Resistors or by disposing resistive or lossy substances in or near power planes

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0234Resistors or by disposing resistive or lossy substances in or near power planes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic control device
- Patent number 12,213,294
- Issue date Jan 28, 2025
- Hitachi Astemo, Ltd.
- Masahiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and circuit board
- Patent number 12,185,452
- Issue date Dec 31, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Rui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF absorbing structures
- Patent number 12,185,453
- Issue date Dec 31, 2024
- Pivotal Commware, Inc.
- Jay Howard McCandless
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and system of surface wave mitigation for multiple-input-...
- Patent number 12,013,481
- Issue date Jun 18, 2024
- Intel Corporation
- Arnaud Lucres Amadjikpe
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,602,054
- Issue date Mar 7, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and system of surface wave mitigation for multiple-input-...
- Patent number 11,598,842
- Issue date Mar 7, 2023
- Intel Corporation
- Arnaud Lucres Amadjikpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and configuration adjustment method for the...
- Patent number 11,133,280
- Issue date Sep 28, 2021
- Realtek Semiconductor Corp.
- Chung-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 11,064,615
- Issue date Jul 13, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sideband conductor resonance mitigation
- Patent number 10,999,924
- Issue date May 4, 2021
- Intel Corporation
- Timothy D. Wig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and switching power supply
- Patent number 10,980,109
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Shingo Hashiguchi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Printed circuit board and switching power supply for electronic app...
- Patent number 10,667,383
- Issue date May 26, 2020
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sideband conductor resonance mitigation
- Patent number 10,602,607
- Issue date Mar 24, 2020
- Intel Corporation
- Timothy D. Wig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) with stubs coupled to electromagnetic a...
- Patent number 10,524,351
- Issue date Dec 31, 2019
- QUALCOMM Incorporated
- Yu Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sideband conductor resonance mitigation
- Patent number 10,517,168
- Issue date Dec 24, 2019
- Intel Corporation
- Timothy D. Wig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defected ground structure with void having resistive material along...
- Patent number 10,499,489
- Issue date Dec 3, 2019
- Hewlett Packard Enterprise Development LP
- Karl J. Bois
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and switching power supply
- Patent number 10,470,295
- Issue date Nov 5, 2019
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic equipment
- Patent number 10,304,496
- Issue date May 28, 2019
- TOSHIBA MEMORY CORPORATION
- Shinichi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic composite filter
- Patent number 10,236,857
- Issue date Mar 19, 2019
- Joinset Co., Ltd.
- Sun-Ki Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for transmitting differential data signals
- Patent number 10,178,762
- Issue date Jan 8, 2019
- Leoni Kabel Holding GmbH
- Bernd Janssen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor integrated circuit device, printed board and manufact...
- Patent number 10,123,426
- Issue date Nov 6, 2018
- Renesas Electronics Corporation
- Takafumi Betsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sideband conductor resonance mitigation
- Patent number 9,974,161
- Issue date May 15, 2018
- Intel Corporation
- Timothy D. Wig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common mode noise suppression of switchmode power converters by cap...
- Patent number 9,913,356
- Issue date Mar 6, 2018
- Robert Bosch GmbH
- Cyrous Rostamzadeh
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board
- Patent number 9,894,751
- Issue date Feb 13, 2018
- Canon Kabushiki Kaisha
- Yusuke Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device, printed board and manufact...
- Patent number 9,839,130
- Issue date Dec 5, 2017
- Renesas Electronics Corporation
- Takafumi Betsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflected signal absorption in interconnect
- Patent number 9,814,130
- Issue date Nov 7, 2017
- Intel Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board equipped with a high-frequency component emitting int...
- Patent number 9,801,268
- Issue date Oct 24, 2017
- Endress + Hauser GmbH + Co. KG
- Thomas Blodt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive nanostructure-based films with improved ESD performance
- Patent number 9,763,313
- Issue date Sep 12, 2017
- CAM Holding Corporation
- Florian Pschenitzka
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Concept for extracting a signal being exchanged between a device un...
- Patent number 9,568,498
- Issue date Feb 14, 2017
- Advantest Corporation
- Jose Antonio Alves Moreira
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board
- Patent number 9,515,027
- Issue date Dec 6, 2016
- Canon Kabushiki Kaisha
- Hiroto Tamaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT ARRANGEMENT, PRINTED CIRCUIT BOARD ARRANGEMENT, ELECTRIC DR...
- Publication number 20240074040
- Publication date Feb 29, 2024
- ZF Friedrichshafen AG
- Florian Ullrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM OF SURFACE WAVE MITIGATION FOR MULTIPLE-INPUT-...
- Publication number 20230176178
- Publication date Jun 8, 2023
- Intel Corporation
- Arnaud Lucres Amadjikpe
- G01 - MEASURING TESTING
Information Patent Application
RF ABSORBING STRUCTURES
- Publication number 20230126395
- Publication date Apr 27, 2023
- Pivotal Commware, Inc.
- Jay Howard McCandless
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND CIRCUIT BOARD
- Publication number 20230108158
- Publication date Apr 6, 2023
- HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Rui WANG
- G02 - OPTICS
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20220248575
- Publication date Aug 4, 2022
- Hitachi Astemo, Ltd.
- Masahiro TOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION PATH
- Publication number 20220087013
- Publication date Mar 17, 2022
- Sony Semiconductor Solutions Corporation
- KENJI NONAKA
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE
- Publication number 20210345495
- Publication date Nov 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A SUBSTRATE STRUCTURE AND METHOD FOR CONTROLLING THE SAME
- Publication number 20210161000
- Publication date May 27, 2021
- LG ELECTRONICS INC.
- Jongwon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE
- Publication number 20210100108
- Publication date Apr 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT CHIP AND CONFIGURATION ADJUSTMENT METHOD FOR THE...
- Publication number 20200312809
- Publication date Oct 1, 2020
- Realtek Semiconductor Corp.
- CHUNG-CHANG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIDEBAND CONDUCTOR RESONANCE MITIGATION
- Publication number 20200275549
- Publication date Aug 27, 2020
- Intel Corporation
- Timothy D. Wig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT
- Publication number 20200253039
- Publication date Aug 6, 2020
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
APPARATUS AND SYSTEM OF SURFACE WAVE MITIGATION FOR MULTIPLE-INPUT-...
- Publication number 20200225314
- Publication date Jul 16, 2020
- Arnaud Lucres Amadjikpe
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT
- Publication number 20200022253
- Publication date Jan 16, 2020
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIDEBAND CONDUCTOR RESONANCE MITIGATION
- Publication number 20190021165
- Publication date Jan 17, 2019
- Intel Corporation
- Timothy D. Wig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT
- Publication number 20180263110
- Publication date Sep 13, 2018
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PRINTED BOARD AND MANUFACT...
- Publication number 20180049323
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Takafumi BETSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PRINTED BOARD AND MANUFACT...
- Publication number 20170354038
- Publication date Dec 7, 2017
- RENESAS ELECTRONICS CORPORATION
- Takafumi BETSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC COMPOSITE FILTER
- Publication number 20170077891
- Publication date Mar 16, 2017
- JOINSET CO., LTD.
- Sun-Ki Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20150271914
- Publication date Sep 24, 2015
- Faraday Technology Corp.
- Ying-Jiunn Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR BROADBAND ELECTROMAGNETIC MODE SUPPRESSION...
- Publication number 20150171498
- Publication date Jun 18, 2015
- Wemtec, Inc.
- William E. McKinzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD EQUIPPED WITH A HIGH-FREQUENCY COMPONENT EMITTING INT...
- Publication number 20150156861
- Publication date Jun 4, 2015
- Endress + Hauser GmbH + Co. KG
- Thomas Blodt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE NANOSTRUCTURE-BASED FILMS WITH IMPROVED ESD PERFORMANCE
- Publication number 20140340811
- Publication date Nov 20, 2014
- CAMBRIOS TECHNOLOGIES CORPORATION
- Florian Pschenitzka
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING WIRING BOARD UNIT, METHOD OF MANUFACTURING...
- Publication number 20140312488
- Publication date Oct 23, 2014
- Fujitsu Limited
- Takashi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENTS IN INTERPOSER BOARD FOR IMPROVING POWER GAIN (D...
- Publication number 20140283379
- Publication date Sep 25, 2014
- R&D Circuits, Inc.
- James V. Russell
- G01 - MEASURING TESTING
Information Patent Application
Apparatus for improved power distribution in an electrical componen...
- Publication number 20140268613
- Publication date Sep 18, 2014
- R&D Circuits,Inc.
- James V. Russell
- G01 - MEASURING TESTING
Information Patent Application
DIFFERENTIAL PASSIVE EQUALIZER
- Publication number 20140266516
- Publication date Sep 18, 2014
- Kai Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140247574
- Publication date Sep 4, 2014
- Canon Kabushiki Kaisha
- Hiroto Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concept for Extracting a Signal Being Exchanged Between a Device Un...
- Publication number 20140239994
- Publication date Aug 28, 2014
- Jose Antonio Alves Moreira
- G01 - MEASURING TESTING
Information Patent Application
Shielding Structures Including Frequency Selective Surfaces
- Publication number 20140209373
- Publication date Jul 31, 2014
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Resistors or by disposing resistive or lossy substances in or near power planes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic control device

Display device and circuit board

RF absorbing structures

Wafer level bump stack for chip scale package

Apparatus and system of surface wave mitigation for multiple-input-...

Circuit board and method for manufacturing the same

Apparatus and system of surface wave mitigation for multiple-input-...

Integrated circuit chip and configuration adjustment method for the...

Wafer level bump stack for chip scale package

Sideband conductor resonance mitigation

Printed circuit board and switching power supply

Printed circuit board and switching power supply for electronic app...

Sideband conductor resonance mitigation

Printed circuit board (PCB) with stubs coupled to electromagnetic a...

Sideband conductor resonance mitigation

Defected ground structure with void having resistive material along...

Printed circuit board and switching power supply

Semiconductor device and electronic equipment

Elastic composite filter

Device and method for transmitting differential data signals

Semiconductor integrated circuit device, printed board and manufact...

Sideband conductor resonance mitigation

Common mode noise suppression of switchmode power converters by cap...

Printed circuit board

Semiconductor integrated circuit device, printed board and manufact...

Reflected signal absorption in interconnect

Circuit board equipped with a high-frequency component emitting int...

Conductive nanostructure-based films with improved ESD performance

Concept for extracting a signal being exchanged between a device un...

Printed circuit board

Patents Applicationslast 30 patents

CIRCUIT ARRANGEMENT, PRINTED CIRCUIT BOARD ARRANGEMENT, ELECTRIC DR...

APPARATUS AND SYSTEM OF SURFACE WAVE MITIGATION FOR MULTIPLE-INPUT-...

RF ABSORBING STRUCTURES

DISPLAY DEVICE AND CIRCUIT BOARD

ELECTRONIC CONTROL DEVICE

TRANSMISSION PATH

WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE

A SUBSTRATE STRUCTURE AND METHOD FOR CONTROLLING THE SAME

WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE

INTEGRATED CIRCUIT CHIP AND CONFIGURATION ADJUSTMENT METHOD FOR THE...

SIDEBAND CONDUCTOR RESONANCE MITIGATION

PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT

APPARATUS AND SYSTEM OF SURFACE WAVE MITIGATION FOR MULTIPLE-INPUT-...

PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT

SIDEBAND CONDUCTOR RESONANCE MITIGATION

PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PRINTED BOARD AND MANUFACT...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PRINTED BOARD AND MANUFACT...

ELASTIC COMPOSITE FILTER

INTEGRATED CIRCUIT

APPARATUS AND METHOD FOR BROADBAND ELECTROMAGNETIC MODE SUPPRESSION...

CIRCUIT BOARD EQUIPPED WITH A HIGH-FREQUENCY COMPONENT EMITTING INT...

CONDUCTIVE NANOSTRUCTURE-BASED FILMS WITH IMPROVED ESD PERFORMANCE

METHOD OF MANUFACTURING WIRING BOARD UNIT, METHOD OF MANUFACTURING...

EMBEDDED COMPONENTS IN INTERPOSER BOARD FOR IMPROVING POWER GAIN (D...

Apparatus for improved power distribution in an electrical componen...

DIFFERENTIAL PASSIVE EQUALIZER

PRINTED CIRCUIT BOARD

Concept for Extracting a Signal Being Exchanged Between a Device Un...

Shielding Structures Including Frequency Selective Surfaces