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ASHING APPARATUS AND ENDPOINT DETECTION PROCESS
- Publication number 20100055807
- Publication date Mar 4, 2010
- Axcelis Technologies, Inc.
- Aseem Kumar Srivastava
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Plasma Doping Method and Apparatus
- Publication number 20090181526
- Publication date Jul 16, 2009
- Tomohiro Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asher, Ashing Method and Impurity Doping Apparatus
- Publication number 20090104783
- Publication date Apr 23, 2009
- Cheng-Guo Jin
- H01 - BASIC ELECTRIC ELEMENTS

Resist stripping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gas distribution plate with UV blocker

Gas supply ring and substrate processing apparatus

Tin oxide thin film spacers in semiconductor device manufacturing

Etching method

Tin oxide thin film spacers in semiconductor device manufacturing

Metal etching with in situ plasma ashing

Apparatus for processing substrate

Method of processing target object

Tin oxide thin film spacers in semiconductor device manufacturing

Tin oxide thin film spacers in semiconductor device manufacturing

Plasma spreading apparatus and method of spreading plasma in proces...

Substrate support with thermal zones for semiconductor processing

Substrate processing apparatuses and substrate processing methods

Method of processing target object

Method for producing contact areas on a semiconductor substrate

Method of processing target object

Implanted photoresist stripping process

High dose implantation strip (HDIS) in H2 base chemistry

Tin oxide thin film spacers in semiconductor device manufacturing

Heating plate with heating zones for substrate processing and metho...

Bare aluminum baffles for resist stripping chambers

High dose implantation strip (HDIS) in H2 base chemistry

Manufacturing method for wiring

Bare aluminum baffles for resist stripping chambers

Plasma ashing apparatus and endpoint detection process

High dose implantation strip (HDIS) in H2 base chemistry

Advanced processing technique and system for preserving tungsten in...

Manufacturing method for wiring

Gas distribution plate assembly for plasma reactors

Bare aluminum baffles for resist stripping chambers

Patents Applicationslast 30 patents

ETCHING METHOD

REMOVABLE MASK LAYER TO REDUCE OVERHANG DURING RE-SPUTTER PROCESS I...

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE...

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

RING CARRIER AND SUBSTRATE TREATING SYSTEM

ETCHING METHOD

METAL ETCHING WITH IN SITU PLASMA ASHING

GAS SUPPLY RING AND SUBSTRATE PROCESSING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

Plasma Strip Tool With Movable Insert

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

Plasma Spreading Apparatus And System

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

METAL ETCHING WITH IN SITU PLASMA ASHING

PLASMA ASHING OF COATED SUBSTRATES

Plasma Processing Apparatus and Methods

METHOD OF PROCESSING TARGET OBJECT

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

HIGH DOSE IMPLANTATION STRIP (HDIS) IN H2 BASE CHEMISTRY

PLASMA DOPING METHOD AND APPARATUS

BARE ALUMINUM BAFFLES FOR RESIST STRIPPING CHAMBERS

HIGH DOSE IMPLANTATION STRIP (HDIS) IN H2 BASE CHEMISTRY

PLASMA MEDIATED ASHING PROCESSES

BARE ALUMINUM BAFFLES FOR RESIST STRIPPING CHAMBERS

PLASMA ASHING APPARATUS AND ENDPOINT DETECTION PROCESS

Plasma Doping Method and Apparatus

Asher, Ashing Method and Impurity Doping Apparatus