Reversing the PCB

Industry

CPC
H05K2203/1563

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1563Reversing the PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Unit unloading system
- Patent number 11,706,875
- Issue date Jul 18, 2023
- Rokko Systems Pte Ltd.
- Yun Suk Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting stacked circuit boards
- Patent number 11,483,938
- Issue date Oct 25, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic printed circuit board assembly for high-power components
- Patent number 11,272,617
- Issue date Mar 8, 2022
- ZKW GROUP GMBH
- Dietmar Kieslinger
- F21 - LIGHTING
Information Patent Grant
Method for treating millimetre and/or micrometre and/or nanometre s...
- Patent number 11,027,481
- Issue date Jun 8, 2021
- EV Group E. Thallner GmbH
- Gerald Mittendorfer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Inkjet system for printing a printed circuit board
- Patent number 10,123,427
- Issue date Nov 6, 2018
- MUTRACX INTERNATIONAL B.V.
- Henk Jan Zwiers
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of producing electronic components and method of producing s...
- Patent number 9,839,135
- Issue date Dec 5, 2017
- Murata Manufacturing Co., Ltd.
- Kazuto Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electronic components
- Patent number 9,801,283
- Issue date Oct 24, 2017
- Murata Manufacturing Co., Ltd.
- Kazuto Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Inkjet system for printing a printed circuit board
- Patent number 9,769,932
- Issue date Sep 19, 2017
- MUTRACX INTERNATIONAL B.V.
- Henk Jan Zwiers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method
- Patent number 9,730,337
- Issue date Aug 8, 2017
- C. Uyemura & Co., Ltd.
- Toshihisa Isono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inkjet system for printing a printed circuit board
- Patent number 9,363,899
- Issue date Jun 7, 2016
- MUTRACX INTERNATIONAL B.V.
- Henk Jan Zwiers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 9,253,897
- Issue date Feb 2, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 9,204,546
- Issue date Dec 1, 2015
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insolation machine for panels fitted with a panel turner
- Patent number 9,173,334
- Issue date Oct 27, 2015
- ALTIX
- Christophe Cousin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for placing, securing and interconnecting electronic compon...
- Patent number 8,963,341
- Issue date Feb 24, 2015
- Edward Binkley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layout method for electronic components of double-sided surface mou...
- Patent number 8,528,195
- Issue date Sep 10, 2013
- Inventec Corporation
- Chung-Yang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser direct imaging apparatus and imaging method
- Patent number 8,314,825
- Issue date Nov 20, 2012
- Hitachi Via Mechanics, Ltd.
- Yoshitatsu Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic components on printed circuit boards
- Patent number 8,011,561
- Issue date Sep 6, 2011
- Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
- Ji Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for printing an electronic circuit component on a substrate...
- Patent number 7,617,774
- Issue date Nov 17, 2009
- manroland AG
- Thomas Walther
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conveyorized blind microvia laser drilling system
- Patent number 7,062,845
- Issue date Jun 20, 2006
- Laservia Corporation
- Larry W. Burgess
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gravitationally-assisted control of spread of viscous material appl...
- Patent number 6,803,657
- Issue date Oct 12, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for gravitation-assisted control of spread of viscous materi...
- Patent number 6,602,730
- Issue date Aug 5, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting components on a plurality of abutted circuit board
- Patent number 6,547,122
- Issue date Apr 15, 2003
- Acer Incorporated
- Szu-Hsiung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gravitationally assisted control of spread of viscous material appl...
- Patent number 6,492,713
- Issue date Dec 10, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gravitationally-assisted control of spread of viscous material appl...
- Patent number 6,489,681
- Issue date Dec 3, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for contact imaging both sides of a substrate
- Patent number 6,198,525
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Wayne Albert Barringer
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Gravitationally-assisted control of spread of viscous material appl...
- Patent number 6,083,768
- Issue date Jul 4, 2000
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the coating of flat-form substrates especially of pri...
- Patent number 6,063,191
- Issue date May 16, 2000
- Ciba Specialty Chemicals Corp.
- Kaspar Kuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and apparatus for automatically assembling the tops and bot...
- Patent number 5,737,834
- Issue date Apr 14, 1998
- Blaupunkt-Werke GmbH
- Jens Sabotke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing double-sided circuit assemblies
- Patent number 5,678,304
- Issue date Oct 21, 1997
- Eastman Kodak Company
- Jay B. Soper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for automatically populating a top and a bottom side of prin...
- Patent number 5,659,947
- Issue date Aug 26, 1997
- Blaupunkt-Werke GmbH
- Norbert Eilers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Gripping Plurality of Types of Circuit Boards
- Publication number 20240025669
- Publication date Jan 25, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Yong Wang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Electronic Printed Circuit Board Assembly for High-Power Components
- Publication number 20210092846
- Publication date Mar 25, 2021
- ZKW GROUP GMBH
- Dietmar KIESLINGER
- F21 - LIGHTING
Information Patent Application
DOUBLE-SIDED ASSEMBLY ON FLEXIBLE SUBSTRATES
- Publication number 20210076504
- Publication date Mar 11, 2021
- Molex, LLC
- Michael DEPPE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR PCB WASHING
- Publication number 20200170119
- Publication date May 28, 2020
- ROKKO SYSTEMS PTE LTD
- Yun Suk SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINT HEAD MAINTENANCE
- Publication number 20190037704
- Publication date Jan 31, 2019
- MUTRACX INTERNATIONAL B.V.
- Henk Jan ZWIERS
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD
- Publication number 20170347461
- Publication date Nov 30, 2017
- MUTRACX INTERNATIONAL B.V.
- Henk Jan ZWIERS
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD
- Publication number 20140374375
- Publication date Dec 25, 2014
- Henk Jan Zwiers
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PLATING METHOD
- Publication number 20140120245
- Publication date May 1, 2014
- C. Uyemura & Co., Ltd.
- Toshihisa Isono
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD, ELECTRIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT...
- Publication number 20130286607
- Publication date Oct 31, 2013
- Koito Manufacturing Co., Ltd.
- Shinji Teraoka
- F21 - LIGHTING
Information Patent Application
INSOLATION MACHINE FOR PANELS FITTED WITH A PANEL TURNER
- Publication number 20130239406
- Publication date Sep 19, 2013
- ALTIX
- Christophe COUSIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layout Method For Electronic Components Of Double-Sided Surface Mou...
- Publication number 20110173808
- Publication date Jul 21, 2011
- Inventec Corporation
- Chung Yang Wu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS
- Publication number 20110167627
- Publication date Jul 14, 2011
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- JI MA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ETCHING METHOD
- Publication number 20110056910
- Publication date Mar 10, 2011
- Makoto Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE...
- Publication number 20100289132
- Publication date Nov 18, 2010
- Shih-Fu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PLACING, SECURING AND INTERCONNECTING ELECTRONIC COMPON...
- Publication number 20100206462
- Publication date Aug 19, 2010
- Promex Industries, Inc.
- Edward S. Binkley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser Direct Imaging Apparatus and Imaging Method
- Publication number 20090086009
- Publication date Apr 2, 2009
- HITACHI VIA MECHANICS, LTD.
- Yoshitatsu Naito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and electronic component mounting method
- Publication number 20080223609
- Publication date Sep 18, 2008
- Fujitsu Limited
- Keiichi Yamamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Process and an apparatus for coating printed circuit boards with la...
- Publication number 20070141263
- Publication date Jun 21, 2007
- Hans-Jurgen Schaefer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering apparatus for printed circuit board, soldering method for...
- Publication number 20060273138
- Publication date Dec 7, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Seung-hoon Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Automatically labeling and inspecting apparatus and method of use
- Publication number 20060169763
- Publication date Aug 3, 2006
- All Fine Technology Co., LTD.
- Chien Yueh Shiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for printing an electronic circuit component on a substrate...
- Publication number 20050241506
- Publication date Nov 3, 2005
- MAN Roland Druckmaschinen AG
- Thomas Walther
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Conveyorized blind microvia laser drilling system
- Publication number 20040118824
- Publication date Jun 24, 2004
- LASERVIA CORPORATION, an Oregon corporation
- Larry W. Burgess
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING COMPONENTS ON A PLURALITY OF ABUTTED CIRCUIT BOARD
- Publication number 20030075589
- Publication date Apr 24, 2003
- Szu-Hsiung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gravitationally assisted control of spread of viscous material appl...
- Publication number 20020197843
- Publication date Dec 26, 2002
- Tongbi jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAVITATIONALLY-ASSISTED CONTROL OF SPREAD OF VISCOUS MATERIAL APPL...
- Publication number 20020001879
- Publication date Jan 3, 2002
- TONGBI JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gravitationally-assisted control of spread of viscous material appl...
- Publication number 20010017413
- Publication date Aug 30, 2001
- Tongbi jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gravitationally-assisted control of spread of viscous material appl...
- Publication number 20010018234
- Publication date Aug 30, 2001
- Tongbi jiang
- H01 - BASIC ELECTRIC ELEMENTS

Reversing the PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Unit unloading system

Method for connecting stacked circuit boards

Electronic printed circuit board assembly for high-power components

Method for treating millimetre and/or micrometre and/or nanometre s...

Inkjet system for printing a printed circuit board

Method of producing electronic components and method of producing s...

Method of producing electronic components

Inkjet system for printing a printed circuit board

Plating method

Inkjet system for printing a printed circuit board

Wiring substrate and method for manufacturing the same

Circuit board and manufacturing method thereof

Insolation machine for panels fitted with a panel turner

Process for placing, securing and interconnecting electronic compon...

Layout method for electronic components of double-sided surface mou...

Laser direct imaging apparatus and imaging method

Method of mounting electronic components on printed circuit boards

Method for printing an electronic circuit component on a substrate...

Conveyorized blind microvia laser drilling system

Gravitationally-assisted control of spread of viscous material appl...

Method for gravitation-assisted control of spread of viscous materi...

Method of mounting components on a plurality of abutted circuit board

Gravitationally assisted control of spread of viscous material appl...

Gravitationally-assisted control of spread of viscous material appl...

System for contact imaging both sides of a substrate

Gravitationally-assisted control of spread of viscous material appl...

Apparatus for the coating of flat-form substrates especially of pri...

Process and apparatus for automatically assembling the tops and bot...

Method for manufacturing double-sided circuit assemblies

Device for automatically populating a top and a bottom side of prin...

Patents Applicationslast 30 patents

Method and Apparatus for Gripping Plurality of Types of Circuit Boards

Electronic Printed Circuit Board Assembly for High-Power Components

DOUBLE-SIDED ASSEMBLY ON FLEXIBLE SUBSTRATES

METHOD AND APPARATUS FOR PCB WASHING

PRINT HEAD MAINTENANCE

INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD

INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD

PLATING METHOD

CIRCUIT BOARD, ELECTRIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT...

INSOLATION MACHINE FOR PANELS FITTED WITH A PANEL TURNER

Layout Method For Electronic Components Of Double-Sided Surface Mou...

METHOD OF MOUNTING ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS

ETCHING METHOD

SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE...

PROCESS FOR PLACING, SECURING AND INTERCONNECTING ELECTRONIC COMPON...

Laser Direct Imaging Apparatus and Imaging Method

Electronic device and electronic component mounting method

Process and an apparatus for coating printed circuit boards with la...

Soldering apparatus for printed circuit board, soldering method for...

Automatically labeling and inspecting apparatus and method of use

Method for printing an electronic circuit component on a substrate...

Conveyorized blind microvia laser drilling system

METHOD OF MOUNTING COMPONENTS ON A PLURALITY OF ABUTTED CIRCUIT BOARD

Gravitationally assisted control of spread of viscous material appl...

GRAVITATIONALLY-ASSISTED CONTROL OF SPREAD OF VISCOUS MATERIAL APPL...

Gravitationally-assisted control of spread of viscous material appl...

Gravitationally-assisted control of spread of viscous material appl...