Reworking

Industry

CPC
H01L2224/2783

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2783Reworking

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer on wafer bonding structure
- Patent number 11,715,723
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,502,057
- Issue date Nov 15, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,381,324
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,304,803
- Issue date May 28, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laterally extended conductive bump buffer
- Patent number 10,276,530
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,202,519
- Issue date Feb 12, 2019
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules with semiconductor dies bonded to a metal foil
- Patent number 10,192,849
- Issue date Jan 29, 2019
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical nanoribbon array (VERNA) thermal interface materials with...
- Patent number 10,170,338
- Issue date Jan 1, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, its manufacturing method, and display device
- Patent number 10,127,855
- Issue date Nov 13, 2018
- BOE Technology Group Co., Ltd.
- Ming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,066,118
- Issue date Sep 4, 2018
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for performing direct bonding between two structures
- Patent number 9,922,954
- Issue date Mar 20, 2018
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting method
- Patent number 9,793,221
- Issue date Oct 17, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component with a pre-oriented molecule configuration...
- Patent number 9,722,159
- Issue date Aug 1, 2017
- Osram Opto Semiconductors GmbH
- Reinhard Streitel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,673,176
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,666,563
- Issue date May 30, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,431
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230260945
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210257332
- Publication date Aug 19, 2021
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Can Housing a Semiconductor Die w...
- Publication number 20210159204
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20190326253
- Publication date Oct 24, 2019
- International Business Machines Corporation
- ERIC J. CAMPBELL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20190092963
- Publication date Mar 28, 2019
- Sekisui Chemical Co., Ltd
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...
- Publication number 20180342405
- Publication date Nov 29, 2018
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Nanoscale Interconnect Array for Stacked Dies
- Publication number 20170323867
- Publication date Nov 9, 2017
- Invensas Corporatoin
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20170233615
- Publication date Aug 17, 2017
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES
- Publication number 20170179073
- Publication date Jun 22, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hubert MORICEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160240504
- Publication date Aug 18, 2016
- Fuji Electric Co., Ltd.
- Shoji SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connecting Medium on an Assembly Partner, Me...
- Publication number 20160225735
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086925
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140374903
- Publication date Dec 25, 2014
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME RELATED...
- Publication number 20140264474
- Publication date Sep 18, 2014
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140191418
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130280861
- Publication date Oct 24, 2013
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL
- Publication number 20130149841
- Publication date Jun 13, 2013
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING METHOD AND STACKING CARRIER
- Publication number 20130049230
- Publication date Feb 28, 2013
- VICTORY GAIN GROUP CORPORATION
- Jui-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...
- Publication number 20120178218
- Publication date Jul 12, 2012
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures of integrated circuit devices and method forming...

Die on die bonding structure

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Bonding structures of integrated circuit devices and method forming...

Semiconductor device comprising a can housing a semiconductor die w...

Wafer on wafer bonding structure

Thermocompression bond tips and related apparatus and methods

Semiconductor device and manufacturing method thereof

Thermocompression bond tips and related apparatus and methods

Inkjet adhesive, manufacturing method for semiconductor device, and...

Porous Cu on Cu surface for semiconductor packages

Selectively cross-linked thermal interface materials

Power electronics assembly having an adhesion layer, and method for...

Method for producing a connecting medium on an assembly partner, me...

Nanoscale interconnect array for stacked dies

Selectively cross-linked thermal interface materials

Nanoscale interconnect array for stacked dies

Laterally extended conductive bump buffer

Inkjet adhesive, manufacturing method for semiconductor device, and...

Semiconductor modules with semiconductor dies bonded to a metal foil

Vertical nanoribbon array (VERNA) thermal interface materials with...

Method for simultaneously bonding multiple chips of different heigh...

Array substrate, its manufacturing method, and display device

Inkjet adhesive, manufacturing method for semiconductor device, and...

Method for performing direct bonding between two structures

Semiconductor device mounting method

Optoelectronic component with a pre-oriented molecule configuration...

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Patents Applicationslast 30 patents

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

DIE ON DIE BONDING STRUCTURE

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

Bonding Structures of Integrated Circuit Devices and Method Forming...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

Semiconductor Device Comprising a Can Housing a Semiconductor Die w...

Porous Cu on Cu Surface for Semiconductor Packages

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...

Nanoscale Interconnect Array for Stacked Dies

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method for Producing a Connecting Medium on an Assembly Partner, Me...

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

STACKED SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME RELATED...

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL

STACKING METHOD AND STACKING CARRIER

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR TH...