Rhenium [Re] as principal constituent

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H01L2224/05683

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05683Rhenium [Re] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder bumping
- Patent number 10,615,143
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip and power module, and manufacturing method of th...
- Patent number 10,522,638
- Issue date Dec 31, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Masakazu Sagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes for interconnection pads in microelectronic struct...
- Patent number 10,121,752
- Issue date Nov 6, 2018
- Intel Corporation
- Srinivas V. Pietambaram
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Voltage regulator integrated with semiconductor chip
- Patent number 8,749,021
- Issue date Jun 10, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Carbon nanotube circuit component structure
- Patent number 8,692,374
- Issue date Apr 8, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing the same, and meth...
- Patent number 8,586,477
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad or metal bump over pad exposed by passivation layer
- Patent number 8,399,989
- Issue date Mar 19, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube circuit component structure
- Patent number 7,990,037
- Issue date Aug 2, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and systems having at least one dam structure
- Patent number 7,833,894
- Issue date Nov 16, 2010
- Micron Technology, Inc.
- W. Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming through-wafer interconnects, intermediate struc...
- Patent number 7,772,115
- Issue date Aug 10, 2010
- Micron Technology, Inc.
- W. Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190088618
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Kazumichi TSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES FOR INTERCONNECTION PADS IN MICROELECTRONIC STRUCT...
- Publication number 20180019219
- Publication date Jan 18, 2018
- Intel Corporation
- Srinivas V. Pietambaram
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METH...
- Publication number 20120028412
- Publication date Feb 2, 2012
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE
- Publication number 20110266680
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Voltage Regulator Integrated with Semiconductor Chip
- Publication number 20080150623
- Publication date Jun 26, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING THROUGH-WAFER INTERCONNECTS AND DEVICES AND SYS...
- Publication number 20070262424
- Publication date Nov 15, 2007
- Micron Technology, Inc.
- W. Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE
- Publication number 20070164430
- Publication date Jul 19, 2007
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming through-wafer interconnects, intermediate struc...
- Publication number 20070045779
- Publication date Mar 1, 2007
- W. Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER
- Publication number 20070026631
- Publication date Feb 1, 2007
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Rhenium [Re] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding process with inhibited oxide formation

Bonding process with inhibited oxide formation

Bonding process with inhibited oxide formation

Non-destructive testing of integrated circuit chips

Injection molded solder bumping

Semiconductor chip and power module, and manufacturing method of th...

Surface finishes for interconnection pads in microelectronic struct...

Voltage regulator integrated with semiconductor chip

Carbon nanotube circuit component structure

Semiconductor apparatus, method of manufacturing the same, and meth...

Metal pad or metal bump over pad exposed by passivation layer

Carbon nanotube circuit component structure

Devices and systems having at least one dam structure

Methods for forming through-wafer interconnects, intermediate struc...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SURFACE FINISHES FOR INTERCONNECTION PADS IN MICROELECTRONIC STRUCT...

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METH...

CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE

Voltage Regulator Integrated with Semiconductor Chip

METHODS FOR FORMING THROUGH-WAFER INTERCONNECTS AND DEVICES AND SYS...

CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE

Methods for forming through-wafer interconnects, intermediate struc...

METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER