Rhenium [Re] as principal constituent

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CPC
H01L2224/05183

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05183Rhenium [Re] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package
- Patent number 10,600,757
- Issue date Mar 24, 2020
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,269,765
- Issue date Apr 23, 2019
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 7,468,545
- Issue date Dec 23, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20200303202
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20200212007
- Publication date Jul 2, 2020
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20190304796
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...
- Publication number 20090057895
- Publication date Mar 5, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post passivation structure for a semiconductor device and packaging...
- Publication number 20060291029
- Publication date Dec 28, 2006
- MEGIC Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Rhenium [Re] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Dry etch process landing on metal oxide etch stop layer over metal...

Dry etch process landing on metal oxide etch stop layer over metal...

Semiconductor package

Semiconductor package

Power semiconductor devices

Post passivation structure for a semiconductor device and packaging...

Post passivation structure for a semiconductor device and packaging...

Patents Applicationslast 30 patents

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

Semiconductor Package

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

POWER SEMICONDUCTOR DEVICES

POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...

Post passivation structure for a semiconductor device and packaging...

Micromechanical device contact terminals free of particle generation